CN204230234U - Distribution component - Google Patents
Distribution component Download PDFInfo
- Publication number
- CN204230234U CN204230234U CN201420492814.7U CN201420492814U CN204230234U CN 204230234 U CN204230234 U CN 204230234U CN 201420492814 U CN201420492814 U CN 201420492814U CN 204230234 U CN204230234 U CN 204230234U
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- Prior art keywords
- base material
- distribution component
- conductor
- straight angle
- diaphragm
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Insulated Conductors (AREA)
Abstract
The utility model provides a kind of distribution component, and it reliably can connect for the wiring substrate etc. of connecting object, can guarantee good conducting state.Distribution component (1) has: many straight angle conductors (2), and they are arranged in plane; Dielectric film (3a, 4a), it is pasted onto straight angle conductor (2) from two faces of arrangement plane except at least one side of straight angle conductor (2); Strengthen base material (14), it is for the straight angle conductor (2) of at least one side, utilizes bonding agent (16) to be pasted onto the side, a face of arrangement plane; And diaphragm (17); it has micro-adhesiveness bond layer (17a); by micro-adhesiveness bond layer (17a) be pasted onto strengthen in base material (14) with on the face of straight angle conductor (2) opposition side; diaphragm has than strengthening the large profile of base material (14), and when overlooking, its circumference (17c) is configured in outside compared with strengthening the circumference (14a) of base material.
Description
Technical field
The utility model relates to a kind of distribution component of the distribution for electronic equipment etc.
Background technology
As carrying out the distribution component of high density distribution and known following distribution component in the space limited, this distribution component has: many conductors, and they are spaced across regulation; And coating layer, it is made up of the insulating properties adhesive tape fixed integratedly in the mode of the sandwich from arrangement plane by conductor.As bonding reinforcement base material on the known conductor exposed in end of an example of distribution component, thus form the structure of the connecting portion be connected with the wiring substrate etc. of connecting object.(for example, referring to patent documentation 1).
Patent documentation 1: Japanese Unexamined Patent Publication 2013-4706 publication
The connecting portion of above-mentioned distribution component, under the state that wiring substrate with connecting object etc. is overlapping, utilizes stamping machine to carry out punching press, thus is bonded to connecting object and is connected.
But, if on distribution component punching press connecting portion, then sometimes from strengthen base material overflow bonding agent can be attached to the stamping surface of stamping machine.So when the stamping surface of stamping machine moves and opens, reinforcement base material or distribution component move together with stamping surface.Thus, likely to peel off from distribution component or bonding between distribution component and connecting object becomes insufficient and produce poor flow owing to strengthening base material.
Utility model content
The purpose of this utility model is to provide a kind of distribution component, and this distribution component reliably can be connected with the wiring substrate etc. of connecting object, can guarantee good conducting state.
Distribution component of the present utility model has:
Many conductors, they are arranged in plane;
Dielectric film, it is except at least one side of described conductor, is pasted onto described conductor from two faces of arrangement plane;
Base material, it is for the described conductor of at least described end side, utilizes bonding agent to be pasted onto the side, a face of described arrangement plane; And
Diaphragm, it has micro-adhesiveness bond layer, by described micro-adhesiveness bond layer be pasted onto described base material with on the face of described conductor opposition side,
Described diaphragm has profile large compared with described base material, and when overlooking, its circumference is configured in outside compared with the circumference of described base material.
Utility model effect
According to the utility model, reliably can be connected with the wiring substrate etc. of connecting object, good conducting state can be guaranteed.
Accompanying drawing explanation
Fig. 1 is the vertical view of an execution mode of the distribution component represented involved by the utility model.
Fig. 2 is the sectional side view of distribution component.
Fig. 3 is the sectional side view in the connecting portion of distribution component.
Fig. 4 is the A-A profile in Fig. 3.
Fig. 5 is the vertical view of the connecting portion observing distribution component from diaphragm side.
Fig. 6 is the vertical view of the connecting portion observing distribution component from release film side.
Fig. 7 is the profile observing the connecting portion between the connecting portion of distribution component and wiring substrate from the side of length direction.
Fig. 8 is the profile of situation when connecting between distribution component connecting portion and wiring substrate of observing from length direction.
Fig. 9 is the profile of situation when connecting between the connecting portion of distribution component and wiring substrate of observing from length direction.
Figure 10 is the oblique view representing the method manufacturing distribution component.
