JP2015065343A - Shield housing body, printed circuit board, electronic apparatus and method for manufacturing shield housing body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shield housing body allowing reduction in thickness and improvement of handleability, a printed circuit board, an electronic apparatus and a method for manufacturing the shield housing body.SOLUTION: A shield housing body 10 is formed of a shield film 1 having a conductive layer 3, a conductive adhesive layer 4 laminated on the conductive layer 3 and having adhesiveness to an attachment part containing a ground pattern 22 on a printed board 20, and a peel-off film 5 laminated on the conductive adhesive layer 4 so as to be peelable, having electrical insulation properties and peeled off leaving a part covering an exposed surface of an electronic circuit 40. The shield housing body 10 is formed into a three-dimensional shape for housing the electronic circuit 40, and comprises a housing 11 in which the peel-off film 5 is arranged on a surface at the electronic circuit 40 side; and a jaw 12 arranged on a periphery of the housing 11 corresponding to an attachment part.

Description

  The present invention relates to a shield container, a printed circuit board, an electronic device, and a method for manufacturing the shield container.

  2. Description of the Related Art Conventionally, there is a shield cap for protecting an electronic circuit provided on a printed circuit board from external electromagnetic waves and protecting other devices from electromagnetic waves radiated from the electronic circuit (for example, Patent Document 1). Such a shield cap is formed in a lid shape by a metal layer such as SUS, and is disposed so as to cover an electronic circuit to be protected. In addition, the shield cap has a metal layer connected to a ground wiring pattern on the printed circuit board to enhance the shielding effect.

  By the way, it is difficult to reduce the thickness of the shield cap because it is necessary to provide a gap between the electronic circuit and the inner wall surface so that the inner wall surface does not contact the electronic circuit on the printed circuit board. Therefore, Patent Documents 2 and 3 are available.

  Patent Document 2 discloses a metal cap for an electronic component storage package obtained by molding a metal foil on which a polyamideimide thin film resin layer is formed. Patent Document 3 includes a heat-fusible insulating layer and an electromagnetic wave shielding layer laminated on the heat-fusible insulating layer, and a concave storage portion having the heat-fusible insulating layer as an inner surface. And an electromagnetic shield positioned at the pressed pressing portion by heating and pressing at least a part of the flange to the ground pattern of the printed circuit board. In the adhesive part formed in the vicinity of the pressing part in the heat-fusible insulating layer extruded in the vicinity of the pressing part by the heating and pressing the layer and the earth pattern in electrical contact A shield case attached to a printed circuit board is disclosed.

JP 2001-345592 A JP 2002-237542 A JP 2006-216682 A

  However, in Patent Documents 1 and 2, it is necessary to apply a three-dimensionally shaped shield cap to a printed circuit board by applying solder or an adhesive, which increases the number of manufacturing steps. Further, in Patent Document 3, it is necessary to fold and form the collar portion to be bonded to the printed circuit board, and the process is complicated.

  Therefore, the present invention has been made in view of the above-described problems, and can be reduced in thickness and can be improved in handling of a shield container, a printed circuit board, an electronic device, and a shield container. An object is to provide a manufacturing method.

  The present invention is a shield container that suppresses electromagnetic wave intrusion and electromagnetic wave radiation of the electronic circuit by covering an exposed surface of the electronic circuit mounted on a printed circuit board, and is laminated on the conductive layer, the conductive layer, A conductive adhesive layer having adhesion to a mounting portion including a ground pattern of a printed circuit board, and a portion that is peelably laminated on the conductive adhesive layer and has electrical insulation, and covers an exposed surface of the electronic circuit Formed in a three-dimensional shape that accommodates the electronic circuit, and the release film is disposed on the surface on the electronic circuit side. And an eaves part arranged at the peripheral part of the accommodating part so as to correspond to the attachment part.

