CN107770944A - Circuit board and its manufacture method with electro-magnetic screen function - Google Patents
Circuit board and its manufacture method with electro-magnetic screen function Download PDFInfo
- Publication number
- CN107770944A CN107770944A CN201610671190.9A CN201610671190A CN107770944A CN 107770944 A CN107770944 A CN 107770944A CN 201610671190 A CN201610671190 A CN 201610671190A CN 107770944 A CN107770944 A CN 107770944A
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- coating
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- circuit board
- electro
- conductive hole
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A kind of circuit board with electro-magnetic screen function, including circuit board body, it is arranged on the electro-magnetic screen layer of circuit board body outer surface and the insulating cement being filled between the circuit board body and electro-magnetic screen layer, the circuit board body includes a basic unit and is separately positioned on the first line layer and the second line layer of basic unit's upper and lower surface, the electro-magnetic screen layer is by the insulating cement directly against located at the first line layer, outside second line layer, the electro-magnetic screen layer is aluminium, the outermost layer of the electro-magnetic screen layer includes film coating layer, the film coating layer is that the electro-magnetic screen layer is exposed to one layer of fine and close aluminum oxide film that air rapid oxidation forms.The present invention also provides a kind of manufacture method of the circuit board with electro-magnetic screen function.
Description
Technical field
The present invention relates to a kind of circuit board, more particularly to a kind of circuit board and its manufacturer with electro-magnetic screen function
Method.
Background technology
During common electronic device works, because operating voltage, the interval of electric current or continuity change frequently can lead to
Its internal electronic element produces the electromagnetic radiation energy of certain frequency, so as to be radiated in the environment around it, so as to its phase
Adjacent electronic component formed interference, even result in the adjacent electronic component can not normal work.And disappearing with middle high-order
Requirement of the expense property electronic product for quality is higher, and more and more higher is cured in its requirement to electromagnetic shielding.
By the way that in circuit board, locally increase radome realizes electromagnetic shielding, it passes through outside circuit board common electronic equipment
Layer is sticked electromagnetic shielding film or copper foil prevents the purpose of electromagnetic radiation to reach.However, if circuit board outer layer sets electromagnetism
Screened film is typically the film coating layer for using one layer of Ag and being arranged on Ag outer layers；It is if same using copper foil as electro-magnetic screen layer
Sample needs to set film coating layer outside copper foil to prevent copper from aoxidizing in atmosphere.So using electromagnetic shielding film described above or
Person's copper foil realizes that the electromagnetic shielding of circuit board is required to additionally set film coating layer, so not only make it that cost of manufacture is higher,
And the thickness of circuit board is also add, it is unfavorable for the slimming of circuit board.
The content of the invention
In view of this, a kind of cost of present invention offer is cheap, processing procedure is easy and more frivolous one kind has electromagnetic shielding
The circuit board and its manufacture method of function.
A kind of circuit board with electro-magnetic screen function, including circuit board body, it is arranged on circuit board body outer surface
Electro-magnetic screen layer and the insulating cement being filled between the circuit board body and electro-magnetic screen layer, the circuit board body include
One basic unit and the first line layer and the second line layer for being separately positioned on basic unit's upper and lower surface, the electro-magnetic screen layer lead to
The insulating cement is crossed directly against outside the first line layer, the second line layer, the electro-magnetic screen layer is aluminium, the electricity
The outermost layer of magnetic masking layer includes film coating layer, and the film coating layer is that the electro-magnetic screen layer is exposed to the rapid oxygen of air
Change the one layer of fine and close aluminum oxide film formed.
Further, the electro-magnetic screen layer includes the first coating being attached at outside first line layer and is attached at described
Second line layer is outer with the first coating interval and the second coating for being oppositely arranged, is offered on first coating
The first conductive hole, the second conductive hole connected through its upper and lower surface and with the first line layer, on second coating
Offer the 3rd conductive hole, the 4th conductive hole for running through its upper and lower surface and being connected with second line layer.
Further, first conductive hole is located at one end of first coating, the 4th conductive hole with it is described
First conductive hole shape is identical and is staggered positioned at one end of the second coating with first conductive hole.
