JPS5732655A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5732655A
JPS5732655A JP10866580A JP10866580A JPS5732655A JP S5732655 A JPS5732655 A JP S5732655A JP 10866580 A JP10866580 A JP 10866580A JP 10866580 A JP10866580 A JP 10866580A JP S5732655 A JPS5732655 A JP S5732655A
Authority
JP
Japan
Prior art keywords
opening
layer
wiring layer
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10866580A
Other languages
Japanese (ja)
Other versions
JPS6148779B2 (en
Inventor
Kunio Kokubu
Makio Beppu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10866580A priority Critical patent/JPS5732655A/en
Publication of JPS5732655A publication Critical patent/JPS5732655A/en
Publication of JPS6148779B2 publication Critical patent/JPS6148779B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To increase the density of integration by forming an opening in which one side end section of a wiring layer of a lower layer of multilayer wiring shaped on the semiconductor integrated circuit is exposed and electrically connecting the side end section to an upper layer through the opening. CONSTITUTION:The lower layer wiring layer 13 is formed on a semiconductor substrate, and coated with an insulating film, the opening 14 for contact in which one side end section of the lower layer wiring layer is exposed is shaped, and an upper layer wiring layer 15 is molded so as to be electrically connected through the opening 14. Accordingly, the multilayer wiring, density thereof is increased to a high degree, can be formed without lowering yield because the wiring layer of a section where the opening for contact is shaped need not be thickened.
JP10866580A 1980-08-07 1980-08-07 Semiconductor integrated circuit device Granted JPS5732655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10866580A JPS5732655A (en) 1980-08-07 1980-08-07 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10866580A JPS5732655A (en) 1980-08-07 1980-08-07 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS5732655A true JPS5732655A (en) 1982-02-22
JPS6148779B2 JPS6148779B2 (en) 1986-10-25

Family

ID=14490567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10866580A Granted JPS5732655A (en) 1980-08-07 1980-08-07 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5732655A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147880U (en) * 1987-12-23 1989-10-12
JPH0741512Y2 (en) * 1989-02-22 1995-09-27 太陽電子株式会社 Nail holder of automatic nail adjuster for ball game machine
JPH0779861B2 (en) * 1989-11-10 1995-08-30 太陽電子株式会社 Nail holder of automatic nail adjuster for ball game machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5386589A (en) * 1977-01-11 1978-07-31 Toshiba Corp Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5386589A (en) * 1977-01-11 1978-07-31 Toshiba Corp Production of semiconductor device

Also Published As

Publication number Publication date
JPS6148779B2 (en) 1986-10-25

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