JPS5552231A - Semiconductor attaching device - Google Patents

Semiconductor attaching device

Info

Publication number
JPS5552231A
JPS5552231A JP12533378A JP12533378A JPS5552231A JP S5552231 A JPS5552231 A JP S5552231A JP 12533378 A JP12533378 A JP 12533378A JP 12533378 A JP12533378 A JP 12533378A JP S5552231 A JPS5552231 A JP S5552231A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit panel
base plate
chip
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12533378A
Other languages
Japanese (ja)
Inventor
Yukio Aoki
Eizo Mori
Yoshiteru Onaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12533378A priority Critical patent/JPS5552231A/en
Publication of JPS5552231A publication Critical patent/JPS5552231A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To attach an IC chip, etc. onto a printed circuit panel easily and effectively, in attaching a semiconductor chip onto a printed circuit panel, by soldering an electrode, which is on a chip-bonded base plate surface, and the printed circuit panel by arranging them in such positions as to face each other.
CONSTITUTION: After joining a semiconductor chip 3 onto center of surface of a heat-resistance insulated base plate 1 with a thickness of lower than 0.5mm and having copper foil formed on its surface in radial configuration, and bonding a wire between all the electrodes of the chip 3 and the copper foil, a mold resin layer 8 is provided. A section of the insulated base plate 1 or the printed circuit panel 7, which is opposite to A, is coated with adhesive, and the insulated base plate 7 is attached onto rear surface of the printed circuit panel 7. In this case, an arrangement is to be made so that a copper foil conductor layer 2 and a conductor layer 5 of the printed circuit panel 7 become opposite to each other. Finally, solder-joining is made in the direction of the arrow by using dip soldering method. In this case, by providing a notched section 9 on the insulated base plate, shortcircuiting of the conductor layer 5 by solder can be prevented.
COPYRIGHT: (C)1980,JPO&Japio
JP12533378A 1978-10-11 1978-10-11 Semiconductor attaching device Pending JPS5552231A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12533378A JPS5552231A (en) 1978-10-11 1978-10-11 Semiconductor attaching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12533378A JPS5552231A (en) 1978-10-11 1978-10-11 Semiconductor attaching device

Publications (1)

Publication Number Publication Date
JPS5552231A true JPS5552231A (en) 1980-04-16

Family

ID=14907505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12533378A Pending JPS5552231A (en) 1978-10-11 1978-10-11 Semiconductor attaching device

Country Status (1)

Country Link
JP (1) JPS5552231A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55157236A (en) * 1979-05-28 1980-12-06 Nec Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55157236A (en) * 1979-05-28 1980-12-06 Nec Corp Semiconductor device

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