JPS5237781A - Process for production of semiconductor device - Google Patents
Process for production of semiconductor deviceInfo
- Publication number
- JPS5237781A JPS5237781A JP11410675A JP11410675A JPS5237781A JP S5237781 A JPS5237781 A JP S5237781A JP 11410675 A JP11410675 A JP 11410675A JP 11410675 A JP11410675 A JP 11410675A JP S5237781 A JPS5237781 A JP S5237781A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- production
- insulation separating
- regions
- separated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Element Separation (AREA)
Abstract
PURPOSE: A process for production of a semiconductor device which can reduce the insulation separating distance among island regions in a semiconductor device of SOS construction, and makes possible the high integration by forming each region insulated and separated from insulation separating regions at high yield.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11410675A JPS5237781A (en) | 1975-09-19 | 1975-09-19 | Process for production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11410675A JPS5237781A (en) | 1975-09-19 | 1975-09-19 | Process for production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5237781A true JPS5237781A (en) | 1977-03-23 |
Family
ID=14629260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11410675A Pending JPS5237781A (en) | 1975-09-19 | 1975-09-19 | Process for production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5237781A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58193505A (en) * | 1982-05-07 | 1983-11-11 | Furukawa Electric Co Ltd:The | Arraying method of optical fiber |
US4760036A (en) * | 1987-06-15 | 1988-07-26 | Delco Electronics Corporation | Process for growing silicon-on-insulator wafers using lateral epitaxial growth with seed window oxidation |
-
1975
- 1975-09-19 JP JP11410675A patent/JPS5237781A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58193505A (en) * | 1982-05-07 | 1983-11-11 | Furukawa Electric Co Ltd:The | Arraying method of optical fiber |
US4760036A (en) * | 1987-06-15 | 1988-07-26 | Delco Electronics Corporation | Process for growing silicon-on-insulator wafers using lateral epitaxial growth with seed window oxidation |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5224478A (en) | Semiconductor device manufacturing process | |
JPS5237781A (en) | Process for production of semiconductor device | |
JPS5211525A (en) | Method of manufacturing headrests | |
JPS5276889A (en) | Production of semiconductor device | |
JPS5279654A (en) | Production of semiconductor device | |
JPS53144670A (en) | Production of semiconductor device | |
JPS5329086A (en) | Production of semiconductor device | |
JPS525700A (en) | The process for production of silicon nitride | |
JPS51146194A (en) | Diode device fabrication method | |
JPS5282083A (en) | Production of semiconductor device | |
JPS5223272A (en) | Method of manufacturing glass passivation semiconductor device | |
JPS5248469A (en) | Process for production of semiconductor device | |
JPS52155982A (en) | Semiconductor device | |
JPS5212586A (en) | Production method of semiconductor integrated circuit | |
JPS51112292A (en) | Semiconductor device | |
JPS51138166A (en) | Production method of semiconductor device | |
JPS5253675A (en) | Production of semiconductor device | |
JPS51117878A (en) | Manufacturing method of semiconductor device | |
JPS5278384A (en) | Production of semiconductor integrated circuit device | |
JPS5432968A (en) | Manufacture of semiconductor device | |
JPS5276872A (en) | Cutting method of semiconductor wafer | |
JPS51140579A (en) | Method of producing thyristor | |
JPS51123064A (en) | Forming process of bonding-pad area | |
JPS5231668A (en) | Production method of semiconductor device which possesses bamp electro de on upper surface of all distribution | |
JPS51114862A (en) | Semiconductor wafer separation method |