JP2012033704A - Electromagnetic wave shield method of electronic component using electromagnetic wave shield film for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield method of an electronic component using an electromagnetic wave shield film which is easily connected with a ground pattern, allows visual confirmation of the inside after being stuck and is excellent in shielding property and durability.SOLUTION: The electromagnetic wave shield method of an electronic component is for blocking electromagnetic waves by covering the surface of the electronic component mounted inside an electronic apparatus with an electromagnetic wave shield film. For the electromagnetic wave shield film, a conductor layer having a numerical aperture of 30% or higher is formed on an adhesive resin layer, and the conductor layer is embedded in the resin layer so as to expose the surface of at least a part of the conductor layer. The surface where the conductor layer is formed of the electromagnetic wave shield film is directly stuck to the ground pattern.

Description

  The present invention relates to an electromagnetic wave shielding method for an electronic component using an electromagnetic wave shielding film that covers an electronic component mounted inside an electronic device and shields an electromagnetic wave and has translucency and adhesiveness.

  Conventionally, there is an electromagnetic wave shielding film that shields electromagnetic waves by covering an electronic component such as a specific LSI (integrated circuit) mounted inside an electronic device such as a mobile phone or a digital camera (Patent Document 1). The electromagnetic wave shielding film is formed, for example, by forming a metal layer on the surface of a resin film by fusion or plating of a metal foil, vapor deposition of a metal thin film, or the like. And by absorbing and reflecting electromagnetic waves by the metal layer, it is possible to prevent malfunctions caused by electromagnetic waves generated from other components inside the electronic device and electromagnetic waves from the outside. On the contrary, leakage of electromagnetic waves to the outside can be prevented without affecting other components inside the electronic device.

JP 2003-60387 A

  As electronic parts are highly integrated and compact in electronic devices, the amount of electromagnetic waves generated from the electronic parts is also increasing. In such a situation, it is necessary to connect to a ground pattern in order to shield electromagnetic waves efficiently. In order to connect the electromagnetic wave shielding layer to the ground pattern, for example, a conductive paste material, a conductive tape, a solder connection, an anisotropic conductive film, and the like are separately required, resulting in an increase in material cost and process cost. In addition, in the configuration where the surface of the conductive film is insulated or the film is pasted, in order to expose the conductive part, masking a part of the surface, coating, screen printing, etc. Therefore, it is necessary to form a part that is not coated, which further increases the material cost and the process cost.

  Moreover, since the conventional conductive film is opaque, it is difficult to confirm the inside of a film after bonding. Therefore, after the films are bonded, the lot number (lot No.) etc. marked on the chip or the like may not be confirmed. In addition, when there is an abnormality in the continuity test or the like, the conductive film may have to be peeled off in order to identify the abnormal part.

  The present invention has been made in view of such conventional problems, and can be easily connected to a ground pattern. The electromagnetic wave shielding film can be visually confirmed after bonding and has excellent shielding properties and durability. The present invention provides an electromagnetic wave shielding method for an electronic component using the above.

