GB2324753B - Printed circuit and printed wiring boards and methods of manufacture - Google Patents

Printed circuit and printed wiring boards and methods of manufacture

Info

Publication number
GB2324753B
GB2324753B GB9809281A GB9809281A GB2324753B GB 2324753 B GB2324753 B GB 2324753B GB 9809281 A GB9809281 A GB 9809281A GB 9809281 A GB9809281 A GB 9809281A GB 2324753 B GB2324753 B GB 2324753B
Authority
GB
United Kingdom
Prior art keywords
manufacture
methods
wiring boards
printed circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9809281A
Other versions
GB9809281D0 (en
GB2324753A (en
Inventor
Kazuyuki Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9809281D0 publication Critical patent/GB9809281D0/en
Publication of GB2324753A publication Critical patent/GB2324753A/en
Application granted granted Critical
Publication of GB2324753B publication Critical patent/GB2324753B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

A printed circuit or wiring board has a substrate 10 with at least one electronic part 4, a solder pad 3 arranged at a predetermined position on the substrate, and at least one solder resist layer 21. The resist layer has a predetermined thickness such that the electronic part 4 is maintained with the distance between an electrode 5 and the solder pad 3 opposite thereto determined by the thickness of the solder resist layer. The electrode of the electronic part then being soldered to the solder pad.
GB9809281A 1997-05-02 1998-04-30 Printed circuit and printed wiring boards and methods of manufacture Expired - Fee Related GB2324753B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13041697A JP3173423B2 (en) 1997-05-02 1997-05-02 Printed wiring board

Publications (3)

Publication Number Publication Date
GB9809281D0 GB9809281D0 (en) 1998-07-01
GB2324753A GB2324753A (en) 1998-11-04
GB2324753B true GB2324753B (en) 1999-09-01

Family

ID=15033744

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9809281A Expired - Fee Related GB2324753B (en) 1997-05-02 1998-04-30 Printed circuit and printed wiring boards and methods of manufacture

Country Status (2)

Country Link
JP (1) JP3173423B2 (en)
GB (1) GB2324753B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2417139A (en) * 2004-08-13 2006-02-15 Siemens Aktiengesellschaft Printed circuit board
JP2011142130A (en) * 2010-01-05 2011-07-21 Murata Mfg Co Ltd Structure for mounting electronic component on mounting substrate, mounting substrate, and mounting substrate having electronic component mounted thereon
CN103098565B (en) * 2010-09-10 2016-08-03 名幸电子有限公司 Substrate having built-in components
JP2012004590A (en) * 2011-08-31 2012-01-05 Hitachi Automotive Systems Ltd Method for manufacturing on-vehicle electronic circuit device or electronic circuit device
JP2014045152A (en) * 2012-08-28 2014-03-13 Panasonic Corp Component mounting board
JP2015099889A (en) * 2013-11-20 2015-05-28 スズキ株式会社 Printed circuit board
JPWO2022085566A1 (en) * 2020-10-19 2022-04-28

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134026A (en) * 1983-01-27 1984-08-08 Allen Bradley Int A method of joining a component part to an integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134026A (en) * 1983-01-27 1984-08-08 Allen Bradley Int A method of joining a component part to an integrated circuit

Also Published As

Publication number Publication date
GB9809281D0 (en) 1998-07-01
GB2324753A (en) 1998-11-04
JPH10308573A (en) 1998-11-17
JP3173423B2 (en) 2001-06-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110430