JPS5417669A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5417669A
JPS5417669A JP8240677A JP8240677A JPS5417669A JP S5417669 A JPS5417669 A JP S5417669A JP 8240677 A JP8240677 A JP 8240677A JP 8240677 A JP8240677 A JP 8240677A JP S5417669 A JPS5417669 A JP S5417669A
Authority
JP
Japan
Prior art keywords
semiconductor device
mimiaturize
curvature
fixing
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8240677A
Other languages
Japanese (ja)
Inventor
Kiyohiko Mihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8240677A priority Critical patent/JPS5417669A/en
Publication of JPS5417669A publication Critical patent/JPS5417669A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Abstract

PURPOSE: To mimiaturize a semiconductor device without any curvature, and to improve its characteristics, by forming ohmic layers of Al-Ni-Au on both top and reverse surfaces of the semiconductor substrate and by fixing Cu electrode plates to both the surface using a soft brazing material.
COPYRIGHT: (C)1979,JPO&Japio
JP8240677A 1977-07-08 1977-07-08 Semiconductor device Pending JPS5417669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8240677A JPS5417669A (en) 1977-07-08 1977-07-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8240677A JPS5417669A (en) 1977-07-08 1977-07-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5417669A true JPS5417669A (en) 1979-02-09

Family

ID=13773702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8240677A Pending JPS5417669A (en) 1977-07-08 1977-07-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5417669A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264765A (en) * 1995-03-27 1996-10-11 Hitachi Ltd Power chip carrier and power semiconductor device using the same
JP2010172655A (en) * 2009-02-02 2010-08-12 Mitsubishi Electric Corp Vacuum cleaner suction gear and vacuum cleaner

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264765A (en) * 1995-03-27 1996-10-11 Hitachi Ltd Power chip carrier and power semiconductor device using the same
JP2010172655A (en) * 2009-02-02 2010-08-12 Mitsubishi Electric Corp Vacuum cleaner suction gear and vacuum cleaner

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