The present invention relates to the following.
1. An electromagnetic wave shielding method for an electronic component in which the surface of an electronic component mounted in an electronic device is covered with an electromagnetic wave shielding film to shield the electromagnetic wave, and the electromagnetic wave shielding film is 30% on an adhesive resin layer. The conductor layer of the electromagnetic wave shielding film in which the conductor layer having the above opening ratio is formed and the conductor layer is embedded in the resin layer so that at least a part of the surface of the conductor layer is exposed is the ground pattern. An electromagnetic wave shielding method, characterized by being bonded to a substrate.
2. The conductor layer embedded and formed so that at least a part of the surface of the conductor layer is exposed in the adhesive resin layer has an overall cross-sectional shape or a trapezoidal upper part of the cross-sectional shape, and the conductor layer The electromagnetic wave shielding method according to 1 above, wherein at least a part of the upper surface or the trapezoidal shape is exposed from the resin layer, and the other part is embedded in the resin layer.
3. 3. The electromagnetic wave shielding method according to 1 or 2 above, wherein the height of the trapezoidal portion having a cross-sectional shape of the conductor layer is 0.1 to 10 μm and the side surface angle is in the range of 30 ° to 80 °.
4). The cross-sectional shape of the conductor layer has an upper part of the trapezoidal shape part and a lower part having a semicircular part that is continuous with this part and is wider than this part and curved downward, and the conductor layer has at least a part of its upper surface. 4. The electromagnetic wave shielding method according to any one of the above 1 to 3, wherein the electromagnetic wave shielding method is exposed from the resin layer and at least a portion below the maximum width is embedded in the resin layer.
5. The electromagnetic wave shield according to any one of 1 to 4 above, wherein the ratio (T2 / L) of the thickness (T2) of the conductor layer above the maximum width to the maximum width (L) of the conductor layer is in the range of 0.01 to 2. Method.
6). 6. The electromagnetic wave shielding method according to any one of 1 to 5, wherein the conductor layer has a thickness of 0.1 to 100 μm and a width of 1 to 50 μm.
7). 7. The electromagnetic wave shielding method according to any one of 1 to 6, wherein the resin layer has a thickness in the range of 0.5 to 100 μm.
8). 8. The electromagnetic wave shielding method according to any one of 1 to 7, wherein an insulating material is further formed on the surface of the electromagnetic wave shielding film on which the pattern of the conductor layer is formed so that at least a part of the pattern is exposed.

  According to the present invention, by directly forming the conductive circuit pattern of the conductive layer having a high aperture ratio on the resin layer, the surface on which the conductive circuit pattern is formed can be bonded to the ground pattern as it is. Therefore, the conductive circuit pattern can be electrically connected by being in contact with the ground pattern, and the resin layer exposed at the opening of the conductive circuit pattern is in close contact with the ground pattern. Power can be secured. As a result, the close contact with the ground pattern and the electrical connection can be made at the same time, so that no other material for the connection and a process for forming it are unnecessary. If the resin layer is an adhesive layer, it can be easily pressure-bonded at room temperature or at a temperature of 100 ° C. or lower.

  Further, in the electromagnetic wave shielding method according to the present invention, since it has an aperture ratio of 30% or more and has transparency, for example, a lot number (lot No.) described by marking or the like on a part is not removed. .) Can be confirmed. In addition, when an abnormality occurs in a continuity test or the like, the abnormal part can be confirmed without removing the electromagnetic shielding film.

The schematic diagram of the cross section which bonded together the surface in which the conductor layer of the electromagnetic wave shielding film was formed on the surface of the electronic component mounted in the electronic device of this invention to the ground pattern of the electronic component. In FIG. 1, an electromagnetic wave shielding film in which an insulating material is formed on the surface of the electromagnetic wave shielding film on which the conductor layer pattern is formed is exposed and bonded to the ground pattern of the electronic component. FIG. The perspective view which cut off some conductor layer patterns. Sectional drawing of the width direction of the conductor layer shown in FIG.3 (b). Sectional drawing of the other example of the width direction of the conductor layer shown in FIG.3 (b). Sectional drawing of the width direction of a conductor layer. Sectional drawing of the width direction of a conductor layer. The fragmentary sectional view which shows the state by which the conductor layer is embed | buried under the resin layer. The fragmentary sectional view which shows the state by which the conductor layer is embed | buried under the resin layer. The perspective view which shows an example of the electroconductive base material for plating. AA sectional drawing of FIG. Sectional drawing which shows an example of the process which shows the manufacturing method of the electroconductive base material for plating. The partial cutaway perspective view which shows an example of a base material with a conductor layer pattern. Sectional drawing which shows the second half of the preparation examples of the base material with a conductor layer pattern.