Figure 11 is the vertical view of the long flat cable of the manufacture midway representing distribution component.
Figure 12 is the vertical view of the distribution component manufacturing midway.
Figure 13 is the sectional side view of the distribution component manufacturing midway.
Figure 14 is the sectional side view of the distribution component of the manufacture midway utilizing different manufacture methods.
Figure 15 is the sectional side view of the distribution component of the manufacture midway utilizing different manufacture methods.
The explanation of label
1: distribution component
2: straight angle conductor
3a, 3b: dielectric film
11: connecting portion
14: strengthen base material
14a: the circumference strengthening base material
15: conductive paste
16: bonding agent
17: diaphragm
17a: micro-adhesiveness bonding agent
17b: counterdie
17c: the circumference of diaphragm
18: mark
19: release film
21: wiring substrate
22: the base material of wiring substrate
23: the contact of wiring substrate
Embodiment
The summary > of < execution mode of the present utility model
First, the summary of execution mode of the present utility model is described.
One execution mode of the distribution component involved by the utility model is,
(1) many conductors, they are arranged in plane;
Dielectric film, it is except at least one side of described conductor, is pasted onto described conductor from two faces of arrangement plane;
Base material, it is for the described conductor of at least described end side, utilizes bonding agent to be pasted onto the side, a face of described arrangement plane; And
Diaphragm, it has micro-adhesiveness bond layer, by described micro-adhesiveness bond layer be pasted onto described base material with on the face of described conductor opposition side,
Described diaphragm has profile large compared with described base material, and when overlooking, its circumference is configured in outside compared with the circumference of described base material.
According to the structure of (1), base material is pasted onto the conductor of the part exposed from dielectric film, the conductor of this part can be made overlapping with wiring substrate of connecting object etc., and utilize stamping machine to connect.At base material with on the face of conductor opposition side, be pasted with diaphragm, this diaphragm has the profile larger than base material, and when overlooking its circumference be configured in compared with the circumference of base material outside.Therefore, even if the bonding agent of bonding base material and conductor overflows to the outside of base material when utilizing stamping machine to carry out punching press, diaphragm also can be utilized to prevent bonding agent to be attached to stamping machine.Thereby, it is possible to reliably connected by the wiring substrate etc. of this distribution component relative to connecting object, good conducting state can be guaranteed.
(2) in another side, face of described arrangement plane relative with described base material and cover the position of described conductor, be provided with the release film not having bond layer, described release film is pasted by described micro-adhesiveness bond layer and described diaphragm.
According to the structure of (2), the conductor before connecting to connecting object can be protected.Being pasted on diaphragm because release film does not have bond layer by micro-bond layer, therefore, can easily peeling off this release film when carrying out the connection operation to connecting object.In addition, when peeling off release film, even if be coated with bonding agent, conductive paste etc. on conductor, it also can not be made to peel off.
(3) at described diaphragm with on the face of described micro-adhesiveness bond layer opposition side, be provided with the mark of the position representing described conductor.
According to the structure of (3), by making the aligned in position of the contact of mark and connecting object, thus on contact, making conductor quickly and reliably locate, good conducting state can be obtained.
The detailed content > of < execution mode of the present utility model
Below, with reference to accompanying drawing, the example of the execution mode of the distribution component involved by the utility model is described.In addition, the utility model is not limited to these illustrative structures, comprises by being equal to claims and all changes in Claims scope shown in claims.
Fig. 1 is the vertical view of the execution mode representing distribution component.Fig. 2 is the sectional side view of distribution component.
As shown in Figures 1 and 2, distribution component 1 has the many straight angle conductors (example of conductor) 2 be made up of the rolled copper foil of such as copper (comprising copper facing) or copper alloy.These straight angle conductors 2 are arranged in plane with the also trestle column of regulation, on two faces of the arrangement plane of straight angle conductor 2, except at least one side of straight angle conductor 2 (in this example except both end sides), be pasted with (lamination) dielectric film 3a, 3b respectively.Distribution component 1 has many straight angle conductors 2 is arranged in same plane shape, and from the both sides of its arrangement plane lamination dielectric film 3a, 3b and the form of the flat cable formed respectively.In addition, the example with 4 straight angle conductors 2 shown in Figure 1, but the radical of straight angle conductor 2 can suitably change.Such as, also straight angle conductor 2 can be set as 20.
