JPS53116073A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS53116073A
JPS53116073A JP3044177A JP3044177A JPS53116073A JP S53116073 A JPS53116073 A JP S53116073A JP 3044177 A JP3044177 A JP 3044177A JP 3044177 A JP3044177 A JP 3044177A JP S53116073 A JPS53116073 A JP S53116073A
Authority
JP
Japan
Prior art keywords
semiconductor device
electrode layer
contactness
good
superimposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3044177A
Other languages
Japanese (ja)
Other versions
JPS6011810B2 (en
Inventor
Osamu Abe
Toshiaki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP52030441A priority Critical patent/JPS6011810B2/en
Publication of JPS53116073A publication Critical patent/JPS53116073A/en
Publication of JPS6011810B2 publication Critical patent/JPS6011810B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Abstract

PURPOSE: To obtain the composite electrode having a good contactness, by providing the second electrode layer having a good contactness through crossing over and superimposing on the ohmic electrode layer placed a part of the substrate surface.
COPYRIGHT: (C)1978,JPO&Japio
JP52030441A 1977-03-22 1977-03-22 semiconductor equipment Expired JPS6011810B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52030441A JPS6011810B2 (en) 1977-03-22 1977-03-22 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52030441A JPS6011810B2 (en) 1977-03-22 1977-03-22 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS53116073A true JPS53116073A (en) 1978-10-11
JPS6011810B2 JPS6011810B2 (en) 1985-03-28

Family

ID=12304010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52030441A Expired JPS6011810B2 (en) 1977-03-22 1977-03-22 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6011810B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922375A (en) * 1982-07-28 1984-02-04 Matsushita Electric Ind Co Ltd Light-emitting semiconductor device
JP2004221112A (en) * 2003-01-09 2004-08-05 Sharp Corp Oxide semiconductor light emitting element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922375A (en) * 1982-07-28 1984-02-04 Matsushita Electric Ind Co Ltd Light-emitting semiconductor device
JP2004221112A (en) * 2003-01-09 2004-08-05 Sharp Corp Oxide semiconductor light emitting element

Also Published As

Publication number Publication date
JPS6011810B2 (en) 1985-03-28

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