JPS5796561A - Lead for connection of semiconductor device - Google Patents

Lead for connection of semiconductor device

Info

Publication number
JPS5796561A
JPS5796561A JP55173003A JP17300380A JPS5796561A JP S5796561 A JPS5796561 A JP S5796561A JP 55173003 A JP55173003 A JP 55173003A JP 17300380 A JP17300380 A JP 17300380A JP S5796561 A JPS5796561 A JP S5796561A
Authority
JP
Japan
Prior art keywords
lead
leads
semiconductor device
connection
integration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55173003A
Other languages
Japanese (ja)
Other versions
JPS6132821B2 (en
Inventor
Hiroshi Yamanouchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55173003A priority Critical patent/JPS5796561A/en
Publication of JPS5796561A publication Critical patent/JPS5796561A/en
Publication of JPS6132821B2 publication Critical patent/JPS6132821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To miniaturize the lead, to increase the degree of integration and to connect the semiconductor device with high accuracy by mounting a plurality of stress patterns to the lead for connection as cushion sections and making the shape symmetric in the longitudinal direction of the lead. CONSTITUTION:The metallic leads digitally projected into a window hole, the surface thereof is coated with gold, silver or the like, are placed onto an electric insulating film 3, and the two framed stress relaxing patterns are connected continuously as the cushion sections. Accordingly, the spaces of the leads can be narrowed, the degree of integration of the leads is increased, displacement is not generated, and the leads can connect the semiconductor device with high accuracy.
JP55173003A 1980-12-08 1980-12-08 Lead for connection of semiconductor device Granted JPS5796561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55173003A JPS5796561A (en) 1980-12-08 1980-12-08 Lead for connection of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173003A JPS5796561A (en) 1980-12-08 1980-12-08 Lead for connection of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5796561A true JPS5796561A (en) 1982-06-15
JPS6132821B2 JPS6132821B2 (en) 1986-07-29

Family

ID=15952380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55173003A Granted JPS5796561A (en) 1980-12-08 1980-12-08 Lead for connection of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5796561A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4580193A (en) * 1985-01-14 1986-04-01 International Business Machines Corporation Chip to board bus connection
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
DE10303455A1 (en) * 2003-01-29 2004-08-19 Osram Opto Semiconductors Gmbh Lead frame band has several component lead frames which are held in support and guiding area and each of which have two electrical connection strips
JP2011142172A (en) * 2010-01-06 2011-07-21 Mitsubishi Electric Corp Power semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63129745U (en) * 1987-02-17 1988-08-24

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48109856U (en) * 1972-03-22 1973-12-18
JPS5417666A (en) * 1977-07-08 1979-02-09 Nec Corp Lead frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48109856U (en) * 1972-03-22 1973-12-18
JPS5417666A (en) * 1977-07-08 1979-02-09 Nec Corp Lead frame

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
US4580193A (en) * 1985-01-14 1986-04-01 International Business Machines Corporation Chip to board bus connection
DE10303455A1 (en) * 2003-01-29 2004-08-19 Osram Opto Semiconductors Gmbh Lead frame band has several component lead frames which are held in support and guiding area and each of which have two electrical connection strips
DE10303455B4 (en) * 2003-01-29 2007-11-29 Osram Opto Semiconductors Gmbh Leadframe ribbon and method of manufacturing a plurality of leadframe based light emitting diode devices
JP2011142172A (en) * 2010-01-06 2011-07-21 Mitsubishi Electric Corp Power semiconductor device

Also Published As

Publication number Publication date
JPS6132821B2 (en) 1986-07-29

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