An example of an electromagnetic wave shielding method for electronic parts using the electromagnetic wave shielding film of the present invention is shown in FIGS.
In FIG. 1, a conductive layer having an opening ratio of 30% or more is formed on a resin layer having adhesiveness, and the conductive layer is embedded in the resin layer so that at least a part of the surface of the conductive layer is exposed. It is the schematic diagram of the cross section which bonded the surface in which the conductor layer of the electromagnetic wave shielding film was formed on the surface of the electronic component mounted in the electronic device to the ground pattern of the electronic component using the electromagnetic wave shielding film. FIG. 2 shows an electromagnetic wave shielding film in which an insulating material is formed so that the ground pattern portion of the electronic component is exposed on the surface of the electromagnetic wave shielding film on which the conductor layer pattern is formed. It is a schematic diagram of a combined cross section.
When the electromagnetic wave is absorbed by the electromagnetic wave shielding layer, it is necessary to connect the electromagnetic wave shielding layer and an electric member having a ground potential. An adhesive layer is formed on the film substrate, and a conductor pattern in which the conductor layer is embedded is formed so that at least a part of the surface of the conductor layer having an opening is exposed on the adhesive layer. The surface on which the pattern is formed may be bonded as it is so as to cover the electronic component and connected to the ground pattern (FIG. 1), or the conductor layer is exposed only at the portion connected to the ground pattern, and the other portions May be connected to the ground pattern in the same manner after an insulating layer is formed, such as by coating with a resin or attaching a film (FIG. 2).

  For the connection with the ground pattern, for example, a method in which the portion bonded to the ground pattern is pressure-bonded with a head is preferable, but the resin layer has adhesiveness and can be easily bonded, so this is limited to this. is not. The temperature of the head is preferably from room temperature (20 ° C.) to about 100 ° C., particularly preferably from room temperature to about 50 ° C. Since the electromagnetic wave shielding film has adhesiveness, it can be bonded even when the temperature of the head is normal temperature, but the initial adhesion becomes higher when the film is bonded at a higher temperature. On the other hand, when the pressure bonding temperature is too high, the flow of the pressure-sensitive adhesive increases and the pattern may be disconnected.

The electromagnetic wave shielding film according to the present invention is a substrate with a conductor layer pattern in which a conductor layer having an opening ratio of 30% or more is formed on an adhesive resin layer. A substrate including a layer and a conductor layer are included, and the conductor layer is arranged in a pattern on the surface of the substrate.
FIG. 13 is a partially cutaway perspective view (schematic diagram) showing an example of a conductor layer patterned substrate according to the present invention. In the substrate 50 with a conductor layer pattern, a conductor layer 54 is embedded on the surface of a substrate 53 having a resin layer 52 on a support substrate 51.

The substrate 53 is preferably transparent in consideration of application of the substrate with a conductor layer pattern to an electronic component or the like. At this time, the substrate with a conductor layer pattern (electromagnetic wave shielding film) according to the present invention preferably has transparency particularly in the visible region, and generally has a total light transmittance of 90% or more.
The base material has a resin layer for embedding the conductor layer on the side of the surface where the conductor layer is embedded.
The resin layer may be a thermoplastic resin, but may be a curable resin, and has adhesiveness for sticking property. The tackiness may be one that develops tackiness by raising the temperature without tackiness at normal temperature. The curable resin may or may not be cured, and the resin may be cured after using the substrate with a conductor layer pattern.
Moreover, it is preferable that this resin layer is laminated | stacked on the support base material, However, You may comprise the base material only with the resin layer.

Examples of the supporting substrate include a plate made of plastic, a plastic film, a plastic sheet, and the like.
Plastics include polystyrene resin, acrylic resin, polymethyl methacrylate resin, polycarbonate resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyethylene resin, polypropylene resin, polyamide resin, polyamideimide resin, polyetherimide resin, polyetheretherketone Resin, polyarylate resin, polyacetal resin, polybutylene terephthalate resin, thermoplastic polyester resin such as polyethylene terephthalate resin, cellulose acetate resin, fluororesin, polysulfone resin, polyethersulfone resin, polymethylpentene resin, polyurethane resin, diallyl phthalate Examples thereof include thermoplastic resins such as resins and thermosetting resins. Among plastics, polyethylene terephthalate resin, polystyrene resin, acrylic resin, polymethyl methacrylate resin, polycarbonate resin, and polyvinyl chloride resin, which are excellent in transparency, are preferably used.

