JPS57201050A - Multilayer wiring structure - Google Patents

Multilayer wiring structure

Info

Publication number
JPS57201050A
JPS57201050A JP8653281A JP8653281A JPS57201050A JP S57201050 A JPS57201050 A JP S57201050A JP 8653281 A JP8653281 A JP 8653281A JP 8653281 A JP8653281 A JP 8653281A JP S57201050 A JPS57201050 A JP S57201050A
Authority
JP
Japan
Prior art keywords
layer
layers
wiring
multilayer wiring
wiring structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8653281A
Other languages
Japanese (ja)
Inventor
Seiichi Iwamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP8653281A priority Critical patent/JPS57201050A/en
Publication of JPS57201050A publication Critical patent/JPS57201050A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To reduce the steps of opening contacting holes and to perform high integration of a multilayer wiring structure by connecting an electrode to be connected with a wire at the side face of a wiring layer interposed between insulating layers through a contacting hole. CONSTITUTION:A diffused layer 12 to become the first wiring layer is formed on a silicon substrate 11. The first and second insulating layers 13, 15 and second and third wiring layers 14, 16 are formed on the substrate 11. The layers 12, 14, 16 are connected via wire through a contacting hole in such a manner that the layer 16 is connected to the side face of the layer 14 and to the layer 12, thereby connecting mutually each other.
JP8653281A 1981-06-05 1981-06-05 Multilayer wiring structure Pending JPS57201050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8653281A JPS57201050A (en) 1981-06-05 1981-06-05 Multilayer wiring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8653281A JPS57201050A (en) 1981-06-05 1981-06-05 Multilayer wiring structure

Publications (1)

Publication Number Publication Date
JPS57201050A true JPS57201050A (en) 1982-12-09

Family

ID=13889601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8653281A Pending JPS57201050A (en) 1981-06-05 1981-06-05 Multilayer wiring structure

Country Status (1)

Country Link
JP (1) JPS57201050A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01313959A (en) * 1988-06-13 1989-12-19 Nec Corp Semiconductor device
JP2007209185A (en) * 2006-02-06 2007-08-16 Toshiba Tec Corp Motor installation structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120783A (en) * 1974-03-04 1975-09-22
JPS52141591A (en) * 1976-05-20 1977-11-25 Matsushita Electric Ind Co Ltd Process of semiconductor device
JPS5397789A (en) * 1977-02-07 1978-08-26 Nec Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120783A (en) * 1974-03-04 1975-09-22
JPS52141591A (en) * 1976-05-20 1977-11-25 Matsushita Electric Ind Co Ltd Process of semiconductor device
JPS5397789A (en) * 1977-02-07 1978-08-26 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01313959A (en) * 1988-06-13 1989-12-19 Nec Corp Semiconductor device
JP2007209185A (en) * 2006-02-06 2007-08-16 Toshiba Tec Corp Motor installation structure

Similar Documents

Publication Publication Date Title
JPS6450443A (en) Semiconductor device
IE831744L (en) S/c using connection structure
JPS57201050A (en) Multilayer wiring structure
JPS6417446A (en) Semiconductor device and manufacture thereof
JPS5567158A (en) Inductor device of hybrid integrated circuit
JPS6428844A (en) Superconducting wiring
JPS5615052A (en) Semiconductor device with multilayer wiring
JPS57132341A (en) Multilayer wiring structure in semiconductor device
JPS6419759A (en) Semiconductor integrated circuit
JPS5732655A (en) Semiconductor integrated circuit device
JPS57181141A (en) Semiconductor device
JPS6448437A (en) Electrode structure
JPS5797649A (en) Manufacture of semiconductor device
JPS55130145A (en) Semiconductor integrated circuit device
JPS6481250A (en) Semiconductor memory device having multilayer metal wiring structure
JPS6066465A (en) Semiconductor device
JPS5789239A (en) Semiconductor integrated circuit
JPS59208856A (en) Multilayer interconnection
JPS5730390A (en) Josephson junction element
JPS56118378A (en) Semiconductor device
JPS6450444A (en) Manufacture of semiconductor device
JPS57181142A (en) Manufacture of semiconductor device
JPS5749254A (en) Semiconductor device
JPS644056A (en) Semiconductor device
JPS6037747A (en) Multilayer interconnection