JPS5223272A - Method of manufacturing glass passivation semiconductor device - Google Patents

Method of manufacturing glass passivation semiconductor device

Info

Publication number
JPS5223272A
JPS5223272A JP9862775A JP9862775A JPS5223272A JP S5223272 A JPS5223272 A JP S5223272A JP 9862775 A JP9862775 A JP 9862775A JP 9862775 A JP9862775 A JP 9862775A JP S5223272 A JPS5223272 A JP S5223272A
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacturing glass
glass passivation
passivation semiconductor
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9862775A
Other languages
Japanese (ja)
Inventor
Masaaki Takahashi
Yoichi Nakajima
Hideyuki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9862775A priority Critical patent/JPS5223272A/en
Publication of JPS5223272A publication Critical patent/JPS5223272A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE: To manufacture a glass passivation semiconductor device of high yield and dielectric strength by efficiently and sufficiently piling glass.
COPYRIGHT: (C)1977,JPO&Japio
JP9862775A 1975-08-15 1975-08-15 Method of manufacturing glass passivation semiconductor device Pending JPS5223272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9862775A JPS5223272A (en) 1975-08-15 1975-08-15 Method of manufacturing glass passivation semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9862775A JPS5223272A (en) 1975-08-15 1975-08-15 Method of manufacturing glass passivation semiconductor device

Publications (1)

Publication Number Publication Date
JPS5223272A true JPS5223272A (en) 1977-02-22

Family

ID=14224752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9862775A Pending JPS5223272A (en) 1975-08-15 1975-08-15 Method of manufacturing glass passivation semiconductor device

Country Status (1)

Country Link
JP (1) JPS5223272A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53105976A (en) * 1977-02-26 1978-09-14 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS54978A (en) * 1977-06-06 1979-01-06 Hitachi Ltd Semiconductor device of glass seal type
JPS5490969A (en) * 1977-12-28 1979-07-19 Hitachi Ltd Glass attaching method to semiconductor groove

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53105976A (en) * 1977-02-26 1978-09-14 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS593849B2 (en) * 1977-02-26 1984-01-26 日本電気ホームエレクトロニクス株式会社 Manufacturing method of semiconductor device
JPS54978A (en) * 1977-06-06 1979-01-06 Hitachi Ltd Semiconductor device of glass seal type
JPS5639056B2 (en) * 1977-06-06 1981-09-10
JPS5490969A (en) * 1977-12-28 1979-07-19 Hitachi Ltd Glass attaching method to semiconductor groove
JPS5733850B2 (en) * 1977-12-28 1982-07-20

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