  According to the above configuration, when the shield container is manufactured from the shield film or when the shield container is stored and transported, the conductive adhesive layer is protected by the release film, so that a large pressure is applied. Even in this case, it is possible to prevent adhesion to an unexpected part. And when this shield container is used to cover the electronic circuit, only the peeling film of the buttock is peeled off, leaving the part where the peeling film covers the exposed surface of the electronic circuit, so that it corresponds to the mounting part of the printed circuit board. The parts to be bonded are bonded by the conductive adhesive layer, and the potential of the conductive layer can be conducted to the ground pattern through the conductive adhesive layer. Moreover, about the exposed surface of an electronic circuit, it can be set as the form covered with a conductive layer through the insulating layer of a peeling film. Accordingly, it is not necessary to attach the shield container to the printed circuit board while ensuring a gap so that the shield container does not contact the electronic circuit, so that the thickness of the printed circuit board on which the electronic circuit is mounted can be reduced. . That is, according to the shield container having the above structure, the release film is used for the function as the protective layer of the conductive adhesive layer and the function as the insulating layer between the electronic circuit and the conductive layer, thereby improving handling. In addition, the electronic circuit can be protected from electromagnetic waves while reducing the thickness of the printed circuit board.

  Moreover, the shield container of this invention WHEREIN: The said electroconductive contact bonding layer may have adhesiveness at normal temperature.

  According to said structure, since a shield container can be adhere | attached on a printed circuit board at normal temperature, it does not give a thermal damage with respect to the electronic circuit of a printed circuit board. In addition, even if there is a defect in the electronic circuit during the inspection after the electronic circuit is mounted, such as a reflow process, the shield container is sticky at room temperature. After the circuit is replaced, the shield container can be re-adhered, and the handling during manufacturing is further improved.

  The shield container of the present invention may further include an insulating layer laminated on a surface of the conductive layer opposite to the laminated side of the conductive adhesive layer.

  According to the above configuration, when the shield container is attached to the electronic circuit, the insulating layer is positioned on the outer surface of the shield container to protect the conductive layer from external electrical contact and mechanical load. be able to.

  In the shield container of the present invention, the conductive layer may be a conductive particle-containing resin layer.

  According to said structure, compared with the case where a conductive layer is a metal foil and the metal thin film formed by vapor deposition, sputtering, etc., it becomes possible to suppress the crack of a conductive layer at the time of a stamping process.

  Moreover, the shield container of the present invention may have a cutting assisting part that is formed at the boundary between the collar part and the housing part and assists the peeling of the release film on the collar part side from the boundary. .

  According to said structure, since the peeling film of a collar part can be easily and correctly cut | disconnected from the peeling film of a accommodating part in a cutting | disconnection auxiliary | assistant part, the handleability at the time of attaching a shield container to a printed circuit board improved Become.

  Moreover, the shield container of the present invention may further include a communication hole formed in the housing part and communicating the space in the housing part with the outside.

  According to the above configuration, even after the shield container is attached to the printed circuit board, even if the air in the housing space in which the shield container houses the electronic circuit is expanded due to the temperature rise, the expanded air is externally communicated from the communication hole. Therefore, it is possible to prevent problems such as breakage and poor adhesion due to excessive increase in the internal pressure of the accommodation space.

  Moreover, the printed circuit board of this invention is equipped with the shield container as described above.

  According to said structure, a printed circuit board with thin thickness can be obtained easily.

  An electronic apparatus according to the present invention includes the printed circuit board described above.

  According to said structure, a thin electronic device can be obtained easily.

  The method for manufacturing a shield container according to the present invention includes a conductive layer, a conductive adhesive layer laminated on the conductive layer and having adhesion to an attachment site including a ground pattern of the printed circuit board, and the conductive adhesive. The electronic circuit is formed by press punching a shield film that is peelably laminated to a layer and has an electrical insulating property and a peeling film that is peeled off while leaving a portion covering the exposed surface of the electronic circuit. A housing portion in which the release film is disposed on the surface on the electronic circuit side, and a flange portion disposed on a peripheral portion of the housing portion so as to correspond to the attachment site, A shield container having a cutting assisting part formed at a boundary between the collar part and the housing part and assisting the peeling of the release film on the collar part side from the boundary is formed.

  According to said structure, it becomes possible to mass-produce easily the shield container which has the cutting auxiliary | assistant part by press punching.

  Thinning and handling can be improved.

