AU2002211084A1 - Methods of manufacturing a printed circuit board shielded against interfering radiation - Google Patents

Methods of manufacturing a printed circuit board shielded against interfering radiation

Info

Publication number
AU2002211084A1
AU2002211084A1 AU2002211084A AU1108402A AU2002211084A1 AU 2002211084 A1 AU2002211084 A1 AU 2002211084A1 AU 2002211084 A AU2002211084 A AU 2002211084A AU 1108402 A AU1108402 A AU 1108402A AU 2002211084 A1 AU2002211084 A1 AU 2002211084A1
Authority
AU
Australia
Prior art keywords
printed circuit
methods
board
manufacturing
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002211084A
Inventor
Stephanus Gerardus Johannes Blankenborg
Peter Leerkamp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stork Paints Bv
Original Assignee
Stork Screens BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1016354A external-priority patent/NL1016354C1/en
Application filed by Stork Screens BV filed Critical Stork Screens BV
Publication of AU2002211084A1 publication Critical patent/AU2002211084A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Abstract

Methods for the production of a board ( 11 ) with printed circuit ( 12 ) shielded against interfering radiation and having electronic components ( 14 ) comprise the steps of positioning of the electronic components ( 14 ) on contact points ( 15 ) designed for them, and the application of a shield ( 20 ), comprising a preformed metallized plastic film ( 30 ) over the top of the electronic components ( 14 ) and in electrical contact with the earth ( 13 ) on the board ( 11 ) with printed circuit ( 12 ), and also fixing the electronic components ( 14 ) on the board ( 11 ) with printed circuit ( 12 ) by means of an electrically conducting fixing agent ( 16 ); and fixing of the shield ( 20 ) on the board ( 11 ) with printed circuit ( 12 ).
AU2002211084A 2000-10-06 2001-10-03 Methods of manufacturing a printed circuit board shielded against interfering radiation Abandoned AU2002211084A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
NL1016354 2000-10-06
NL1016354A NL1016354C1 (en) 2000-10-06 2000-10-06 Production of shielded printed circuit board involves applying fixing agent and positioning shield comprising preformed metallized plastic film over electronic component(s)
NL1016549 2000-11-06
NL1016549A NL1016549C2 (en) 2000-10-06 2000-11-06 Method for the production of a card protected against interference radiation with a printed circuit.
PCT/NL2001/000727 WO2002030170A1 (en) 2000-10-06 2001-10-03 Methods of manufacturing a printed circuit board shielded against interfering radiation

Publications (1)

Publication Number Publication Date
AU2002211084A1 true AU2002211084A1 (en) 2002-04-15

Family

ID=26643249

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002211084A Abandoned AU2002211084A1 (en) 2000-10-06 2001-10-03 Methods of manufacturing a printed circuit board shielded against interfering radiation

Country Status (12)

Country Link
US (1) US7089646B2 (en)
EP (1) EP1323341B1 (en)
JP (1) JP2004511107A (en)
KR (1) KR20030057535A (en)
CN (1) CN1213650C (en)
AT (1) ATE270491T1 (en)
AU (1) AU2002211084A1 (en)
CA (1) CA2424885C (en)
DE (1) DE60104140T2 (en)
ES (1) ES2219569T3 (en)
NL (1) NL1016549C2 (en)
WO (1) WO2002030170A1 (en)

