JPS56148857A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56148857A
JPS56148857A JP5250380A JP5250380A JPS56148857A JP S56148857 A JPS56148857 A JP S56148857A JP 5250380 A JP5250380 A JP 5250380A JP 5250380 A JP5250380 A JP 5250380A JP S56148857 A JPS56148857 A JP S56148857A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
semiconductor chip
formed
electrode
chip
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5250380A
Inventor
Masahiro Yoshida
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657Stacked arrangements of devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16135Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/0651Wire or wire-like electrical connections from device to substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06513Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps

Abstract

PURPOSE:To improve the integration of a semiconductor device by bonding another semiconductor chip on a semiconductor chip mounted on a substrate. CONSTITUTION:A lead electrode 2 and a metallic layer 3 are formed on a substrate 1 made of insulator, and a package 4 is formed. A projected conductor electrode 9 is formed on the upper surface of the first semiconductor chip 15, bonded by solder on a metallic layer 3, and then the electrode of the chip 15 is bonded by a fine metallic wire to the lead electrode 2. The second semiconductor chip 16 on which the electrode 9 is formed is carried on the chip 15, the electrodes 9 of both chips 15 and 16 are contacted and bonded. Thus, the integration of the semiconductor device can be improved without increasing the difficult integration of the semiconductor chip therein.
JP5250380A 1980-04-18 1980-04-18 Semiconductor device Granted JPS56148857A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5250380A JPS56148857A (en) 1980-04-18 1980-04-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5250380A JPS56148857A (en) 1980-04-18 1980-04-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56148857A true true JPS56148857A (en) 1981-11-18

Family

ID=12916524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5250380A Granted JPS56148857A (en) 1980-04-18 1980-04-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56148857A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892230A (en) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp Semiconductor device
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS59117251A (en) * 1982-12-24 1984-07-06 Hitachi Ltd Semiconductor device
JPS59229850A (en) * 1983-05-16 1984-12-24 Rohm Co Ltd Semiconductor device
US5703405A (en) * 1993-03-15 1997-12-30 Motorola, Inc. Integrated circuit chip formed from processing two opposing surfaces of a wafer
WO2001028003A1 (en) * 1999-10-14 2001-04-19 Sun Microsystems, Inc. Face-to-face chips
US7112468B2 (en) 1998-09-25 2006-09-26 Stmicroelectronics, Inc. Stacked multi-component integrated circuit microprocessor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892230A (en) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp Semiconductor device
JPS6347259B2 (en) * 1981-11-27 1988-09-21 Mitsubishi Electric Corp
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS59117251A (en) * 1982-12-24 1984-07-06 Hitachi Ltd Semiconductor device
JPS59229850A (en) * 1983-05-16 1984-12-24 Rohm Co Ltd Semiconductor device
US5703405A (en) * 1993-03-15 1997-12-30 Motorola, Inc. Integrated circuit chip formed from processing two opposing surfaces of a wafer
US7112468B2 (en) 1998-09-25 2006-09-26 Stmicroelectronics, Inc. Stacked multi-component integrated circuit microprocessor
WO2001028003A1 (en) * 1999-10-14 2001-04-19 Sun Microsystems, Inc. Face-to-face chips
US6500696B2 (en) 1999-10-14 2002-12-31 Sun Microsystems, Inc. Face to face chip
US6559531B1 (en) 1999-10-14 2003-05-06 Sun Microsystems, Inc. Face to face chips

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