As the support substrate, a plastic film is preferable. The plastic film includes polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate, polyolefins such as polyethylene, polypropylene, polystyrene, and EVA, vinyl resins such as polyvinyl chloride and polyvinylidene chloride, polysulfone, and polyethersulfone. A film made of plastic such as phon, polycarbonate, polyamide, polyimide, acrylic resin, etc., having a total visible light transmittance of 70% or more is preferable. These can be used as a single layer, but may be used as a multilayer film in which two or more layers are combined. Among the plastic films, a polyethylene terephthalate film or a polycarbonate film is particularly preferable from the viewpoints of transparency, heat resistance, ease of handling, and cost.
Although there is no restriction | limiting in particular in the thickness of the said plastic film, The thing of 1 mm or less is preferable, and when it is too thick, there exists a tendency for visible light transmittance | permeability to fall easily. In consideration of the fact that if the film is too thin, the handleability deteriorates, the thickness of the plastic film is more preferably 5 to 500 μm, and further preferably 50 to 200 μm.
These base materials such as plastic films are transparent for use as electromagnetic wave shielding films for preventing leakage of electromagnetic waves from electronic components mounted in electronic devices (that is, transparent base materials). Is preferred.

As the resin for forming the resin layer, a thermoplastic resin or a curable resin is used as described above.
Typical examples of the thermoplastic resin include the following. For example, natural rubber, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t-butyl-1,3-butadiene, poly-1,3 -Dienes such as butadiene), polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether and polyvinyl butyl ether, polyesters such as polyvinyl acetate and polyvinyl propionate, polyurethane, ethyl cellulose , Polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, phenoxy resin, polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, poly-t-butyl Acrylate, poly-3-ethoxypropyl acrylate), polyoxycarbonyl tetramethacrylate, polymethyl acrylate, polyisopropyl methacrylate, polydodecyl methacrylate, polytetradecyl methacrylate, poly-n-propyl methacrylate, poly-3,3,5-trimethyl Poly (meth) acrylates such as cyclohexyl methacrylate, polyethyl methacrylate, poly-2-nitro-2-methylpropyl methacrylate, poly-1,1-diethylpropyl methacrylate, polymethyl methacrylate, thermoplastic polyester resins, thermoplastic polyamides Resin etc. can be used. The monomers constituting these polymers may be used as a copolymer obtained by copolymerization of two or more, if necessary, or may be used by blending two or more of the above polymers or copolymers. .

Among the curable resins, as a resin curable by active energy rays, a material in which an acrylic resin, an epoxy resin, a polyester resin, a urethane resin, or the like is used as a base polymer and a radically polymerizable or cationically polymerizable functional group is added to each of them is used. Can be illustrated. As the radical polymerizable functional group, there are carbon-carbon double bonds such as an acrylic group (acryloyl group), a methacryl group (methacryloyl group), a vinyl group, and an allyl group, and a highly reactive acrylic group (acryloyl group) is preferable. Used for. As the cationically polymerizable functional group, an epoxy group (glycidyl ether group, glycidylamine group) is representative, and a highly reactive alicyclic epoxy group is preferably used. Specific materials include acrylic urethane, epoxy (meth) acrylate, epoxy-modified polybutadiene, epoxy-modified polyester, polybutadiene (meth) acrylate, and acrylic-modified polyester. As the active energy rays, ultraviolet rays, electron beams and the like are used.
When the active energy ray is ultraviolet, photosensitizers or photoinitiators added at the time of ultraviolet curing include known materials such as benzophenone, anthraquinone, benzoin, sulfonium salt, diazonium salt, onium salt, and halonium salt. Can be used. In addition to the above materials, a general-purpose thermoplastic resin may be blended.

  Among the curable resins, thermosetting resins include natural rubber, isoprene rubber, chloroprene rubber, polyisobutylene, butyl rubber, halogenated butyl, acrylonitrile-butadiene rubber, styrene-butadiene rubber, polyisobutene, carboxy rubber, and neoprene. Sulfur, aniline formaldehyde resin, urea formaldehyde resin, phenol formaldehyde resin, ligrin resin, xylene formaldehyde resin, xylene formaldehyde resin, melamine formaldehyde resin, epoxy resin, urea resin, aniline resin, melamine resin , Phenol resins, formalin resins, metal oxides, metal chlorides, oximes, alkylphenol resins, and the like. In addition, for these purposes, additives such as general-purpose vulcanization accelerators can be used for the purpose of increasing the crosslinking reaction rate.