It is explanatory drawing which shows the structure of a shield container. It is a perspective view of a shield container. It is explanatory drawing which shows an example of the manufacturing method of a shield container. It is explanatory drawing which shows an example of the manufacturing method of the cutting assistance part in a shield container. It is explanatory drawing which shows the mounting method of a shield container. It is a figure which shows the modification of a shield container.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

(Configuration of shield container 10)
As shown in FIGS. 1 and 2, the shield container 10 of the present embodiment covers the exposed surface of the electronic circuit 40 mounted on the printed circuit board 20, thereby forming the electronic circuit 40 (the signal pattern 21 on the printed circuit board 20, and The electronic component 30 mounted on the printed circuit board 20 or the like) suppresses electromagnetic wave intrusion or electromagnetic wave radiation. The shield container 10 is peelable to the conductive adhesive layer 4, the conductive adhesive layer 4 laminated on the conductive layer 3, and has adhesiveness to the attachment portion including the ground pattern 22 of the printed circuit board 20. And a shielding film 1 having a peeling film 5 that has electrical insulation and is peeled leaving a portion covering the exposed surface of the electronic circuit 40.

  The shield housing 10 is formed in a three-dimensional shape having a housing space 11a for housing the electronic circuit 40, and the housing portion 11 in which the release film 5 is disposed on the surface of the electronic circuit 40 (the housing space 11a side); It has the collar part 12 arrange | positioned at the peripheral part of the accommodating part 11 so that it may correspond to an attachment site | part. The shield container 10 is provided on the printed circuit board 20 together with the electronic circuit 40, and is provided as the printed circuit board 100 in various electronic devices 300 such as a notebook personal computer and a tablet terminal. In the present embodiment, “inner side surface” means a surface located on the electronic circuit 40 side, and “outer side surface” means a surface located on the opposite side to the electronic circuit 40 side.

  The shape and size of the shield container 10 are not particularly limited and are appropriately selected according to the application. For example, it may be a shield case that covers the entire printed circuit board 20, a shield cover that covers a specific area of the printed circuit board 20, or a shield that covers a small number (for example, one) of electronic component areas. It may be a cap.

  Further, in the present embodiment, the shield container 10 is formed in a cubic shape in which the container 11 is open on one side, but is not limited thereto. For example, the accommodating portion 11 may be formed in a hemispherical shape or the like, or complicated depending on the arrangement mode of the electronic circuit 40 (the electronic component 30 and / or the signal pattern 21) mounted on the printed circuit board 20. It may be formed in a shape. Moreover, the inner surface of the accommodating part 11 may be in contact with the electronic circuit 40 accommodated, and may be non-contact. Moreover, although the collar part 12 is formed in the whole periphery of the said open surface, the shield container 10 is not limited to this, You may be formed in a part of periphery of the open surface.

  Thus, since the conductive adhesive layer 4 is protected by the release film 5, a large pressure is applied when the shield container 10 is manufactured from the shield film 1 or when the shield container 10 is stored and transported. Even when it is done, adhesion to an unexpected part can be prevented. And as shown in FIG. 1, when covering the electronic circuit 40 using this shield container 10, only the peeling film 5 of the collar part 12 leaves the site | part where the peeling film 5 covers the exposed surface of the electronic circuit 40. By peeling off, the conductive adhesive layer 4 is adhered to a part corresponding to the attachment part of the printed circuit board 20, and the potential of the conductive layer 3 is conducted to the ground pattern 22 through the conductive adhesive layer 4. Further, the exposed surface of the electronic circuit 40 is covered with a conductive layer through a release film 5 as an insulating layer. Thereby, since it is not necessary to attach the shield container 10 to the printed circuit board 20 while ensuring a gap so that the conductive layer 3 does not contact the electronic circuit 40, the thickness of the printed circuit board 100 can be reduced. Although not shown, there is a gap between the release film and the electronic component 30 in FIG. 2, but when the thickness is reduced, the thickness of the printed circuit board 100 is minimized by eliminating the gap. be able to. That is, the shield container 10 can be handled by using the release film 5 for a function as a protective layer of the conductive adhesive layer 4 and a function as an insulating layer that insulates between the electronic circuit 40 and the conductive layer 3. In addition to being improved, the electronic circuit 40 can be protected from electromagnetic waves while reducing the thickness of the printed circuit board 20.

