JPS5314553A - Isolating method of rigid fragile plate - Google Patents
Isolating method of rigid fragile plateInfo
- Publication number
- JPS5314553A JPS5314553A JP8816776A JP8816776A JPS5314553A JP S5314553 A JPS5314553 A JP S5314553A JP 8816776 A JP8816776 A JP 8816776A JP 8816776 A JP8816776 A JP 8816776A JP S5314553 A JPS5314553 A JP S5314553A
- Authority
- JP
- Japan
- Prior art keywords
- fragile plate
- isolating method
- rigid
- rigid fragile
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
PURPOSE: To isolate wafer to pellets by applying vibrations to a rigit fragile plate provided with scribing grooves.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8816776A JPS5314553A (en) | 1976-07-26 | 1976-07-26 | Isolating method of rigid fragile plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8816776A JPS5314553A (en) | 1976-07-26 | 1976-07-26 | Isolating method of rigid fragile plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5314553A true JPS5314553A (en) | 1978-02-09 |
Family
ID=13935350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8816776A Pending JPS5314553A (en) | 1976-07-26 | 1976-07-26 | Isolating method of rigid fragile plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5314553A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0653317A (en) * | 1992-05-27 | 1994-02-25 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | Method for cutting of semiconductor material, especially small piece not contaminated with silicon |
JP2013102211A (en) * | 2013-01-29 | 2013-05-23 | Agere Systems Inc | Method for separating semiconductor wafer into semiconductor dies by using injected impurities |
-
1976
- 1976-07-26 JP JP8816776A patent/JPS5314553A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0653317A (en) * | 1992-05-27 | 1994-02-25 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | Method for cutting of semiconductor material, especially small piece not contaminated with silicon |
JP2013102211A (en) * | 2013-01-29 | 2013-05-23 | Agere Systems Inc | Method for separating semiconductor wafer into semiconductor dies by using injected impurities |
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