  As a thermosetting resin, those using a curing agent include a resin having a functional group such as a carboxyl group, a hydroxyl group, an epoxy group, an amino group, an unsaturated hydrocarbon group, an epoxy group, a hydroxyl group, an amino group, an amide group, Some are used in combination with a curing agent having a functional group such as a carboxyl group or a thiol group, or a curing agent such as a metal chloride, isocyanate, acid anhydride, metal oxide, or peroxide. In addition, for the purpose of increasing the curing reaction rate, additives such as general-purpose catalysts can be used. Specific examples include curable acrylic resin compositions, unsaturated polyester resin compositions, diallyl phthalate resins, epoxy resin compositions, polyurethane resin compositions, and the like.

Furthermore, as a thermosetting resin or a resin curable with active energy rays, an adduct of acrylic acid or methacrylic acid can be exemplified as a preferable one.
As an adduct of acrylic acid or methacrylic acid, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate, or the like can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of adhesiveness. As the epoxy acrylate, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, resorcinol (Meth) acrylic such as diglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether An acid adduct is mentioned. A polymer having a hydroxyl group in the molecule, such as epoxy acrylate, is effective in improving adhesion. These copolymer resins can be used in combination of two or more as required.

Note that a general-purpose thermoplastic resin may be blended with the thermosetting resin or the resin curable with active energy rays.
Moreover, additives, such as a plasticizer, antioxidant, a filler, a coloring agent, and an ultraviolet absorber, may be mix | blended with the resin layer.
The thickness of the resin layer needs to be at least thicker than the thickness in which the conductor layer is embedded. In order to bury the conductor layer in the resin more reliably, the thickness of the resin layer is more preferably 1.5 times or more the thickness of burying the conductor layer. Further, the thickness of the resin layer is preferably 0.5 μm or more and 100 μm or less. It is useless even if it is thicker than necessary.

  Various patterns can be used for the conductor layer, but the pattern is appropriately selected depending on the specific application. As a pattern of the conductor layer, the conductor layer itself has a linear or planar shape, and the conductor layer itself has a planar shape such as a triangle such as an equilateral triangle, an isosceles triangle, a right triangle, a square, a rectangle, Rectangles such as rhombuses, parallelograms, trapezoids, (positive) hexagons, (positive) octagons, (positive) dodecagons, (positive) dodecagons, etc. (positive) n-gons (n is an integer greater than or equal to 3) ), Geometric shapes such as circles, ellipses, stars, etc., and with conductor layers, in particular with linear or other shape conductor layers, equilateral triangles, isosceles triangles, right triangles, etc. Triangles, squares, rectangles, rhombuses, parallelograms, trapezoids, and other quadrangles, (positive) hexagons, (positive) octagons, (positive) dodecagons, (positive) n-gons ( n is an integer greater than or equal to 3), geometric figures such as circles, ellipses, and stars, or any combination of these It may be set to draw a pattern was (e.g., may be shaped as a hole of these shapes to the conductor layer on the plane). These units can be repeated alone or in combination of two or more. Moreover, the pattern of the conductor layer is preferably a mesh pattern, a stripe pattern, or a comb pattern.

The line spacing of the conductor layer is preferably in the range of 50 μm to 4000 μm. If the line interval is too small, the area of the opening is reduced, and therefore the exposed area of the adhesive is reduced, and the adhesiveness is likely to be lowered. On the other hand, when the line interval is too large, the light transmission property is improved, but the electromagnetic wave shielding property tends to be lowered. The line spacing of the conductor layer is more preferably 100 μm to 4000 μm, further preferably 200 to 2000 μm, and particularly preferably 250 to 1000 μm.
When the conductor layer pattern is complicated by a combination of geometric figures surrounded by the conductor layer, the line spacing is converted into a square area based on the repeat unit, and the length of one side Is the line spacing.

