SE9600085D0 - Shielding of electronic components that are baked directly on PCBs - Google Patents

Shielding of electronic components that are baked directly on PCBs

Info

Publication number
SE9600085D0
SE9600085D0 SE9600085A SE9600085A SE9600085D0 SE 9600085 D0 SE9600085 D0 SE 9600085D0 SE 9600085 A SE9600085 A SE 9600085A SE 9600085 A SE9600085 A SE 9600085A SE 9600085 D0 SE9600085 D0 SE 9600085D0
Authority
SE
Sweden
Prior art keywords
electronic components
pcbs
shielding
baked directly
insulating polymer
Prior art date
Application number
SE9600085A
Other languages
Swedish (sv)
Inventor
Bo Wikstroem
Original Assignee
Xicon Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xicon Ab filed Critical Xicon Ab
Priority to SE9600085A priority Critical patent/SE9600085D0/en
Publication of SE9600085D0 publication Critical patent/SE9600085D0/en
Priority to AU13251/97A priority patent/AU1325197A/en
Priority to PCT/SE1997/000015 priority patent/WO1997025847A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01063—Europium [Eu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Abstract

Method of electrically shielding electronic components that are mounted directly on a printed circuit board and completely or partly provided with an insulating polymer. The insulating polymer is provided with a thin layer of conducting material.
SE9600085A 1996-01-08 1996-01-08 Shielding of electronic components that are baked directly on PCBs SE9600085D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9600085A SE9600085D0 (en) 1996-01-08 1996-01-08 Shielding of electronic components that are baked directly on PCBs
AU13251/97A AU1325197A (en) 1996-01-08 1997-01-08 Shielding of electronic components embedded in plastics directly on circuit board
PCT/SE1997/000015 WO1997025847A1 (en) 1996-01-08 1997-01-08 Shielding of electronic components embedded in plastics directly on circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9600085A SE9600085D0 (en) 1996-01-08 1996-01-08 Shielding of electronic components that are baked directly on PCBs

Publications (1)

Publication Number Publication Date
SE9600085D0 true SE9600085D0 (en) 1996-01-08

Family

ID=20400981

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9600085A SE9600085D0 (en) 1996-01-08 1996-01-08 Shielding of electronic components that are baked directly on PCBs

Country Status (3)

Country Link
AU (1) AU1325197A (en)
SE (1) SE9600085D0 (en)
WO (1) WO1997025847A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6092281A (en) 1998-08-28 2000-07-25 Amkor Technology, Inc. Electromagnetic interference shield driver and method
US6448635B1 (en) 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip
DE10002852A1 (en) * 2000-01-24 2001-08-02 Infineon Technologies Ag Shielding device and electrical component with a shielding device
JP2001339016A (en) * 2000-05-30 2001-12-07 Alps Electric Co Ltd Surface mounting electronic circuit unit
DE10142542A1 (en) * 2001-08-30 2003-03-27 Infineon Technologies Ag Arrangement of semiconductor chip in chip carrier housing has conductive coating applied to semiconductor chip on opposite side to chip carrier
EP2043149A1 (en) * 2007-09-27 2009-04-01 Oticon A/S Assembly comprising an electromagnetically screened smd component, method of manufacturing the same and use

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959752A (en) * 1988-10-24 1990-09-25 Digital Equipment Corporation Electronic module RFI/EMI shielding
DE4016953A1 (en) * 1990-05-25 1991-11-28 Itt Ind Gmbh Deutsche Electronic device with electromagnetic screening - using insulating and conductive pref. epoxy¨ resin layers
US5287247A (en) * 1990-09-21 1994-02-15 Lsi Logic Corporation Computer system module assembly
US5177324A (en) * 1991-08-19 1993-01-05 Motorola, Inc. In situ RF shield for printed circuit board

Also Published As

Publication number Publication date
AU1325197A (en) 1997-08-01
WO1997025847A1 (en) 1997-07-17

Similar Documents

Publication Publication Date Title
MY128039A (en) Printed circuit boards and method of producing the same
AU2002211084A1 (en) Methods of manufacturing a printed circuit board shielded against interfering radiation
EP0851724A3 (en) Printed circuit board and electric components
NO950933L (en) Annular circuit components coupled with through holes in a printed circuit board
DE69915874D1 (en) PRINTED PCB AND METHOD FOR THE PRODUCTION THEREOF
TW342580B (en) Printed circuit assembly and method of manufacture therefor
DE69612787T2 (en) Flexible printed microstrip circuit board as an electrical connection line
MY113889A (en) Dual substrate package assembly for being electrically coupled to a conducting member
EP0997935A4 (en) Printed wiring board and method for manufacturing the same
MY113466A (en) Multilayer printed wiring board
EP1119227A4 (en) Printed wiring board and method for producing the same
ATE390711T1 (en) HOUSING WITH BURGLAR PROTECTION FOR ELECTRONIC CIRCUITS
DE69923205D1 (en) PCB ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF
WO1987007998A1 (en) Shielding device
DE50209353D1 (en) PCB WITH AT LEAST ONE ELECTRONIC COMPONENT
SE9802157L (en) Electrical component
TW333742B (en) The improving & producing method for PCB with migration resistance
EP0748152A3 (en) Method for mounting an electronic component on a wiring substrate and an illuminated switch unit using this mounting method
SE9600085D0 (en) Shielding of electronic components that are baked directly on PCBs
JP2002033556A (en) Flexible circuit board
SE9703128D0 (en) Procedure and apparatus in electronic systems
IL105753A (en) Printed circuit substrates
KR950001266B1 (en) Method of manufacturing aluminum circuit board
GB2330238B (en) Assembly of electrical components on printed circuit boards
EP1168897A3 (en) Foil printed circuit board and process for manufacturing and mounting the same