  In this embodiment, the shield container 10 has the insulating layer 2 laminated | stacked on the surface on the opposite side to the lamination | stacking side of the conductive adhesive layer 4 in the conductive layer 3. FIG. Thus, when the shield container 10 is attached to the printed board 20, the conductive layer 3 is protected from external physical stress and electrical interference by positioning the insulating layer 2 on the outer surface of the shield container 10. be able to. The shield container 10 is not limited to having the insulating layer 2. That is, the insulating layer 2 may not be stacked on the conductive layer 3. When the insulating layer 2 is not stacked, the ground can be obtained by bringing the conductive layer 3 into contact with the housing of the electronic device 300 or the like. The conductive layer may be electrically connected to the ground pattern via an installation member. The installation member may be, for example, a laminate in which a conductive adhesive layer and a metal layer are laminated. Each of the layers constituting the shield container 10 may be a single layer or a plurality of layers. Hereinafter, each structure of the shield container 10 is demonstrated concretely.

(Shield container 10: conductive layer 3)
The conductive layer 3 has conductivity, and has a function of suppressing electromagnetic waves from entering the electronic circuit 40 covered by the shield film 1 from outside and preventing electromagnetic waves from the electronic circuit 40 from being emitted to the outside. ing.

  The conductive layer 3 is not particularly limited, such as a metal thin film layer formed by vapor deposition and sputtering, or a metal foil formed by rolling or electrolysis, but is preferably a conductive particle-containing resin layer. Thereby, it becomes possible to suppress the cracking of the conductive layer during the press punching process as compared with the metal thin film layer.

  When the conductive layer 3 is a conductive particle-containing resin layer, the conductive particles used for the conductive layer 3 are silver coated copper particles obtained by performing silver plating on carbon, silver, copper, nickel, solder, aluminum, and copper powder, A filler obtained by performing metal plating on resin balls, glass beads, or the like, or a mixture of these particles is used. As the conductive particles, it is preferable to use silver-coated copper or nickel that is relatively inexpensive and has excellent conductivity and is highly reliable.

  The blending ratio of the conductive particles to the resin depends on the shape of the particles and the like, but in the case of silver-coated copper particles, the lower limit relative to 100 parts by weight of the resin is preferably 100 parts by weight, and more preferably. Is preferably 200 parts by weight. Moreover, it is preferable that the upper limit of the silver coat copper particle with respect to 100 weight part of resin shall be 1500 weight part, More preferably, it is good to set it as 1000 weight part. In the case of nickel particles, the lower limit for 100 parts by weight of the resin is preferably 150 parts by weight, and more preferably 300 parts by weight. Further, the upper limit value of nickel particles with respect to 100 parts by weight of the resin is preferably 2000 parts by weight, and more preferably 1000 parts by weight. The shape of the conductive particles may be spherical, needle-like, fiber-like, flake-like, or dendritic.

  When the conductive layer 3 is a conductive particle-containing resin layer, examples of the resin used for the conductive layer 3 include epoxy resins having a molecular weight of 1,000 to 2,000,000, phenoxy resins, urethane resins, silicone resins, styrene resins, polyamide resins, Examples include, but are not limited to, polyimide resins, polyester resins, and acrylic resins.

  Examples of the metal material when the conductive layer 3 is a metal thin film layer or a metal foil include copper, aluminum, silver, and gold.

  The upper limit of the thickness of the conductive layer 3 is preferably 100 μm, more preferably 80 μm, and further preferably 50 μm. The lower limit of the thickness of the conductive layer 3 is preferably 0.01 μm, more preferably 1 μm, and even more preferably 10 μm. A thickness exceeding 100 μm is not preferable because it is contrary to the purpose of reducing the height, and a thickness less than 0.01 μm is not preferable because the shielding properties are deteriorated.

(Shield container 10: conductive adhesive layer 4)
The conductive adhesive layer 4 is laminated on the conductive layer 3 and has an adhesive property to an attachment site including the ground pattern 22 of the printed circuit board 20. The conductive adhesive layer 4 is formed by containing conductive particles in an adhesive material. As the conductive particles used for the conductive adhesive layer 4, silver-coated copper particles obtained by applying silver plating to carbon, silver, copper, nickel, solder, aluminum and copper powder, and further, metal plating is applied to resin balls and glass beads. The applied particles or a mixture of these particles is used. As the conductive particles, it is preferable to use silver-coated copper particles or nickel, which are relatively inexpensive and have excellent conductivity, and have high reliability.

