JPS5260566A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5260566A JPS5260566A JP13698075A JP13698075A JPS5260566A JP S5260566 A JPS5260566 A JP S5260566A JP 13698075 A JP13698075 A JP 13698075A JP 13698075 A JP13698075 A JP 13698075A JP S5260566 A JPS5260566 A JP S5260566A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- wafer
- scribing
- disappear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To improve workability by beforehand heating a flexible conductor plate to shrink and attaching a semiconductor wafer after allowing the stress during winding to disappear, then scribing the wafer into pellets.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13698075A JPS5260566A (en) | 1975-11-13 | 1975-11-13 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13698075A JPS5260566A (en) | 1975-11-13 | 1975-11-13 | Production of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5260566A true JPS5260566A (en) | 1977-05-19 |
JPS5549420B2 JPS5549420B2 (en) | 1980-12-11 |
Family
ID=15187947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13698075A Granted JPS5260566A (en) | 1975-11-13 | 1975-11-13 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5260566A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58147129A (en) * | 1982-02-26 | 1983-09-01 | Nitto Electric Ind Co Ltd | Fixing method for semiconductor wafer |
JPS6181652A (en) * | 1984-09-28 | 1986-04-25 | Shin Etsu Polymer Co Ltd | Dicing film |
-
1975
- 1975-11-13 JP JP13698075A patent/JPS5260566A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58147129A (en) * | 1982-02-26 | 1983-09-01 | Nitto Electric Ind Co Ltd | Fixing method for semiconductor wafer |
JPS6181652A (en) * | 1984-09-28 | 1986-04-25 | Shin Etsu Polymer Co Ltd | Dicing film |
Also Published As
Publication number | Publication date |
---|---|
JPS5549420B2 (en) | 1980-12-11 |
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