JPS52151561A - Polishing method of semiconductor wafers - Google Patents

Polishing method of semiconductor wafers

Info

Publication number
JPS52151561A
JPS52151561A JP6918676A JP6918676A JPS52151561A JP S52151561 A JPS52151561 A JP S52151561A JP 6918676 A JP6918676 A JP 6918676A JP 6918676 A JP6918676 A JP 6918676A JP S52151561 A JPS52151561 A JP S52151561A
Authority
JP
Japan
Prior art keywords
semiconductor wafers
polishing method
polishing
damaging
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6918676A
Other languages
Japanese (ja)
Other versions
JPS5953698B2 (en
Inventor
Kazuhisa Murata
Hiroshi Hayashi
Takeshi Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP6918676A priority Critical patent/JPS5953698B2/en
Publication of JPS52151561A publication Critical patent/JPS52151561A/en
Publication of JPS5953698B2 publication Critical patent/JPS5953698B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To obtain a method of polishing semiconductor wafers without damaging their surfaces by covering the polishing surface with sealing wax then polishing the surface.
COPYRIGHT: (C)1977,JPO&Japio
JP6918676A 1976-06-11 1976-06-11 Polishing method for semiconductor wafers Expired JPS5953698B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6918676A JPS5953698B2 (en) 1976-06-11 1976-06-11 Polishing method for semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6918676A JPS5953698B2 (en) 1976-06-11 1976-06-11 Polishing method for semiconductor wafers

Publications (2)

Publication Number Publication Date
JPS52151561A true JPS52151561A (en) 1977-12-16
JPS5953698B2 JPS5953698B2 (en) 1984-12-26

Family

ID=13395431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6918676A Expired JPS5953698B2 (en) 1976-06-11 1976-06-11 Polishing method for semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS5953698B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109648466A (en) * 2018-12-28 2019-04-19 深圳市芯思杰智慧传感技术有限公司 A kind of chip sealing wax device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109648466A (en) * 2018-12-28 2019-04-19 深圳市芯思杰智慧传感技术有限公司 A kind of chip sealing wax device
CN109648466B (en) * 2018-12-28 2023-10-10 芯思杰技术(深圳)股份有限公司 Chip wax sealing device

Also Published As

Publication number Publication date
JPS5953698B2 (en) 1984-12-26

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