  As an adhesive material used for the conductive adhesive layer 4, an adhesive having adhesiveness at room temperature is preferable. Examples of the adhesive include acrylic, rubber, silicon, and urethane. Among these, acrylic adhesives are preferable in terms of durability and price. In addition, it is not limited to an adhesive, The adhesive agent joined by hardening may be sufficient. Adhesives include polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, polyimide, rubber, acrylic, phenoxy, and other thermoplastic resins, phenol, epoxy, and urethane. , Melamine-based, alkyd-based, and phenoxy-based thermosetting resins.

  The upper limit of the thickness of the conductive adhesive layer 4 is preferably 100 μm, more preferably 80 μm, and even more preferably 50 μm. The lower limit of the thickness of the conductive adhesive layer 4 is preferably 1 μm, more preferably 5 μm, and even more preferably 10 μm. A thickness exceeding 100 μm is not preferable because it is contrary to the purpose of reducing the height, and a thickness of less than 1 μm is not preferable because adhesiveness deteriorates.

(Shield container 10: release film 5)
The release film 5 is peelably laminated on the conductive adhesive layer 4 and has electrical insulation, and is peeled off leaving a portion covering the exposed surface of the electronic circuit 40. The release film 5 is not particularly limited as long as it has releasability with respect to the conductive adhesive layer 4. For example, silicon or a non-silicon melamine release agent or acrylic release agent is coated. PET film or the like can be used.

  The upper limit of the thickness of the release film 5 is preferably 100 μm, more preferably 75 μm, and still more preferably 50 μm. Further, the lower limit of the thickness of the release film 5 is preferably 1 μm, more preferably 2 μm, and even more preferably 5 μm. A thickness exceeding 100 μm is not preferable because it is contrary to the purpose of reducing the height, and a thickness of less than 1 μm is not preferable because the insulating properties deteriorate.

(Shield container 10: insulating layer 2)
The insulating layer 2 is laminated on the surface of the conductive layer 3 opposite to the laminated side of the conductive adhesive layer 4. The insulating layer 2 is preferably made of high elongation PET, but is not particularly limited as long as it has insulating properties. For example, it may consist of another cover film or an insulating resin coating layer. The cover film is made of engineering plastic. For example, polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimide, polyimideamide, polyetherimide, polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), and the like can be given. An inexpensive polyester film is preferable when heat resistance is not required, and a polyphenylene sulfide film is preferable when flame resistance is required, and a polyimide film is preferable when heat resistance is required. The insulating resin may be an insulating resin, and examples thereof include a thermosetting resin or an ultraviolet curable resin. Examples of the thermosetting resin include a phenol resin, an acrylic resin, an epoxy resin, a melamine resin, a silicone resin, and an acrylic modified silicone resin. Examples of the ultraviolet curable resin include epoxy acrylate resins, polyester acrylate resins, and methacrylate-modified products thereof. The curing form may be any of thermosetting, ultraviolet curing, electron beam curing, etc., as long as it can be cured.

  The upper limit of the thickness of the insulating layer 2 is preferably 150 μm, more preferably 100 μm, and still more preferably 50 μm. The lower limit of the thickness of the insulating layer 2 is preferably 1 μm, more preferably 2 μm, and even more preferably 5 μm. A thickness exceeding 150 μm is not preferable because it is contrary to the purpose of reducing the height, and a thickness of less than 1 μm is not preferable because the insulating properties deteriorate.

(Manufacturing method of shield container 10)
A method for manufacturing the shield container 10 will be described. In addition, although the case where conductive particle containing resin is used for the conductive layer 3 is demonstrated here, it is not limited to this. First, the manufacturing method of the shield film 1 used for the shield container 10 is demonstrated.

  First, the insulating layer 2 is extrusion-molded by a T-die method or the like to form a film. Conductive particle-containing resin is applied to the film-like insulating layer 2 to form the conductive layer 3. Separately from this, the conductive resin layer 4 is formed by applying a resin containing conductive particles to the release film 5 formed by extrusion. Thereafter, by laminating these two laminates, the shield film 1 in which the insulating layer 2, the conductive layer 3, the conductive resin layer 4, and the release film 5 are sequentially laminated is formed.