The conductor layer (A), which is an example of the conductor layer in the present invention, has a trapezoidal cross section or an upper part having a trapezoidal cross section and a lower part continuous thereto. This will be described with reference to the drawings. FIG. 3 is a perspective view in which a part of the pattern of the conductor layer 20 is cut out. FIG. 3A shows a conductor layer pattern having a trapezoidal cross-sectional shape, and FIG. 3B shows that the cross-sectional shape is continuous with the upper trapezoidal portion and this portion, and from a portion wider than this portion. It is the pattern of the conductor layer which consists of a semicircle-shaped part which becomes.
FIG. 4 is a cross-sectional view in the width direction of the conductor layer 20 shown in FIG. 3B. The cross section is continuous with the trapezoidal upper part 21 and the upper part, and the semicircular lower part 22 wider than the upper part. The base of the trapezoidal part and the part of the semicircular string of the semicircular part are integrated. In FIGS. 3B and 4, the lower part has a semicircular cross-sectional shape, but this is not restrictive. In the case as shown in FIG. 3B and FIG. 4, the shoulder portion 23 protruding from the lower base of the trapezoidal portion of the semicircular portion of the lower portion 22 can be one feature. In addition, said semicircle does not necessarily include not only the shape which cut off the perfect circle but the thing which cut off the shape which deform | transformed the ellipse or the ellipse or the perfect circle. For example, it may have a shape represented by (a), (b), or (c) in FIG. 5 (another example of a cross-sectional view in the width direction of the conductor layer shown in FIG. 3B).
3 and 4, the maximum width of the lower portion (and hence the maximum width of the conductor layer pattern) is along the plane portion, but it may be a shape having the maximum width below the shoulder portion.
Furthermore, the conductor layer pattern may have a maximum width narrower than the maximum width of the upper portion of the conductor layer pattern. The lower cross-sectional shape may be rectangular.

As a dimension of the conductor layer pattern, the thickness of the entire conductor layer pattern is preferably 0.1 to 100 μm. If the thickness is less than 1 μm, it tends to be difficult to obtain a sufficiently low resistance. If the thickness exceeds 100 μm, the resistance hardly changes. Therefore, material costs and process time increase, which is disadvantageous in terms of cost. In consideration of the above, it is more preferably 0.5 to 30 μm, and further preferably 3 to 15 μm.
In addition, the maximum width of the conductor layer pattern is preferably 1 to 50 μm in consideration of an aperture ratio of 30% or more and electromagnetic wave shielding properties. If the width of the conductor layer pattern is too narrow, the electromagnetic shielding property tends to be lowered, and if it is too wide, the visible light transmittance is lowered. In consideration of the above, the width is more preferably 5 to 30 μm.

The dimension of a conductor layer (A) is further demonstrated using drawing.
FIG. 6 shows a cross-sectional view of the conductor layer. 6A shows a trapezoidal shape, and FIG. 6B shows an upper trapezoidal part and a semicircular part (lower part) wider than the trapezoidal part. In both cases, it is preferable that the upper surface width (length of the upper side of the trapezoidal shape) L1 and the maximum width L in the cross-sectional shape of the conductor layer pattern are as follows.

The thickness (T) of the conductor layer is as described above.
In the case of the shape in FIG. 6B, the total thickness T of the trapezoidal portion (upper part) thickness T1 and the semicircular part (lower part) thickness T2 is in the range of 2 to 100 μm. Preferably, there is no further limitation on the values of T1 and T2, but in order to further improve the adhesion between the resin layer and the conductor layer pattern, T2 is preferably 0.5 μm or more, and is 1 μm or more. Is more preferable.

  The maximum width L of the conductor layer is the same as the width (L) of the conductor layer described above. In the case of the shape in FIG. 6 (b), the maximum width L of the upper side width L1 and the lower side width L2 of the upper trapezoidal part is in the above range, and the angle of the side of the trapezoidal part is as described later. If the conditions described later are satisfied, the width is not particularly limited. When the lower part is completely buried and the resin layer covers the shoulder and part of the upper part, the adhesion between the conductor layer and the resin layer is improved. From this point of view, the maximum width L and the upper part are improved. The difference in the width L2 of the lower side of the trapezoidal portion is preferably 1 μm or more. Moreover, when it is the shape in (a) or (b) of FIG. 6, it is preferable that L1 shall be 1 micrometer or more on the manufacturing method mentioned later.

