JPS551153A - Semiconductor fitting device - Google Patents

Semiconductor fitting device

Info

Publication number
JPS551153A
JPS551153A JP7447078A JP7447078A JPS551153A JP S551153 A JPS551153 A JP S551153A JP 7447078 A JP7447078 A JP 7447078A JP 7447078 A JP7447078 A JP 7447078A JP S551153 A JPS551153 A JP S551153A
Authority
JP
Japan
Prior art keywords
lead wire
tip
substrate
semiconductor
cutaway portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7447078A
Other languages
Japanese (ja)
Inventor
Yukio Aoki
Eizo Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7447078A priority Critical patent/JPS551153A/en
Publication of JPS551153A publication Critical patent/JPS551153A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Abstract

PURPOSE: To provide a semiconductor fitting device wherein cutaway portions are formed at the lead wire of an insulation substrate on which an outgoing lead wire, and the lead wire and a conductor layer formed on a printed circuit plate are soldered, thereby remarkably facilitating the fitting of the semiconductor device.
CONSTITUTION: The central part of the surface of a heat resisting insulation substrate 1 is used in a region to which a semiconductor tip 3 is fixed, and an outgoing lead wire 2 connected to the electrode provided on the tip 3 by use of a bonding wire 4 is fitted radially on the substrate 1. In this organization, cutaway portions 9 are formed at parts of the substrate 1 at the lower side of the projected lead wire 2, and a printed circuit plate 7 having conductor layers 5 and a through- hole 10 in which the tip 3 is fitted is placed on the substrate 1. Then, the lead wire 2 and the conductor layers 5 are bonded together, and the tip 3 projected in the through-hole 10 is molded by a resin 8. According to this arrangement, the lead wire 2 and the conductor layer 5 can be soldered through the cutaway portions 9, as a result of which the operation is facilitated and the thickness of the full part of the device is further thinned.
COPYRIGHT: (C)1980,JPO&Japio
JP7447078A 1978-06-19 1978-06-19 Semiconductor fitting device Pending JPS551153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7447078A JPS551153A (en) 1978-06-19 1978-06-19 Semiconductor fitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7447078A JPS551153A (en) 1978-06-19 1978-06-19 Semiconductor fitting device

Publications (1)

Publication Number Publication Date
JPS551153A true JPS551153A (en) 1980-01-07

Family

ID=13548165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7447078A Pending JPS551153A (en) 1978-06-19 1978-06-19 Semiconductor fitting device

Country Status (1)

Country Link
JP (1) JPS551153A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5824181A (en) * 1981-08-06 1983-02-14 旭硝子株式会社 Display body
JPS6463495A (en) * 1987-09-03 1989-03-09 Kawasaki Heavy Ind Ltd Moving body and fluid driving method
US5087961A (en) * 1987-01-28 1992-02-11 Lsi Logic Corporation Semiconductor device package
JPH0520353U (en) * 1991-08-19 1993-03-12 日新電機株式会社 Electronic cooling element connection device
US5877544A (en) * 1995-08-23 1999-03-02 Schlumberger Industries Electronic micropackage for an electronic memory card

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5824181A (en) * 1981-08-06 1983-02-14 旭硝子株式会社 Display body
US5087961A (en) * 1987-01-28 1992-02-11 Lsi Logic Corporation Semiconductor device package
JPS6463495A (en) * 1987-09-03 1989-03-09 Kawasaki Heavy Ind Ltd Moving body and fluid driving method
JPH0520353U (en) * 1991-08-19 1993-03-12 日新電機株式会社 Electronic cooling element connection device
US5877544A (en) * 1995-08-23 1999-03-02 Schlumberger Industries Electronic micropackage for an electronic memory card

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