  The shield film 1 formed as described above is wound into a roll shape and sequentially stamped into the shape of the shield container 10. Specifically, as shown in FIG. 3, the shield film 1 wound around a roll is sequentially sent out to a concave mold 200 having a concave portion 200 a that is concave in the shape of the shield container 10. And the convex mold 201 fitted to the recessed part 200a is pressed with respect to the shield film 1 on the concave mold 200 by cold working. Thereby, the accommodating part 11 is formed in convex shape. Although not shown, at the time of pressing, the shield film 1 around the housing portion 11 is cut by the convex mold 201 to form the flange portion 12.

  Moreover, as shown in FIG. 4, the cutting auxiliary | assistant part 5a is formed in the peeling film 5 with the cutter 202 provided in the convex mold 201 at the time of a press. The cutting assisting part 5a is formed at the boundary between the flange part 12 and the accommodating part 11 in the shield container 10 (periphery of the open surface of the accommodating part 11). Specifically, the cutter 202 penetrates the release film 5 and reaches the conductive adhesive layer 4. In addition, the whole cutting | disconnection auxiliary | assistant part 5a may be formed in a half cut shape, and may be formed in a perforation. Thus, peeling of the peeling film 5 in the collar part 12 can be assisted by the cutting assistance part 5a. That is, as shown in FIG. 5, when the shield container 10 is mounted, the release film 5 on the flange 12 is peeled off from the shield container 10 using the cutting assisting part 5a, and the release film 5 is peeled off. The shield container 10 is bonded to the printed circuit board 20 by the adhesiveness of the conductive adhesive layer 4 thus exposed.

  In the above detailed description, the present invention has been described mainly with respect to characteristic parts so that the present invention can be more easily understood. However, the present invention is not limited to the embodiments described in the above detailed description, and other implementations are possible. It can also be applied to forms and its scope should be interpreted as widely as possible.

  The terms and terminology used in the present specification are used to accurately describe the present invention, and are not used to limit the interpretation of the present invention. Moreover, it would be easy for those skilled in the art to infer other configurations, systems, methods, and the like included in the concept of the present invention from the concept of the invention described in this specification. Accordingly, the description of the claims should be regarded as including an equivalent configuration without departing from the technical idea of the present invention. In addition, in order to fully understand the object of the present invention and the effects of the present invention, it is desirable to fully consider the literatures already disclosed.

(Modification)
For example, in this embodiment, the inner space is hermetically sealed by the shield container 10 in order to protect the electronic circuit 40 from humidity and the like in addition to the function of shielding electromagnetic waves, but is not limited thereto. For example, as shown in FIG. 6, the communication hole 13 may be formed in the housing portion 11 of the shield housing 10. The communication hole 13 is formed so as to penetrate the housing portion 11 so as to communicate the space in the housing portion 11 with the outside.

  The communication hole 13 may be formed when the shield film is manufactured. That is, the communication hole 13 may be formed in a portion of the shield film that covers the exposed surface of the electronic circuit, and may be formed so as to penetrate in the layer thickness direction.

  The diameter of the communication hole 13 is preferably designed according to the wavelength of the electromagnetic wave radiated from the electronic circuit and the wavelength of the electromagnetic wave received from the outside by the shield container 10. The reason for this is that, as shown in FIGS. 11A, 11B, and 11C, with respect to the “KEC electric field shielding effect” and the “KEC electromagnetic shielding effect”, there are no pinhole size diameters of 0.10 mm, 0.62 mm, and 1.00 mm. When measuring 1 hole, 4 holes, and 9 holes, the “KEC electromagnetic shielding effect” shows almost the same value in all cases, but for the “KEC electric field shielding effect”, the pinhole size diameter is This is because different values are shown with a boundary of 0.62 mm.