Dielectric film 3a, 3b have the base material part formed by the resin of polyethylene terephthalate, polyester, polyimides or polyphenylene sulfide etc. and the adhesive linkage be made up of polyesters bonding agent or flame-proof polyvinyl chloride class insulating properties bonding agent, fire retardant polyolefin etc.Two dielectric films 3a, 3b make the face of adhesive linkage relatively be pasted onto on straight angle conductor 2.Thus, the electric insulation between straight angle conductor 2 is realized.
Fig. 3 is the sectional side view of the connecting portion of distribution component.Fig. 4 is the A-A profile in Fig. 3.
As shown in Figures 3 and 4, the two ends of the length direction of distribution component 1 as connecting portion 11, this connecting portion 11 be straight angle conductor 2 not by dielectric film 3a, 3b cover part, be connected with wiring substrate 21 grade of connecting object described later at this part place straight angle conductor 2.
In connecting portion 11, straight angle conductor 2 does not paste dielectric film 3a, 3b, but straight angle conductor 2 exposes from dielectric film 3a, 3b.In connecting portion 11, a face of arrangement plane is pasted with and strengthens base material (example of base material) 14, thus, straight angle conductor 2 is configured on a face of reinforcement base material 14 side by side.Strengthen base material 14 to be formed by insulating resins such as polyethylene terephthalate (PET).
On reinforcement base material 14, the face of configuration straight angle conductor 2 side is coated with bonding agent 16.Thus, strengthen base material 14 by the end of bonding agent 16 and the dielectric film 3a of side and straight angle conductor 2 mutually bonding.As bonding agent 16, such as, can use polyester-type thermoplastic's bonding agent.
In each straight angle conductor 2 that end is exposed, this exposed portion at least partially on be coated with conductive paste 15.Conductive paste 15 is made up of conducting particles and bonding agent.As conducting particles, such as silver powder, carbon powder, copper powders, nickel by powder or their mixed-powder etc. can be used.As forming the bonding agent of this conductive paste 15, can be used any one in such as polyesters bonding agent, polyurethanes bonding agent, epoxies bonding agent etc.Particularly, preferably adopt as conductive paste 15 that to comprise average grain diameter be the flakey silver powder of 0.5 to 5 μm and be less than or equal to the silver paste of spherical silver powder of 20nm in the organic average grain diameter of surface-coated.By in silver paste containing nano-Ag particles, thus reduce contact resistance, in addition, surface concavo-convex diminishes thus connection area becomes large.Therefore, the reliability of electrical connection improves.
In addition, in connecting portion 11, strengthen base material 14 with the face of straight angle conductor 2 opposition side on be pasted with diaphragm 17.This diaphragm 17 such as has the counterdie 17b and micro-adhesiveness bond layer 17a that are made up of resins such as polyethylene terephthalate (PET).By this micro-adhesiveness bond layer 17a, diaphragm 17 is pasted onto on reinforcement base material 14 to hold flaky state.
Fig. 5 is the vertical view of the connecting portion observing distribution component from diaphragm side.
As shown in Figure 5, have when this diaphragm 17 is overlooked than strengthening the large profile of base material 14.Diaphragm 17 is pasted onto strengthens on base material 14 in the mode being configured in outside compared with the circumference 14a making its circumference 17c and strengthen base material 14.
In addition, in diaphragm 17 with on the face of micro-adhesiveness bond layer 17a opposition side (that is, counterdie 17b expose face), be provided with the mark 18 of the position representing straight angle conductor 2.Mark 18 by implementing painted and arranging on diaphragm 17.In addition, as this telltale mark 18, also can arrange by forming otch.In addition, the shape marking 18 also can be round shape, wire.Mark 18 in this example is arranged on the position overlapping with each straight angle conductor 2 when overlooking.As long as the shape of the position of mark 18 identifiable design straight angle conductors 2, position, also can not be positioned at the position overlapping with straight angle conductor 2.
As shown in Figures 3 and 4, in connecting portion 11, on another face of arrangement plane, relative with strengthening base material 14 and the position covering straight angle conductor 2 is provided with the release film 19 not having bond layer.In addition, Fig. 6 is the vertical view of the connecting portion observing distribution component from release film side.This release film 19 is made up of resins such as such as polyethylene terephthalate (PET), is set to the size with diaphragm 17 equal extent.A part for the periphery of this release film 19 is pasted onto on the periphery of micro-adhesiveness bond layer 17a of diaphragm 17.Thus, utilize on connecting portion 11 keep release film 19, the straight angle conductor 2 in coated reinforcement base material 14 expose side.
