JPS54133877A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54133877A
JPS54133877A JP4167578A JP4167578A JPS54133877A JP S54133877 A JPS54133877 A JP S54133877A JP 4167578 A JP4167578 A JP 4167578A JP 4167578 A JP4167578 A JP 4167578A JP S54133877 A JPS54133877 A JP S54133877A
Authority
JP
Japan
Prior art keywords
electrode
lead
bump
terminal
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4167578A
Other languages
Japanese (ja)
Inventor
Susumu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4167578A priority Critical patent/JPS54133877A/en
Publication of JPS54133877A publication Critical patent/JPS54133877A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce the size of a chip remarkably, and also to increase connection strength between an electrode terminal and a lead wire, by providing the region of the electrode terminal onto an activation region too.
CONSTITUTION: Activation region 11 is formed on semiconductor substrate 10 and its circumferential part is used as electrode-terminal region 12, thereby forming bump 13 while intruding into activation region 11. The structure of wiring lead 15 fixed to this bump 13 is mentioned hereafter. Namely, polyimide film 16 is stuck to the reverse surface of lead 15, and insulation coating of organic resin 17 is adhered to its top surface; and an opening is made in film 17 at a part touching bump 13 and electrode-terminal connection part 14 at the tip is exposed. Consequently, lead 15 can be connected to bump 13 positioned at the center part of the semiconductor device, and the width of lead 15 extending from electrode- terminal connection part 14 can be made small, so that the chip size can be reduced.
COPYRIGHT: (C)1979,JPO&Japio
JP4167578A 1978-04-07 1978-04-07 Semiconductor device Pending JPS54133877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4167578A JPS54133877A (en) 1978-04-07 1978-04-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4167578A JPS54133877A (en) 1978-04-07 1978-04-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54133877A true JPS54133877A (en) 1979-10-17

Family

ID=12614979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4167578A Pending JPS54133877A (en) 1978-04-07 1978-04-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54133877A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276235A (en) * 1987-05-08 1988-11-14 Nec Corp Semiconductor integrated circuit device
JPH0195539A (en) * 1987-10-07 1989-04-13 Toshiba Corp Semiconductor device
JPH01253246A (en) * 1988-03-31 1989-10-09 Toshiba Corp Semiconductor integrated circuit mounting substrate, manufacture thereof and semiconductor integrated circuit device
JP2002289651A (en) * 2000-12-12 2002-10-04 Mitsui Mining & Smelting Co Ltd Chip-on film base and its manufacturing method
JP2005117036A (en) * 2003-10-04 2005-04-28 Samsung Electronics Co Ltd Tape circuit board and semiconductor chip package utilizing same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276235A (en) * 1987-05-08 1988-11-14 Nec Corp Semiconductor integrated circuit device
JPH0195539A (en) * 1987-10-07 1989-04-13 Toshiba Corp Semiconductor device
JPH01253246A (en) * 1988-03-31 1989-10-09 Toshiba Corp Semiconductor integrated circuit mounting substrate, manufacture thereof and semiconductor integrated circuit device
JP2002289651A (en) * 2000-12-12 2002-10-04 Mitsui Mining & Smelting Co Ltd Chip-on film base and its manufacturing method
JP2005117036A (en) * 2003-10-04 2005-04-28 Samsung Electronics Co Ltd Tape circuit board and semiconductor chip package utilizing same

Similar Documents

Publication Publication Date Title
JPS54133877A (en) Semiconductor device
JPS54133878A (en) Semiconductor device
JPS52143785A (en) Semiconductor device
JPS551153A (en) Semiconductor fitting device
JPS52154358A (en) Production of semiconductor device
JPS5588346A (en) Packaging method for semiconductor element
JPS522282A (en) Semiconductor device
JPS5740943A (en) Semiconductror device
JPS53141575A (en) Semiconductor device
JPS5326585A (en) Production of mis semiconductor device
JPS56105670A (en) Semiconductor device
JPS5377172A (en) Production of semiconductor device
JPS5362471A (en) Semiconductor device
JPS54114976A (en) Semiconductor device
JPS5275979A (en) Semiconductor device
JPS5283166A (en) Semiconductor device and its production
JPS5544734A (en) Semiconductor device
JPS5397367A (en) Semiconductor device and its manufacture
JPS546775A (en) Semiconductor device featuring stepped electrode structure
JPS5414159A (en) Manufacture for semiconductor device
JPS5333061A (en) Packaging method of semiconductor integrated circuits
JPS5552242A (en) Semiconductor device
JPS5365060A (en) Bump type semiconductor device
JPS54157080A (en) Semiconductor device
JPS538058A (en) Production of semiconductor device