JPS538058A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS538058A
JPS538058A JP8231176A JP8231176A JPS538058A JP S538058 A JPS538058 A JP S538058A JP 8231176 A JP8231176 A JP 8231176A JP 8231176 A JP8231176 A JP 8231176A JP S538058 A JPS538058 A JP S538058A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
pads
alloying
junctions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8231176A
Other languages
Japanese (ja)
Inventor
Shigeharu Abe
Makoto Serigano
Toshihiko Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8231176A priority Critical patent/JPS538058A/en
Publication of JPS538058A publication Critical patent/JPS538058A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To prevent the phenomena by which pads draws up the Si of electrode contact part and breaks down PN junctions and improve the density of integration by providing a Si layer on the bonding pads of Al formed on a Si substrate and alloying them thereafter.
COPYRIGHT: (C)1978,JPO&Japio
JP8231176A 1976-07-10 1976-07-10 Production of semiconductor device Pending JPS538058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8231176A JPS538058A (en) 1976-07-10 1976-07-10 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8231176A JPS538058A (en) 1976-07-10 1976-07-10 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS538058A true JPS538058A (en) 1978-01-25

Family

ID=13771006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8231176A Pending JPS538058A (en) 1976-07-10 1976-07-10 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS538058A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007190485A (en) * 2006-01-19 2007-08-02 Matsushita Electric Ind Co Ltd Wastewater treatment apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007190485A (en) * 2006-01-19 2007-08-02 Matsushita Electric Ind Co Ltd Wastewater treatment apparatus

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