(connection between distribution component and connecting object)
The connecting portion 11 of the distribution component 1 formed in the above described manner is connected with the wiring substrate etc. of connecting object.With reference to Fig. 7 and Fig. 8, this method of attachment is described.Fig. 7 is the profile of situation when connecting between the connecting portion of distribution component and wiring substrate of observing from the side of length direction.Fig. 8 is the B-B profile of Fig. 7, is the drawing in side sectional elevation of state when connecting between the connecting portion of distribution component and wiring substrate of observing from length direction.
The wiring substrate 21 of connecting object has substrate 22 and contact 23, and this contact 23 is made up of the conductive pattern be arranged on this base material 22.The width dimensions of contact 23 is roughly the same with the straight angle conductor 2 of flat cable 1 with spacing.
When the connecting portion 11 of distribution component 1 is connected to wiring substrate 21, first, release film 19 is peeled off from connecting portion 11.Now, because release film 19 does not have adhesive-applying, therefore easily from connecting portion 11 strip off.In addition, the conductive paste 15 be coated on straight angle conductor 2 can not be peeled off together with release film 19.
Then, as shown in Figure 7, by the connecting portion 11 of distribution component 1 with to strengthen the opposition side of base material 14 overlapping towards the wiring substrate 21 loaded on the downside stamping surface 26 of stamping machine 25.Now, the counterdie 17b side of diaphragm 17 upward.Diaphragm 17 is provided with the mark 18 of the position representing straight angle conductor 2, therefore, with this mark 18 for benchmark, makes the straight angle conductor 2 of connecting portion 11 and the aligned in position of the contact 23 of wiring substrate 21, thus, straight angle conductor 2 is reliably located in contact 23.In addition; if configure connecting portion 11 in the above described manner on wiring substrate 21; the part outstanding from the surrounding strengthening base material 14 then in diaphragm 17 contacts with wiring substrate 21, and micro-adhesiveness bond layer 17a of this part is mutually bonding with smaller adhesion with wiring substrate 21.
As shown in Figure 8, after making connecting portion 11 be configured in the assigned position of wiring substrate 21 thus, the upside stamping surface 27 of stamping machine 25 is declined, utilize downside stamping surface 26 and upside stamping surface 27 clamp and heat while the connecting portion that pressurizes.Like this, strengthen bonding agent 16 melting of base material 14 base material 22 to wiring substrate 21 and press, the state that the base material 22 and strengthening becoming wiring substrate 21 is filled by bonding agent 16 between base material 14.In addition, in this condition, be coated in the conductive paste 15 on straight angle conductor 2 to be touched to the contact 23 of wiring substrate 21 by conquassation.
Now, the bonding agent 16 of melting, sometimes to the surrounding's spilling strengthening base material 14, utilizes diaphragm 17 to prevent this bonding agent 16 from sticking on the stamping surface 27 of upside.Further, in diaphragm 17 from the surrounding strengthening base material 14 outstanding be partly adhered to wiring substrate 21, therefore, when utilizing stamping machine 25 to pressurize, prevent connecting portion 11 from offseting relative to wiring substrate 21 position.
Afterwards, if remove heating and pressurize and make bonding agent 16 harden, then the reinforcement base material 14 of the connecting portion 11 of distribution component 1 is bonding with wiring substrate 21 by bonding agent 16.Thereafter, diaphragm 17 is peeled off from wiring substrate 21 and reinforcement base material 14 and removes.
Fig. 9 illustrates the connecting portion between the distribution component 1 after removing diaphragm 17 and wiring substrate 21.Because diaphragm 17 utilizes the smaller adhesion of micro-adhesiveness bond layer 17a to carry out bonding, therefore, it is possible to easily peel off diaphragm 17 relative to wiring substrate 21 and reinforcement base material 14.Connecting portion place between distribution component 1 and wiring substrate 21, makes connecting portion 11 overlapping with wiring substrate 21, thus straight angle conductor 2 and contact 23 are via conductive paste 15 conducting, and in addition, reinforcement base material 14 and base material 22 are undertaken bonding by bonding agent 16.
Thus, the connecting portion 11 of distribution component 1 is heated and pressurizes and be connected to wiring substrate 21, thus the contact 23 of the straight angle conductor 2 and wiring substrate 21 that are coated with conductive paste 15 is reliably connected with the state of conducting.