  Moreover, the width | variety of the part whose cross-sectional shape of a conductor layer is trapezoid should just narrow as a whole toward an upper surface. It does not necessarily have to be narrowed at a constant gradient α as in the above-mentioned drawing, and it is sufficient that it does not spread toward the upper surface but narrows as a whole. In particular, it is preferable that there are no portions whose side surfaces are perpendicular to the top surface.

  The side surface corresponding to the trapezoidal section of the conductor layer is not necessarily a flat surface. In this case, as shown in the cross-sectional view of the conductor layer in FIG. 7, the gradient α has a trapezoidal height h and a trapezoid side width s (horizontal direction of the trapezoid side width direction). ) And formula (1)

によってαを決定する。
αは、角度で３０度以上、９０度未満が好ましく、３０度以上、８０度以下がより好ましく、３０度以上、６０度以下がさらに好ましく、４０度以上、６０度以下が特に好ましい。

Determines α.
α is preferably 30 ° or more and less than 90 °, more preferably 30 ° or more and 80 ° or less, still more preferably 30 ° or more and 60 ° or less, and particularly preferably 40 ° or more and 60 ° or less.

In FIG. 6, T2 and L are preferably T2 / L = 0.01-2.
As a result, the conductor layer has a larger spread in the thickness direction than the spread in the width direction, and the plating grows anisotropically in the thickness direction, so that the line width is reduced without increasing the surface resistance. The base material with a conductor layer pattern having such a conductor layer can realize both transparency and low resistance at a high level. In particular, the effect is remarkable in a fine pattern having a line width of 30 μm or less. When the plating grows anisotropically in the thickness direction, the cross-sectional shape approaches a circular shape as compared with the case where the plating grows isotropically. Therefore, the pattern base material with a conductor layer having such a conductor layer can improve the folding of the line due to the stress when transferring the line, and can more effectively suppress the decrease in resistance and the appearance abnormality. In particular, this effect becomes more remarkable as the plating thickness is reduced.

In the present invention, the conductor layer is preferably entirely or partially embedded in the resin layer with at least the upper surface exposed. Thereby, since the anchor effect appears, the adhesiveness to the resin layer of a conductor layer pattern improves.
8 and 9 are partial cross-sectional views showing a state where the conductor layer is embedded in the resin layer.
8A shows a state in which a part of the trapezoidal conductor layer 20 is embedded in the resin layer 24, and FIG. 8B shows the conductor while the upper surface is exposed from the resin layer 24. FIG. The state in which the entire layer 20 is embedded in the resin layer 24 is shown. FIG. 9A shows a trapezoidal portion 21 having an upper cross-section and a lower semicircular portion 22 wider than the upper portion, and a trapezoidal base of the trapezoidal portion 21 and a part of a semicircular chord of the semicircular portion 22. The state where the whole semicircular portion 22 (in the depth direction) of the lower part of the conductor layer integrated with is embedded in the resin layer 24 (the shoulder portion 23 is exposed) is shown. FIG. 9B shows a state in which a similar conductor layer is embedded in the resin layer 24 in a state where a part including the upper surface of the upper trapezoidal portion 21 is exposed from the resin layer 24. FIG. 9C shows a state in which a similar conductor layer is embedded in the resin layer 24 in a state where only the upper surface of the upper trapezoidal portion 21 is exposed from the resin layer 24. In any of these cases, the maximum width portion of the conductor layer is embedded in the resin layer 24.
Further, in the state of FIG. 8B or FIG. 9C, the resin layer 24 may be further covered so as to cover a part of the upper surface of the conductor layer 20 or the upper trapezoidal portion 21. .

The manufacturing method of the base material with a conductor layer pattern used by this invention is demonstrated below.
The base material with a conductor layer pattern according to the present invention performs (I) a conductor layer preparation step in which a conductor layer is formed by plating on a conductive base material for plating, and (II) then, on the conductive base material for plating. It is produced by a method including a transfer step of transferring the formed conductor layer to a suitable base material including a resin layer, and (III), in some cases, a step of replacing the base material with another base material. The step of embedding the conductor layer in the resin layer is performed in the transfer step or after the transfer step.