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US8104474B2 (en) * 2005-08-23 2012-01-31 Portaero, Inc. Collateral ventilation bypass system with retention features
CN1972587B (en) * 2005-11-25 2011-11-16 深圳富泰宏精密工业有限公司 Shielding component and casing assembly of electronic device
CN101452729A (en) * 2007-11-29 2009-06-10 深圳易拓科技有限公司 Antielectromagnetic interference method of mobile hard disk and the mobile hard disk
KR101056323B1 (en) * 2009-09-15 2011-08-11 삼성모바일디스플레이주식회사 Flat Panel Display
DE102009047681A1 (en) * 2009-12-08 2011-06-09 Robert Bosch Gmbh Circuit module and method for producing such a circuit module
JP5593714B2 (en) 2010-01-29 2014-09-24 富士通株式会社 Electronic element shield structure and electronic device equipped with the same
DE102010026953B4 (en) * 2010-07-12 2015-02-26 Continental Automotive Gmbh Housing of an electronic circuit for a fuel pump
CN102340962A (en) * 2010-07-28 2012-02-01 深圳富泰宏精密工业有限公司 Fixed structure and electronic device employing same
US8340735B2 (en) * 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
EP2416544B1 (en) * 2010-08-06 2015-04-29 BlackBerry Limited Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device
TW201218731A (en) * 2010-10-28 2012-05-01 Hon Hai Prec Ind Co Ltd Mobile phone with metal hinge
CN101964830A (en) * 2010-10-29 2011-02-02 鸿富锦精密工业（深圳）有限公司 Mobile phone with metal hinge
US8654537B2 (en) 2010-12-01 2014-02-18 Apple Inc. Printed circuit board with integral radio-frequency shields
US8279625B2 (en) 2010-12-14 2012-10-02 Apple Inc. Printed circuit board radio-frequency shielding structures
KR101052559B1 (en) * 2011-02-25 2011-07-29 김선기 Shield case for emi shielding and protection
US9179538B2 (en) 2011-06-09 2015-11-03 Apple Inc. Electromagnetic shielding structures for selectively shielding components on a substrate
US10631413B1 (en) * 2011-11-28 2020-04-21 The United States Of America As Represented By The Secretary Of The Army Enhanced protective layering process to accommodate circuit board heat dissipation
US9900988B1 (en) * 2011-11-28 2018-02-20 The United States Of America As Represented By The Secretary Of The Army Protective layering process for circuit board EMI sheilding and thermal management
US9254588B1 (en) * 2011-11-28 2016-02-09 The United States Of America As Represented By The Secretary Of The Army Protective layering process for circuit boards
US10557061B2 (en) 2011-12-26 2020-02-11 Dic Corporation Adhesive tape
TWI468485B (en) * 2012-05-21 2015-01-11 Dainippon Ink & Chemicals Adhesive tape
US9785185B2 (en) * 2012-09-11 2017-10-10 Apple Inc. Removable adhesive joint for computing device
WO2014055732A2 (en) * 2012-10-04 2014-04-10 Whaley Brian A Shieldings for metal detector heads and manufacturing methods thereof
KR20140143991A (en) * 2013-06-10 2014-12-18 삼성전기주식회사 Shielding apparatus for wireless power transfer and wireless power transfer system using thereof
JP2015065342A (en) * 2013-09-25 2015-04-09 タツタ電線株式会社 Shield housing body, printed circuit board and electronic apparatus
JP2015065343A (en) * 2013-09-25 2015-04-09 タツタ電線株式会社 Shield housing body, printed circuit board, electronic apparatus and method for manufacturing shield housing body
US9521741B1 (en) 2014-06-04 2016-12-13 Amazon Technologies, Inc. Side surface mounting of shields for a circuit board assembly
JP6413405B2 (en) * 2014-07-07 2018-10-31 Ａｇｃ株式会社 Double-sided adhesive film, transparent surface material with adhesive layer, and laminate
CN104837327A (en) * 2015-05-21 2015-08-12 小米科技有限责任公司 Circuit protection structure and electronic device
CN105592679B (en) * 2016-03-09 2018-07-13 深圳市华星光电技术有限公司 PCB fixed structures and liquid crystal display device
CN106132182A (en) * 2016-06-27 2016-11-16 努比亚技术有限公司 Printed circuit board, mobile terminal, mobile terminal shielding frame and preparation method
CN106028627A (en) * 2016-07-26 2016-10-12 深圳天珑无线科技有限公司 Circuit board assembly
US20180084682A1 (en) * 2016-09-20 2018-03-22 Jones Tech (USA), Inc. Shielding structure for an electronic circuit
JP6691495B2 (en) * 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント Electronics
CN107411459A (en) * 2017-07-17 2017-12-01 陈锋 A kind of quilt of anti-electromagnetic radiation
CN113543615B (en) * 2021-06-29 2022-11-01 中国科学院长春光学精密机械与物理研究所 Irradiation protection method for space electronic equipment
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Also Published As

Publication number Publication date
EP1323341A1 (en) 2003-07-02
KR20030057535A (en) 2003-07-04
CA2424885C (en) 2009-12-15
CA2424885A1 (en) 2002-04-11
CN1213650C (en) 2005-08-03
ATE270491T1 (en) 2004-07-15
DE60104140D1 (en) 2004-08-05
US20040022046A1 (en) 2004-02-05
CN1468503A (en) 2004-01-14
WO2002030170A1 (en) 2002-04-11
NL1016549C2 (en) 2002-04-10
JP2004511107A (en) 2004-04-08
US7089646B2 (en) 2006-08-15
EP1323341B1 (en) 2004-06-30
DE60104140T2 (en) 2005-08-25
ES2219569T3 (en) 2004-12-01

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