(manufacturing the method for distribution component)
Below, the method for the distribution component 1 manufacturing above-mentioned structure is described.
Figure 10 is the oblique view representing the method manufacturing distribution component.Figure 11 represents the vertical view of the long flat cable of the manufacture midway of distribution component.Figure 12 is the vertical view of the distribution component manufacturing midway.Figure 13 is the sectional side view of the distribution component manufacturing midway.Figure 14 is the sectional side view of the distribution component of the manufacture midway utilizing different manufacture methods.Figure 15 is the sectional side view of the distribution component of the manufacture midway utilizing different manufacture methods.
As shown in Figure 10, from the multiple spools 30 being wound with long straight angle conductor 2 respectively, send straight angle conductor 2, and be arranged on same plane with the also trestle column of regulation.Further, make to send from spool 31 long dielectric film 3a, 3b between heated mandrel 32, and while dielectric film 3a, 3b are heated, and press against and be pasted onto on the positive and negative of these straight angle conductors 2, forming long flat cable.This long flat cable is wound on take up roll 33.A part for the length direction of dielectric film 3a, 3b is formed fenestrate portion 35.Dielectric film 3a, 3b paste in the mode making each window portion 35 and align.The window portion 35 of the flat cable of such formation becomes connecting portion 11.
Below, as shown in figure 11, in order to remove the remainder (being called the part of ear) of the Width of dielectric film 3a, 3b, cutting off with the position shown in chain-dotted line C1 at long flat cable.Thus, at the Width two ends in window portion 35, the position that removing dielectric film 3a, 3b are connected in the longitudinal direction.
Further, the position of long flat cable shown in the chain-dotted line C2 of the central authorities by window portion 35 is cut off, as shown in FIG. 12 and 13, form the length of regulation and the distribution component 1 that exposes at two ends place of straight angle conductor 2.
In addition, also can not form window portion 35 in advance and manufacture long flat cable, remove the remainder of the Width of dielectric film 3a, 3b of this long flat cable, and after carrying out further cutting off and forming the distribution component 1 of specific length, part near the two ends of the two ends of this distribution component 1 removing dielectric film 3a, 3b.
In this case, as shown in figure 14, dielectric film 3a, 3b of part near the two ends of distribution component 1 is cut off from its positive and negative cutter 37, as shown in figure 15, dielectric film 3a, 3b of being positioned at end side compared with place of incision is pulled out and remove.
On a face of the straight angle conductor 2 exposed at the two ends place of distribution component 1, paste the reinforcement base material 14 being coated with bonding agent 16.Now, will strengthen on base material 14 end that is pasted onto the dielectric film 3a of side and straight angle conductor 2.By silk screen printing or transfer printing, in the exposed portion of straight angle conductor 2, go up coating electrically conductive cream 15 at least partially.
Thereafter, connecting portion 11 reinforcement base material 14 with bonding protective film 17 on the face of straight angle conductor 2 opposition side, make its circumference 17c be positioned at the outside of circumference 14a strengthening base material 14.And then, in the mode exposing side covering the straight angle conductor 2 strengthened in base material 14, release film 19 is pasted onto on diaphragm 17 with diaphragm 17 opposition side at connecting portion 11.
As previously discussed, distribution component 1 involved according to the present embodiment, connecting portion 11 is overlapping with wiring substrate 21 and pressurize, thus bonding agent 16 can be utilized to make reinforcement base material 14 bonding with the base material 22 of wiring substrate 21, make contact 23 conducting of straight angle conductor 2 and wiring substrate 21.
Now, in connecting portion 11 strengthen base material 14 with on the face of straight angle conductor 2 opposition side, be pasted with the diaphragm 17 larger with strengthening profile compared with base material 14, the circumference 17c of diaphragm 17 is configured in outside than the circumference 14a strengthening base material 14.Therefore; when connecting portion 11 being connected utilizing stamping machine 25 to pressurize with wiring substrate 21; even if bonding agent 16 overflows laterally from the circumference 14a strengthening base material 14, this bonding agent can not be attached to the upside stamping surface 27 of stamping machine 25 and be attached on diaphragm 17.Thus, can prevent bonding agent 16 upwards side blow pressure surface 27 adhere to.