Second conductive hole is located at the side of first conductive hole, and the 3rd conductive hole is conductive positioned at the described 4th
Hole side, second conductive hole is identical with the 3rd conductive hole shape and is oppositely arranged.
Second conductive hole in the 3rd conductive hole with being filled with conductive material, and the conductive material is by tin, copper
Or the material composition that other electric conductivities are good, the conductive material is exposed to outer external end edge and the electro-magnetic screen layer
Outermost layer is non-coplanar.
The via hole through its upper and lower surface is offered in the basic unit, the first line layer and the second line layer pass through
The via hole is electrically connected.
Circuit board body surface of the present invention is provided with electro-magnetic screen layer, and the electro-magnetic screen layer uses aluminium.
So that the electro-magnetic screen layer, which exposes aerial outermost layer meeting rapid oxidation, forms one layer as the thin of aluminum oxide film
Film coating layer, without additionally increasing by one layer of other protective layer outside the electro-magnetic screen layer, so that described in this case
Function circuit board with electromagnetic shielding is with more frivolous on the basis of good capability of electromagnetic shielding.Further, because described in
Aluminium price is low, ductility is good so that the flexility of the electro-magnetic screen layer is good, cost is cheap, so that tool described in this case
There is the circuit board cost of the function of electromagnetic shielding lower.
A kind of manufacture method of the circuit board with electro-magnetic screen function, comprises the following steps：
One first coating and the second coating are provided, and in a side surface of first coating and the second coating
Be sticked an insulation glue-line respectively；
First coating is punched, so as to form the first conductive hole, punching described second on first coating
Coating, so as to form the 4th conductive hole on second coating；
One basic unit and formation the first copper foil and the second copper foil on basic unit's opposite sides surface are provided；
First copper foil, the second copper foil are etched, and first line layer is formed in basic unit by drilling, die cutting techniques
With the second line layer, so as to be made circuit board body；
First coating, the circuit board body, the second coating are combined successively so that the circuit board
Body between first coating and second coating and first coating and the second coating formed with
One side surface of insulation glue-line is relative with first line layer, the second line layer respectively；
First coating, the second coating are fitted in into the circuit board body respectively by the insulation glue-line
On first line layer, the second line layer, press first coating and the second coating and cause the insulating cement laminar flow, fill out
It is charged in the circuit board body, and is finally formed by curing the insulating cement；
By laser, perforate forms the second conductive hole and the 3rd conductive hole on first coating and the second coating；
Conductive material, the outer rim of conductive material and first aluminium are filled in second conductive hole and the 3rd conductive hole
The upper surface of paper tinsel and the second aluminium foil is not concordant.
Further, first coating and the second coating are aluminium, first coating and the second coating
Rapid oxidation forms film coating layer in atmosphere with the insulation glue-line opposite side surface that is sticked.
First conductive hole and the 4th conductive hole cut to be formed by UV.First conductive hole covers through described first
The upper and lower surface and insulation glue-line of cap rock, upper and lower surface and the insulation of the 4th conductive hole through second coating
Glue-line.
The via hole through its upper and lower surface is offered in the basic unit, the first line layer and the second line layer pass through
The via hole conducting.
In the manufacture method of the function circuit board with electromagnetic shielding of the present invention, first coating and second
Coating just uses aluminium, and first coating, the second coating are outer to form one layer of oxidation by rapid oxidation in atmosphere
Aluminium film so that extra protective layer need not be further added by outside the first coating and the second coating, not only simplify processing procedure,
Production cost is reduced, and make it that the circuit board with electro-magnetic screen function is more lightening.
Brief description of the drawings
The sectional view of circuit board with electro-magnetic screen function described in the embodiment of the present invention shown in Fig. 1.
Fig. 2-9 show the manufacture method schematic flow sheet of the circuit board of the present invention with electro-magnetic screen function.
