JPS6448437A - Electrode structure - Google Patents

Electrode structure

Info

Publication number
JPS6448437A
JPS6448437A JP20550587A JP20550587A JPS6448437A JP S6448437 A JPS6448437 A JP S6448437A JP 20550587 A JP20550587 A JP 20550587A JP 20550587 A JP20550587 A JP 20550587A JP S6448437 A JPS6448437 A JP S6448437A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
glass substrate
externally attached
attached part
conductor
connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20550587A
Inventor
Yoshiro Takahashi
Toshimitsu Yamashita
Takashi Okada
Yoshinori Arao
Original Assignee
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Abstract

PURPOSE:To connect an externally attached part to a conductor layer with excellent reliability by forming a resin layer between region, to which the externally attached part such as a semiconductor element is connected, in the conductor layer on a glass substrate and the glass substrate. CONSTITUTION:A resin layer 31 is shaped between a region, to which at least an externally attached part 25 is connected, in conductor layers 21a, 21b and a glass substrate 11. Consequently, when the externally attached part 25 such as a semiconductor element is connected to the conductor layers 21a, 21b on the glass substrate 11 by using solder, stress generated by the difference of, the mutual thermal expansion coefficients of the semiconductor element 25, etc., and the glass substrate 11 is absorbed by the resin layer 31 formed between both conductor layers. Accordingly, an effect on the glass substrate 11 of the stress can be reduced, thus connecting the externally attached part to the conductor layer with excellent reliability.
JP20550587A 1987-08-19 1987-08-19 Electrode structure Pending JPS6448437A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20550587A JPS6448437A (en) 1987-08-19 1987-08-19 Electrode structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20550587A JPS6448437A (en) 1987-08-19 1987-08-19 Electrode structure

Publications (1)

Publication Number Publication Date
JPS6448437A true true JPS6448437A (en) 1989-02-22

Family

ID=16507973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20550587A Pending JPS6448437A (en) 1987-08-19 1987-08-19 Electrode structure

Country Status (1)

Country Link
JP (1) JPS6448437A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03209793A (en) * 1989-10-18 1991-09-12 Nippondenso Co Ltd Solder connecting structure for glass board
EP0818946A2 (en) * 1996-07-09 1998-01-14 Sharp Kabushiki Kaisha A printed-wiring board and a production method thereof
JP2007013017A (en) * 2005-07-04 2007-01-18 Sony Corp Electronic device and its manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216978A (en) * 1975-07-30 1977-02-08 Matsushita Electric Ind Co Ltd Semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216978A (en) * 1975-07-30 1977-02-08 Matsushita Electric Ind Co Ltd Semiconductor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03209793A (en) * 1989-10-18 1991-09-12 Nippondenso Co Ltd Solder connecting structure for glass board
EP0818946A2 (en) * 1996-07-09 1998-01-14 Sharp Kabushiki Kaisha A printed-wiring board and a production method thereof
EP0818946A3 (en) * 1996-07-09 1999-11-03 Sharp Kabushiki Kaisha A printed-wiring board and a production method thereof
JP2007013017A (en) * 2005-07-04 2007-01-18 Sony Corp Electronic device and its manufacturing method

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