JPS6448437A - Electrode structure - Google Patents
Electrode structureInfo
- Publication number
- JPS6448437A JPS6448437A JP20550587A JP20550587A JPS6448437A JP S6448437 A JPS6448437 A JP S6448437A JP 20550587 A JP20550587 A JP 20550587A JP 20550587 A JP20550587 A JP 20550587A JP S6448437 A JPS6448437 A JP S6448437A
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- externally attached
- attached part
- semiconductor element
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Abstract
PURPOSE:To connect an externally attached part to a conductor layer with excellent reliability by forming a resin layer between region, to which the externally attached part such as a semiconductor element is connected, in the conductor layer on a glass substrate and the glass substrate. CONSTITUTION:A resin layer 31 is shaped between a region, to which at least an externally attached part 25 is connected, in conductor layers 21a, 21b and a glass substrate 11. Consequently, when the externally attached part 25 such as a semiconductor element is connected to the conductor layers 21a, 21b on the glass substrate 11 by using solder, stress generated by the difference of, the mutual thermal expansion coefficients of the semiconductor element 25, etc., and the glass substrate 11 is absorbed by the resin layer 31 formed between both conductor layers. Accordingly, an effect on the glass substrate 11 of the stress can be reduced, thus connecting the externally attached part to the conductor layer with excellent reliability.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20550587A JPS6448437A (en) | 1987-08-19 | 1987-08-19 | Electrode structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20550587A JPS6448437A (en) | 1987-08-19 | 1987-08-19 | Electrode structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6448437A true JPS6448437A (en) | 1989-02-22 |
Family
ID=16507973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20550587A Pending JPS6448437A (en) | 1987-08-19 | 1987-08-19 | Electrode structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6448437A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209793A (en) * | 1989-10-18 | 1991-09-12 | Nippondenso Co Ltd | Solder connecting structure for glass board |
EP0818946A2 (en) * | 1996-07-09 | 1998-01-14 | Sharp Kabushiki Kaisha | A printed-wiring board and a production method thereof |
JP2007013017A (en) * | 2005-07-04 | 2007-01-18 | Sony Corp | Electronic device and its manufacturing method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5216978A (en) * | 1975-07-30 | 1977-02-08 | Matsushita Electric Ind Co Ltd | Semiconductor |
-
1987
- 1987-08-19 JP JP20550587A patent/JPS6448437A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5216978A (en) * | 1975-07-30 | 1977-02-08 | Matsushita Electric Ind Co Ltd | Semiconductor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209793A (en) * | 1989-10-18 | 1991-09-12 | Nippondenso Co Ltd | Solder connecting structure for glass board |
EP0818946A2 (en) * | 1996-07-09 | 1998-01-14 | Sharp Kabushiki Kaisha | A printed-wiring board and a production method thereof |
EP0818946A3 (en) * | 1996-07-09 | 1999-11-03 | Sharp Kabushiki Kaisha | A printed-wiring board and a production method thereof |
KR100272053B1 (en) * | 1996-07-09 | 2001-01-15 | 마찌다 가쯔히꼬 | Printed wiring board and manufacturing method thereof |
JP2007013017A (en) * | 2005-07-04 | 2007-01-18 | Sony Corp | Electronic device and its manufacturing method |
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