Main element symbol description
| Circuit board with electro-magnetic screen function | 100 |
| Circuit board body | 10 |
| Basic unit | 11 |
| Via hole | 101 |
| First line layer | 12 |
| First copper foil | 12a |
| Second copper foil | 13a |
| Second line layer | 13 |
| First through hole | 120 |
| Second through hole | 130 |
| Electro-magnetic screen layer | 20 |
| First coating | 21 |
| Second coating | 22 |
| Film coating layer | 210 |
| Insulating cement | 30 |
| First conductive hole | 211 |
| Second conductive hole | 212 |
| 3rd conductive hole | 221 |
| 4th conductive hole | 222 |
| Conductive material | 40 |
Following embodiment will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is carried out clear
Chu, it is fully described by, it is clear that described embodiment only a part of embodiment of the present invention, rather than whole realities
Apply mode.Based on the embodiment in the present invention, those of ordinary skill in the art institute under the premise of creative work is not made
The every other embodiment obtained, belongs to the scope of protection of the invention.
The noun of locality " first " used herein, " second " are the position definition so that first substrate described in the used time,
And do not limit.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
As shown in figure 1, a kind of circuit board 100 with electro-magnetic screen function of the present invention includes a circuit board body
10th, it is arranged on the electro-magnetic screen layer 20 of the outer surface of circuit board body 10 and is filled in the circuit board body 10 and electromagnetic shielding
Insulating cement 30 between layer 20.
The circuit board body 10 is that flexible PCB (FPC) or Rigid Flex (R-FLEX) etc. need to carry out electromagnetic screen
The circuit structure covered.The circuit board body 10 includes a basic unit 11 and is separately positioned on the First Line of the upper and lower surface of basic unit 11
The line layer 13 of road floor 12 and second.
The via hole 101 through its upper and lower surface is offered in the basic unit 11.The quantity of the via hole 101 is more
Individual, the quantity of the via hole 101 is set according to the line requirements of circuit board body 10.The shape of the via hole 101 is according to system
Journey sets the shape of a variety of and each via hole 101 can be with identical or different.The line layer 13 of first line layer 12 and second
Turned on by the via hole 101.
The insulating cement 30, which is contained between the circuit board body 10 and the electro-magnetic screen layer 20, is filled in described lead
In through hole 101, and fill up the first line layer 12, the gap of the second line layer 13.
The electro-magnetic screen layer 20 is made up of aluminium.The electro-magnetic screen layer 20 includes the first coating 21 and with described the
The second coating 22 that one coating 21 interval is oppositely arranged.First coating 21 is attached at institute by the insulating cement 30
State outside first line layer 12, second coating 22 is attached at outside second line layer 13 by the insulating cement 30.Institute
The outermost surface for stating the first coating 21 and the second coating 22 is respectively formed thin film coating layer 210, for being electromagnetically shielded
Protective effect.The film coating layer 210 formed for the electro-magnetic screen layer 20 exposed to rapid oxidation in atmosphere one
The fine and close aluminum oxide film of layer.Pass through in itself because the film coating layer 210 is the first coating 21 and the second coating 22
Oxidation and converted, therefore first coating 21 and second covering when film coating layer 210 are formed after
The thickness of itself of layer 22 can't change.
Further, offered on first coating 21 through thereon, lower surface and with the first line layer 12
The first conductive hole 211, the second conductive hole 212 of connection.Offered on second coating 22 through its upper and lower surface simultaneously
The 3rd conductive hole 221 and the 4th conductive hole 222 connected with second line layer 13.First conductive hole 211 is located at institute
State one end of the first coating 21, the 4th conductive hole 222 is identical with the shape of the first conductive hole 211 and the second coating
22 one end is staggered with first conductive hole 211.Second conductive hole 212 is located at first conductive hole 211
Side, the 3rd conductive hole 221 is located at the side of the 4th conductive hole 222, and second conductive hole 212 and the 3rd is conductive
The shape of hole 221 is identical and is oppositely arranged.Second conductive hole 212, the 3rd conductive hole 221 interlock with the via hole 101
Set.
Further, the cross section of first conductive hole 211 and the 4th conductive hole 222 is rectangular.Described second
The cross section of conductive hole 212 and the 3rd conductive hole 221 is trapezoidal, outermost layer court of its aperture from the electro-magnetic screen layer 20
It is gradually reduced to the direction of circuit board body 10.
Further, second conductive hole 212 in the 3rd conductive hole 221 with being filled with conductive material 40.Institute
Conductive material 40 is stated by tin, copper or the good material composition of other electric conductivities.The conductive material 40 is exposed to outside
External end edge and the electro-magnetic screen layer 20 outermost layer it is non-coplanar.