  Specifically, when the pinhole size diameter is 1.00 mm, the KEC electric field shielding effect is 82 dB with “no hole” in the vicinity of 50 MHz, and “9 holes” has a large difference of 73 dB. However, when the pinhole size diameters are 0.62 mm and 0.10 mm, “no hole” and “9 holes” indicate substantially the same value of 80 dB. As a result, if the pinhole size diameter is 0.62 mm or less, the “KEC electric field shielding effect” and the “KEC electromagnetic shielding effect” are effective even when there are a plurality of pinholes (punching holes). This is because the result is obtained.

  A method for measuring the “KEC electric field shielding effect” and the “KEC electromagnetic shielding effect” will be described. Shield film consisting of a transfer film thickness of 50 μm, a protective layer thickness of 5 μm, a metal thin film layer thickness of 0.1 μm, and an anisotropic conductive adhesive layer of 10 μm (product name: SF-PC5500-C) Prepared. And using this shield film, the sample size is 15 cm × 15 cm, the opening shape is circular, the opening diameter is 1.00 mm, 0.62 mm, 0.10 mm, the numerical aperture is 1, 4, and 9, respectively. A square plate-shaped measurement piece was created. If the numerical aperture is 1, the opening is placed in the center of the measurement piece. If the numerical aperture is 4 or 9, the center of the measurement piece is They were arranged in a 1.5 cm wide grid pattern with apexes. Each measurement piece was sandwiched between cells to generate electromagnetic waves, the electric field passing through the material was received on the other side, and the attenuation due to the passage was measured to measure the electric field shielding effect and the electromagnetic shielding effect.

DESCRIPTION OF SYMBOLS 1 Shield film 2 Insulating layer 3 Conductive layer 4 Conductive adhesive layer 5 Release film 10 Shield accommodating body 11 Accommodating part 11a Accommodating space 12 Gutter part 13 Communication hole 20 Printed circuit board 21 Signal pattern 22 Ground pattern 30 Electronic component 40 Electronic circuit 100 Print Circuit board 200 Concave die 200a Concave portion 201 Convex die 202 Cutter 300 Electronic device

Claims (9)

A shield container that suppresses electromagnetic wave intrusion and electromagnetic wave radiation of the electronic circuit by covering an exposed surface of the electronic circuit mounted on a printed circuit board,
A conductive layer, a conductive adhesive layer laminated on the conductive layer and having adhesiveness to an attachment site including a ground pattern of the printed circuit board, and a conductive layer that can be peeled off and electrically insulated. And having a release film that is peeled off leaving a portion covering the exposed surface of the electronic circuit,
A housing part that is formed into a three-dimensional shape that houses the electronic circuit, and the release film is disposed on the surface of the electronic circuit side;
A shield container having a flange part disposed at a peripheral edge of the housing part so as to correspond to the attachment site.   The shield container according to claim 1, wherein the conductive adhesive layer has adhesiveness at room temperature.   Furthermore, it has the insulating layer laminated | stacked on the surface on the opposite side to the lamination | stacking side of the said electroconductive contact bonding layer in the said conductive layer, The shield container of Claim 1 or 2 characterized by the above-mentioned.   The shield container according to any one of claims 1 to 3, wherein the conductive layer is a conductive particle-containing resin layer.   5. The device according to claim 1, further comprising a cutting auxiliary portion that is formed at a boundary between the collar portion and the housing portion and assists the peeling of the release film on the collar portion side from the boundary. The shield container described in 1.   The shield container according to any one of claims 1 to 5, further comprising a communication hole that is formed in the housing part and communicates the space in the housing part with the outside.   A printed circuit board comprising the shield container according to any one of claims 1 to 6.   An electronic apparatus comprising the printed circuit board according to claim 7. A conductive layer, a conductive adhesive layer laminated on the conductive layer and having adhesiveness to an attachment site including a ground pattern of the printed circuit board, and a conductive layer that can be peeled off and electrically insulated. By punching a shield film having a release film that is peeled off leaving a portion covering the exposed surface of the electronic circuit,
A housing part that is formed into a three-dimensional shape that houses the electronic circuit, and the release film is disposed on the surface of the electronic circuit side;
A collar portion disposed on a peripheral edge portion of the accommodating portion so as to correspond to the attachment site;
A shield characterized in that it is formed at a boundary between the flange and the housing, and a shield container having a cutting assisting portion for assisting the peeling of the release film on the flange side from the boundary is formed. A method for manufacturing a container.

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