JPS5240974A - Package for semiconductor chips - Google Patents

Package for semiconductor chips

Info

Publication number
JPS5240974A
JPS5240974A JP50116621A JP11662175A JPS5240974A JP S5240974 A JPS5240974 A JP S5240974A JP 50116621 A JP50116621 A JP 50116621A JP 11662175 A JP11662175 A JP 11662175A JP S5240974 A JPS5240974 A JP S5240974A
Authority
JP
Japan
Prior art keywords
package
semiconductor chips
bonding
ribbon
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50116621A
Other languages
Japanese (ja)
Inventor
Sotohisa Asai
Toshihiko Yatsuhara
Masaaki Nakatani
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50116621A priority Critical patent/JPS5240974A/en
Publication of JPS5240974A publication Critical patent/JPS5240974A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45014Ribbon connectors, e.g. rectangular cross-section
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance

Abstract

PURPOSE: To provide a recess at the center of an insulating case, and making the surface of a semiconductor chip having an electrode and the height of each bonding area nearly the same, thereby facilitating bonding and reducing inductance by wire or ribbon.
COPYRIGHT: (C)1977,JPO&Japio
JP50116621A 1975-09-27 1975-09-27 Package for semiconductor chips Pending JPS5240974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50116621A JPS5240974A (en) 1975-09-27 1975-09-27 Package for semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50116621A JPS5240974A (en) 1975-09-27 1975-09-27 Package for semiconductor chips

Publications (1)

Publication Number Publication Date
JPS5240974A true JPS5240974A (en) 1977-03-30

Family

ID=14691708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50116621A Pending JPS5240974A (en) 1975-09-27 1975-09-27 Package for semiconductor chips

Country Status (1)

Country Link
JP (1) JPS5240974A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692789A (en) * 1982-07-23 1987-09-08 Kabushiki Kaisha Toyota Chuo Kenkyusho Semiconductor apparatus
JPS6356923A (en) * 1986-08-27 1988-03-11 Fujitsu Ltd High-frequency transistor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4410453Y1 (en) * 1966-05-11 1969-04-26
JPS4410452Y1 (en) * 1966-04-27 1969-04-26
JPS4868170A (en) * 1971-12-20 1973-09-17
JPS4947713A (en) * 1972-03-22 1974-05-09

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4410452Y1 (en) * 1966-04-27 1969-04-26
JPS4410453Y1 (en) * 1966-05-11 1969-04-26
JPS4868170A (en) * 1971-12-20 1973-09-17
JPS4947713A (en) * 1972-03-22 1974-05-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692789A (en) * 1982-07-23 1987-09-08 Kabushiki Kaisha Toyota Chuo Kenkyusho Semiconductor apparatus
JPS6356923A (en) * 1986-08-27 1988-03-11 Fujitsu Ltd High-frequency transistor device

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