In the present invention, the surface of circuit board body 10 is provided with electro-magnetic screen layer 20, and the electro-magnetic screen layer
20 use aluminium.So that it is oxygen that the electro-magnetic screen layer 20, which exposes aerial outermost layer meeting rapid oxidation to form one layer,
Change the film coating layer 210 of aluminium film.Because the film coating layer 210 is the first coating 21 and the second coating 22 itself
By oxidation and converted, therefore first coating 21 and second after film coating layer 210 are formed
The thickness of itself of coating 22 can't change.This case is other without being additionally further added by one layer outside the electro-magnetic screen layer 20
Protective layer so that base of the circuit board 100 with good capability of electromagnetic shielding with electro-magnetic screen function described in this case
It is more frivolous on plinth.Further, because the aluminium price is low, ductility is good so that the flexility of the electro-magnetic screen layer 20
Well, cost is cheap, so that the circuit board cost with electro-magnetic screen function is lower described in this case.
As shown in figs. 2-9, the preparation method that this case provides the circuit board with electro-magnetic screen function, including following step
Suddenly：
Step 1：As shown in Figure 2, there is provided one first coating 21 and the second coating 22, and in first coating
21 and second a side surface of coating 22 be sticked respectively an insulation glue-line 30a.
The coating 22 of first coating 21 and second is aluminium, the coating 22 of first coating 21 and second with
Being sticked, rapid oxidation forms film coating layer 210 in atmosphere for insulation glue-line 30a opposite side surface.The film coating
One layer of fine and close aluminum oxide film that layer forms for the electro-magnetic screen layer exposed to air rapid oxidation.Because the film drapes over one's shoulders
Coating 210 is the first coating 21 and the second coating 22 itself by oxidation and converted, therefore when forming the film
The thickness of itself of first coating 21 and the second coating 22 can't change after coating layer 210
Step 2：As shown in figure 3, punching first coating 21, so as to form the on first coating 21
One conductive hole 211, second coating 22 is punched, so as to form the 4th conductive hole 222 on second coating 22.
In the embodiment of the present invention, the conductive hole 222 of the first conductive hole 211 and the 4th cuts to be formed by UV.Described
One conductive hole 211 runs through through the upper and lower surface and insulation glue-line 30a, the 4th conductive hole 222 of first coating 21
The upper and lower surface of second coating 22 and the insulation glue-line 30a.
Step 3：As shown in Figure 4, there is provided a basic unit 11 and formed the opposite sides surface of basic unit 11 the first copper foil 12a
With the second copper foil 13a.
Step 4：As shown in figure 5, by etching the first copper foil 12a, the second copper foil 13a, and by drilling, being punched
Etc. technology, first line layer 12 and the second line layer 13 are formed in basic unit 11, so as to which the circuit board body 10 be made.
The via hole 101 through its upper and lower surface is offered in the basic unit 11.The line of first line layer 12 and second
Road floor 13 is turned on by the via hole 101.The quantity of the via hole 101 is multiple, the quantity foundation of the via hole 101
Circuit board line demand is set.The shape of the via hole 101 sets the shape of a variety of and each via hole 101 according to processing procedure
It is identical or different.
Step 5：As shown in fig. 6, by the first coating 21 described above, the circuit board body 10, the second coating 22
Be combined successively so that the circuit board body 10 between first coating 21 and second coating 22 and
The coating 22 of first coating 21 and second formed with insulation glue-line 30a a side surface respectively with the circuit board body
10 first line layer 12, the second line layer 13 are relative.
Step 6：As shown in fig. 7, first coating 21, the second coating 22 are passed through into 30a points of the insulation glue-line
It is not fitted on the line layer 13 of first line layer 12 and second of the circuit board body 10, presses the He of the first coating 21
Second coating 22 causes the insulation glue-line 30a flowings, filled into the circuit board body 10, and is finally formed by curing institute
State insulating cement 30.
Step 7：As shown in figure 8, by laser perforate on the coating 22 of the first coating 21 and second, so that
Form the second conductive hole 212 and the 3rd conductive hole 221.