Thus, following problem can be eliminated, namely, when the upside stamping surface 27 of stamping machine 25 rises, the connecting portion 11 of distribution component 1 peels off from wiring substrate 21 because bonding agent moves together with upside stamping surface 27, or bonding insufficient between connecting portion 11 with wiring substrate 21 and produce poor flow.Thereby, it is possible to reliably connected relative to wiring substrate 21 by distribution component 1, guarantee good conducting state.
In addition, because the circumference 17c of diaphragm 17 is configured in outside compared with strengthening the circumference 14a of base material 14, when wiring substrate 21 configures connecting portion 11, the circumference 17c of diaphragm 17 pastes with wiring substrate 21 due to micro-adhesiveness bond layer 17a.Thus, when utilizing stamping machine 25 to pressurize, connecting portion 11 can be made relative to wiring substrate 21 not deviation position and reliably configuring, the good conducting state of the contact 23 of straight angle conductor 2 and wiring substrate 21 can be guaranteed.
In addition; owing to being provided with the mark 18 for positioning for wiring substrate 21 on diaphragm 17, therefore, by making the aligned in position of the contact 23 of this mark 18 and wiring substrate 21; thus on contact 23, reliably location straight angle conductor 2 can be cut rapidly, good conducting state can be obtained.
In addition, due in connecting portion 11 with diaphragm 17 opposition side on be pasted with release film 19, therefore, it is possible to protection connect to wiring substrate 21 before straight angle conductor 2 side of connecting portion 11.Further, because release film 19 does not have bond layer, and bonding with micro-adhesiveness bond layer 17a of diaphragm 17 and keep, therefore, when peeling off this release film 19, can prevent conductive paste 15 grade of coating on straight angle conductor 2 from being peeled off such problem.In addition, there is no need must on straight angle conductor 2 coating electrically conductive cream 15.In this case, by utilizing release film 19 to cover straight angle conductor 2, thus can prevent from scratching the problems such as straight angle conductor 2.
Claims (3)
1. a distribution component, it has:
Many conductors, they are arranged in plane;
Dielectric film, it is except at least one side of described conductor, is pasted onto described conductor from two faces of arrangement plane;
Base material, it is for the described conductor of at least described end side, utilizes bonding agent to be pasted onto the side, a face of described arrangement plane; And
Diaphragm, it has micro-adhesiveness bond layer, by described micro-adhesiveness bond layer be pasted onto described base material with on the face of described conductor opposition side,
Described diaphragm has the profile larger than described base material, and when overlooking, its circumference is configured in outside compared with the circumference of described base material.
2. distribution component according to claim 1, wherein,
In another side, face of described arrangement plane, relative with described base material and cover the position of described conductor, be provided with the release film not having bond layer,
Described release film is pasted by described micro-adhesiveness bond layer and described diaphragm.
3. distribution component according to claim 1 and 2, wherein,
At described diaphragm with on the face of described micro-adhesiveness bond layer opposition side, be provided with the mark of the position representing described conductor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013178635A JP2015050206A (en) | 2013-08-29 | 2013-08-29 | Wiring member |
| JP2013-178635 | 2013-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204230234U true CN204230234U (en) | 2015-03-25 |
Family
ID=52700016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420492814.7U Active CN204230234U (en) | 2013-08-29 | 2014-08-28 | Distribution component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2015050206A (en) |
| CN (1) | CN204230234U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106207532A (en) * | 2015-04-30 | 2016-12-07 | 住友电气工业株式会社 | Distribution component |
| CN113632180A (en) * | 2019-03-29 | 2021-11-09 | 株式会社自动网络技术研究所 | Wiring member |
| CN114600326A (en) * | 2019-10-28 | 2022-06-07 | 株式会社自动网络技术研究所 | Fixing structure of wiring member and wiring member with joint member |
-
2013
- 2013-08-29 JP JP2013178635A patent/JP2015050206A/en active Pending
-
2014
- 2014-08-28 CN CN201420492814.7U patent/CN204230234U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106207532A (en) * | 2015-04-30 | 2016-12-07 | 住友电气工业株式会社 | Distribution component |
| CN113632180A (en) * | 2019-03-29 | 2021-11-09 | 株式会社自动网络技术研究所 | Wiring member |
| US11942242B2 (en) | 2019-03-29 | 2024-03-26 | Autonetworks Technologies, Ltd. | Wiring member |
| CN114600326A (en) * | 2019-10-28 | 2022-06-07 | 株式会社自动网络技术研究所 | Fixing structure of wiring member and wiring member with joint member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015050206A (en) | 2015-03-16 |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |