JPS6432662A - Structure of semiconductor package - Google Patents

Structure of semiconductor package

Info

Publication number
JPS6432662A
JPS6432662A JP62187525A JP18752587A JPS6432662A JP S6432662 A JPS6432662 A JP S6432662A JP 62187525 A JP62187525 A JP 62187525A JP 18752587 A JP18752587 A JP 18752587A JP S6432662 A JPS6432662 A JP S6432662A
Authority
JP
Japan
Prior art keywords
substrate
small substrate
solder bumps
surface electrodes
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62187525A
Other languages
Japanese (ja)
Inventor
Yuji Fujita
Minoru Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62187525A priority Critical patent/JPS6432662A/en
Publication of JPS6432662A publication Critical patent/JPS6432662A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To reduce thermal stress applied to a thin-film electrode, and to prevent the disconnection of an aluminum wiring by making the difference of the thermal expansion coefficients of a semiconductor chip and a small substrate smaller than that of the small substrate and a large substrate. CONSTITUTION:Back electrodes 10 on a small substrate 2 and surface electrodes 11 on a wiring substrate 3 are connected by solder bumps, and a section between the small substrate 2 and the wiring substrate 3 is filled with a resin 6. The thermal expansion coefficient of the resin 6 is brought close to the value of the solder bumps 7, thus reducing thermal stress applied to the solder bumps 7. Through-hole conductors 5 are formed into the small substrate 2, and electrically connect the back electrodes 10 on the small substrate and surface electrodes 9 on the small substrate. Surface electrodes 8 on a semiconductor chip 1 and the surface electrodes 9 on the small substrate are connected by solder bumps 4.
JP62187525A 1987-07-29 1987-07-29 Structure of semiconductor package Pending JPS6432662A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62187525A JPS6432662A (en) 1987-07-29 1987-07-29 Structure of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62187525A JPS6432662A (en) 1987-07-29 1987-07-29 Structure of semiconductor package

Publications (1)

Publication Number Publication Date
JPS6432662A true JPS6432662A (en) 1989-02-02

Family

ID=16207606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62187525A Pending JPS6432662A (en) 1987-07-29 1987-07-29 Structure of semiconductor package

Country Status (1)

Country Link
JP (1) JPS6432662A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02307295A (en) * 1989-05-23 1990-12-20 Japan Radio Co Ltd Junction of multilayer printed board
US8178255B2 (en) * 2007-02-06 2012-05-15 Sanyo Electric Co., Ltd. Fuel cell
USRE44251E1 (en) 1996-09-12 2013-06-04 Ibiden Co., Ltd. Circuit board for mounting electronic parts

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02307295A (en) * 1989-05-23 1990-12-20 Japan Radio Co Ltd Junction of multilayer printed board
USRE44251E1 (en) 1996-09-12 2013-06-04 Ibiden Co., Ltd. Circuit board for mounting electronic parts
US8178255B2 (en) * 2007-02-06 2012-05-15 Sanyo Electric Co., Ltd. Fuel cell

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