Step 8：As shown in figure 9, conductive material 40 is filled in the conductive hole 221 of the second conductive hole 212 and the 3rd,
The outer rim of conductive material 40 and the upper surface of the coating 22 of the first coating 21 and second be not concordant.
In the manufacture method of the circuit board of the present invention with electro-magnetic screen function, first coating 21 and
Two coatings 22 just use aluminium, are formed outside first coating 21, the second coating 22 by rapid oxidation in atmosphere
One layer of aluminum oxide film.Because the film coating layer 210 is the first coating 21 and the second coating 22 passes through oxidation in itself
And it is converted, therefore first coating 21 and the second coating 22 after film coating layer 210 are formed
The thickness of itself can't change.It need not be further added by outside first coating 21 described in this case and the second coating 22 extra
Protective layer, not only simplify processing procedure, reduce production cost, and make it that the circuit board with electro-magnetic screen function is more frivolous
Change.
It is understood that for the person of ordinary skill of the art, it can be conceived with the technique according to the invention and done
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection of claim of the invention
Scope.
Claims (10)
1. a kind of circuit board with electro-magnetic screen function, including circuit board body, the electricity for being arranged on circuit board body outer surface
Magnetic masking layer and the insulating cement being filled between the circuit board body and electro-magnetic screen layer, the circuit board body include one
Basic unit and the first line layer and the second line layer for being separately positioned on basic unit's upper and lower surface, it is characterised in that：The electricity
By the insulating cement directly against outside the first line layer, the second line layer, the electro-magnetic screen layer is magnetic masking layer
Aluminium, the outermost layer of the electro-magnetic screen layer include film coating layer, and the film coating layer exposes for the electro-magnetic screen layer
In one layer of fine and close aluminum oxide film that air rapid oxidation forms.
2. there is the circuit board of electro-magnetic screen function as claimed in claim 1, it is characterised in that：The electro-magnetic screen layer includes patch
The first coating outside first line layer and it is attached at outside second line layer and the first coating interval and phase
To the second coating of setting, offer on first coating through its upper and lower surface and connected with the first line layer
The first conductive hole, the second conductive hole, offer on second coating through its upper and lower surface and with second circuit
The 3rd conductive hole, the 4th conductive hole of layer connection.
3. there is the circuit board of electro-magnetic screen function as claimed in claim 2, it is characterised in that：First conductive hole is located at institute
One end of the first coating is stated, the 4th conductive hole is identical with the described first conductive hole shape and positioned at the one of the second coating
End is staggered with first conductive hole.
4. there is the circuit board of electro-magnetic screen function as claimed in claim 2, it is characterised in that：Second conductive hole is located at institute
The side of the first conductive hole is stated, the 3rd conductive hole is located at the 4th conductive hole side, second conductive hole and the 3rd
Conductive hole shape is identical and is oppositely arranged.
5. there is the circuit board of electro-magnetic screen function as claimed in claim 4, it is characterised in that：Second conductive hole with it is described
It is filled with conductive material in 3rd conductive hole, the conductive material is by tin, copper or the good material group of other electric conductivities
Into the conductive material is non-coplanar exposed to the outermost layer of outer external end edge and the electro-magnetic screen layer.
6. there is the circuit board of electro-magnetic screen function as claimed in claim 1, it is characterised in that：Offer and run through in the basic unit
The via hole of its upper and lower surface, the first line layer and the second line layer are electrically connected by the via hole.
7. the manufacture method of the circuit board with electro-magnetic screen function as described in claim 1-6 item any one, including it is as follows
Step：
One first coating and the second coating are provided, and distinguished in a side surface of first coating and the second coating
Be sticked an insulation glue-line；
First coating is punched, so as to form the first conductive hole, punching second covering on first coating
Layer, so as to form the 4th conductive hole on second coating；
One basic unit and formation the first copper foil and the second copper foil on basic unit's opposite sides surface are provided；
First line layer and the second line layer is made in first copper foil, the second copper foil, so as to which circuit board body be made；
First coating, the circuit board body, the second coating are combined successively so that the circuit board body
Between first coating and second coating and first coating and the second coating are formed with insulation
One side surface of glue-line is relative with first line layer, the second line layer respectively；
First coating, the second coating are fitted in the first of the circuit board body respectively by the insulation glue-line
On line layer, the second line layer, press first coating and the second coating and cause the insulating cement laminar flow, filling extremely
In the circuit board body, and finally it is formed by curing the insulating cement；
By laser, perforate forms the second conductive hole and the 3rd conductive hole on first coating and the second coating；
Fill conductive material in second conductive hole and the 3rd conductive hole, the outer rim of conductive material and first aluminium foil and
The upper surface of second aluminium foil is non-coplanar.
