JPS6453493A - Wiring board for surface packaging - Google Patents

Wiring board for surface packaging

Info

Publication number
JPS6453493A
JPS6453493A JP20994087A JP20994087A JPS6453493A JP S6453493 A JPS6453493 A JP S6453493A JP 20994087 A JP20994087 A JP 20994087A JP 20994087 A JP20994087 A JP 20994087A JP S6453493 A JPS6453493 A JP S6453493A
Authority
JP
Japan
Prior art keywords
pad
wiring board
insulating film
printed wiring
surface packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20994087A
Other languages
Japanese (ja)
Inventor
Iwao Ishihara
Makio Ohata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP20994087A priority Critical patent/JPS6453493A/en
Publication of JPS6453493A publication Critical patent/JPS6453493A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To provide a printed wiring board for surface packaging with great pad adhesive force by coating at least one part of pad with an insulating film in a printed wiring board whose terminal of component to be packaged on the surface is connected through solder. CONSTITUTION:A pad 3 and a copper foil pattern for wiring 7 are formed at a position where a terminal 4 of a surface packaging component 1 on the surface of a printed wiring board 2 hits against. At this time, an insulating film 6 is coated at a part where pad is most easily peeled, namely the side without lead wire in a longer direction of a rectangular pad. It allows the pad 3 to be pressed down by the insulating film 6 to make it difficult to be peeled off.
JP20994087A 1987-08-24 1987-08-24 Wiring board for surface packaging Pending JPS6453493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20994087A JPS6453493A (en) 1987-08-24 1987-08-24 Wiring board for surface packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20994087A JPS6453493A (en) 1987-08-24 1987-08-24 Wiring board for surface packaging

Publications (1)

Publication Number Publication Date
JPS6453493A true JPS6453493A (en) 1989-03-01

Family

ID=16581181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20994087A Pending JPS6453493A (en) 1987-08-24 1987-08-24 Wiring board for surface packaging

Country Status (1)

Country Link
JP (1) JPS6453493A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362589A (en) * 1989-07-31 1991-03-18 Seiko Epson Corp Mounting of semiconductor device
JPH0459982U (en) * 1990-09-28 1992-05-22
JPH04309288A (en) * 1991-04-08 1992-10-30 Nec Corp Printed circuit board
JP2001295793A (en) * 2000-04-18 2001-10-26 Toto Ltd Axial blower
JP2003008191A (en) * 2001-06-21 2003-01-10 Toshiba Corp Wiring board device
WO2003098983A1 (en) * 2002-05-17 2003-11-27 Nec Corporation Printed wiring board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5680196A (en) * 1979-12-05 1981-07-01 Hitachi Ltd Method of forming electrode for printed circuit board
JPS5944068B2 (en) * 1976-09-20 1984-10-26 日立マクセル株式会社 clippers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944068B2 (en) * 1976-09-20 1984-10-26 日立マクセル株式会社 clippers
JPS5680196A (en) * 1979-12-05 1981-07-01 Hitachi Ltd Method of forming electrode for printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362589A (en) * 1989-07-31 1991-03-18 Seiko Epson Corp Mounting of semiconductor device
JPH0459982U (en) * 1990-09-28 1992-05-22
JPH04309288A (en) * 1991-04-08 1992-10-30 Nec Corp Printed circuit board
JP2001295793A (en) * 2000-04-18 2001-10-26 Toto Ltd Axial blower
JP2003008191A (en) * 2001-06-21 2003-01-10 Toshiba Corp Wiring board device
WO2003098983A1 (en) * 2002-05-17 2003-11-27 Nec Corporation Printed wiring board

Similar Documents

Publication Publication Date Title
GB2180175B (en) Apparatus for making scribed circuit boards and circuit board modifications
TW341722B (en) Surface-mounted semiconductor package and its manufacturing method
EP0452506A4 (en) Flexible circuit board for mounting ic and method of producing the same
KR870003681A (en) Electrical components with leads
CA2108868A1 (en) Printed circuit board with electric elements mounted thereon
JPS6453493A (en) Wiring board for surface packaging
EP0126164A4 (en) Method of connecting double-sided circuits.
JPS5618448A (en) Composite electronic part
JPS52107572A (en) Device for soldering electronic element lead wire to conductor on printed circuit board or sililar article
JPS6464389A (en) Flexible printed-circuit board
GB2324753B (en) Printed circuit and printed wiring boards and methods of manufacture
EP0751562A3 (en) Thermally conducting fastening of an electronic power device to a printed circuit board with a heat dissipator
GB1555227A (en) Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
JPS5456189A (en) Lead wire connection
JPS6464298A (en) Hybrid integrated circuit
EP0335420A3 (en) Electrical and mechanical joint construction between a printed wiring board and a lead pin
JPS6469091A (en) Printed circuit board
JPS5552231A (en) Semiconductor attaching device
JPS54109769A (en) Semiconductor device connecting tape
JPS6459985A (en) Printed wiring board for ic card
JPS6442140A (en) Connection of integrated circuit
JPS5546561A (en) Method of fabricating hybrid integrated circuit
MY121812A (en) Method and a device for shielding electronic components
JPS6484689A (en) Printed wiring board for high speed signal transmission
JPS55160452A (en) Hybrid integrated circuit