JPS538058A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS538058A JPS538058A JP8231176A JP8231176A JPS538058A JP S538058 A JPS538058 A JP S538058A JP 8231176 A JP8231176 A JP 8231176A JP 8231176 A JP8231176 A JP 8231176A JP S538058 A JPS538058 A JP S538058A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- pads
- alloying
- junctions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE: To prevent the phenomena by which pads draws up the Si of electrode contact part and breaks down PN junctions and improve the density of integration by providing a Si layer on the bonding pads of Al formed on a Si substrate and alloying them thereafter.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8231176A JPS538058A (en) | 1976-07-10 | 1976-07-10 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8231176A JPS538058A (en) | 1976-07-10 | 1976-07-10 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS538058A true JPS538058A (en) | 1978-01-25 |
Family
ID=13771006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8231176A Pending JPS538058A (en) | 1976-07-10 | 1976-07-10 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS538058A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007190485A (en) * | 2006-01-19 | 2007-08-02 | Matsushita Electric Ind Co Ltd | Wastewater treatment apparatus |
-
1976
- 1976-07-10 JP JP8231176A patent/JPS538058A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007190485A (en) * | 2006-01-19 | 2007-08-02 | Matsushita Electric Ind Co Ltd | Wastewater treatment apparatus |
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