8. the manufacture method of the circuit board with electro-magnetic screen function as claimed in claim 7, it is characterised in that：Described first covers
Cap rock and the second coating are aluminium, and first coating and the second coating and the insulation glue-line opposite side surface that is sticked are equal
Rapid oxidation forms film coating layer in atmosphere.
9. there is the manufacture method of electromagnetic shielding circuit board as claimed in claim 7, it is characterised in that：First conductive hole and
4th conductive hole cuts to be formed by UV, and first conductive hole runs through the upper and lower surface and insulating cement of first coating
Layer, upper and lower surface and the insulation glue-line of the 4th conductive hole through second coating.
10. there is the manufacture method of electromagnetic shielding circuit board as claimed in claim 7, it is characterised in that：Opened up in the basic unit
There is the via hole through its upper and lower surface, the first line layer and the second line layer are turned on by the via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610671190.9A CN107770944A (en) | 2016-08-15 | 2016-08-15 | Circuit board and its manufacture method with electro-magnetic screen function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610671190.9A CN107770944A (en) | 2016-08-15 | 2016-08-15 | Circuit board and its manufacture method with electro-magnetic screen function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107770944A true CN107770944A (en) | 2018-03-06 |
Family
ID=61260940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610671190.9A Pending CN107770944A (en) | 2016-08-15 | 2016-08-15 | Circuit board and its manufacture method with electro-magnetic screen function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107770944A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112153883A (en) * | 2019-06-28 | 2020-12-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board manufacturing method and circuit board |
| CN112654129A (en) * | 2019-10-10 | 2021-04-13 | 庆鼎精密电子（淮安）有限公司 | Anti-electromagnetic interference circuit board and manufacturing method thereof |
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|---|---|---|---|---|
| JPH0575219A (en) * | 1991-07-25 | 1993-03-26 | Sharp Corp | Flexible circuit board and manufacture of flexible circuit board |
| US5474834A (en) * | 1992-03-09 | 1995-12-12 | Kyocera Corporation | Superconducting circuit sub-assembly having an oxygen shielding barrier layer |
| CN101426331A (en) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board |
| CN101959395A (en) * | 2009-07-17 | 2011-01-26 | 英华达（南京）科技有限公司 | Shielding shell and surface processing method thereof |
| CN104754855A (en) * | 2013-12-31 | 2015-07-01 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
-
2016
- 2016-08-15 CN CN201610671190.9A patent/CN107770944A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575219A (en) * | 1991-07-25 | 1993-03-26 | Sharp Corp | Flexible circuit board and manufacture of flexible circuit board |
| US5474834A (en) * | 1992-03-09 | 1995-12-12 | Kyocera Corporation | Superconducting circuit sub-assembly having an oxygen shielding barrier layer |
| CN101426331A (en) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board |
| CN101959395A (en) * | 2009-07-17 | 2011-01-26 | 英华达（南京）科技有限公司 | Shielding shell and surface processing method thereof |
| CN104754855A (en) * | 2013-12-31 | 2015-07-01 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112153883A (en) * | 2019-06-28 | 2020-12-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board manufacturing method and circuit board |
| CN112654129A (en) * | 2019-10-10 | 2021-04-13 | 庆鼎精密电子（淮安）有限公司 | Anti-electromagnetic interference circuit board and manufacturing method thereof |
| CN112654129B (en) * | 2019-10-10 | 2021-11-16 | 庆鼎精密电子（淮安）有限公司 | Anti-electromagnetic interference circuit board and manufacturing method thereof |
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Effective date of registration: 20190111 Address after: 223065 No. 11 Honghai North Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Qing Ding precision electronic (Huaian) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518105 Yanchuan Yanluo Road, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. |
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Application publication date: 20180306 |