  The conductive substrate for plating (see FIG. 10) is a conductive substrate having a pattern-shaped plating forming portion, and an insulating layer is formed on the surface of the conductive substrate, and the opening direction is formed in the insulating layer. A concave portion (plating forming portion) for forming a wide plating toward is formed. The conductive material is exposed on the bottom surface of the recess. This conductive substrate for plating is a plate for plating that can be used repeatedly.

  In the present invention, the conductive material used for the conductive substrate has sufficient conductivity for depositing metal on the exposed surface by electrolytic plating, and is particularly preferably a metal. In addition, the base material has a low adhesion to the metal layer formed on it so that the metal layer formed by electrolytic plating on the surface can be transferred to the adhesive support, and can be easily peeled off. It is preferable that As such a conductive base material, stainless steel, chrome-plated cast iron, chrome-plated steel, titanium, titanium-lined material, nickel and the like are particularly preferable.

  Examples of the shape of the conductive substrate include a sheet shape, a plate shape, a roll shape, and a hoop shape. In the case of a roll, a sheet or plate attached to a rotating body (roll) may be used. In the case of a hoop shape, a configuration in which rolls are installed at two to several locations inside the hoop and a hoop-shaped conductive base material is passed through the roll can be considered. Since it is possible to continuously produce a metal foil in both a roll shape and a hoop shape, the production efficiency is higher than that in a sheet shape or a plate shape, which is preferable. When the conductive substrate is used by being wound around a roll, a conductive roll is preferably used so that the roll and the conductive substrate are easily conducted.

The insulating layer can be formed of a carbon thin film similar to diamond, a so-called diamond-like carbon (hereinafter referred to as DLC) thin film having an insulating property. The DLC thin film is particularly preferable because it is excellent in durability and chemical resistance.
Furthermore, the insulating layer can be formed of an inorganic material such as Al ₂ O ₃ or SiO ₂ .

An example of the conductive substrate will be described with reference to the drawings.
FIG. 10 is a partial perspective view showing an example of a conductive substrate for plating. FIG. 11 is a cross-sectional view taken along the line AA in FIG. FIG. 11A shows a case where the side surface of the concave portion is planar, while FIG. 11B shows a case where the side surface of the concave portion has gentle irregularities. In the conductive base material 31 for plating, an insulating layer 33 is laminated on a conductive base material 32, and a concave portion 34 is formed in the insulating layer 33, and the conductive base material 32 is formed at the bottom of the concave portion 34. Exposed. The bottom of the recess 34 may be a conductor layer that is electrically connected to the conductive substrate.
In this example, the insulating layer 33 is a square as a geometric figure, and a recess 34 is formed in a groove shape around the square.
A conductive or insulating intermediate layer (not shown) may be laminated between the conductive substrate 32 and the insulating layer 33 for the purpose of improving the adhesiveness of the insulating layer 33 or the like. Or the recessed part 34 is wide as a whole toward the opening direction. It is not always necessary that the width is constant and wide at the gradient α as in the drawing. If there is no problem in peeling off the conductor layer pattern formed by plating, the recess may have a portion whose width becomes narrower in the opening direction, but it is better not to have such a portion, It is preferable that it is not narrowed toward the opening direction but spreads as a whole. In particular, it is preferable that one side surface of the concave portion together with the opposite surface thereof has no portion that is perpendicular to the bottom surface and continues in the height direction by 1 μm or more. If it is such a conductive substrate for plating, after plating using it, when peeling the deposited metal layer from the conductive substrate for plating, friction between the metal layer and the insulating layer or The resistance can be reduced, and the peeling becomes easier.

  According to the conductive base material for plating described above, since the concave portion in which the metal layer is formed by plating is wide in the opening direction, the conductor layer pattern obtained by plating can be easily peeled off. Moreover, since an insulating layer consists of DLC or an inorganic material, the adhesiveness to an electroconductive base material is excellent, and the peeling resistance is excellent. The insulating layer can improve the adhesion between the conductive base material and the insulating layer by the intermediate layer, thereby further extending the life of the conductive base material for plating. The conductive substrate for plating having a concave portion that is wide toward the opening direction forms a convex pattern on the conductive substrate, and after the insulating layer is formed, the convex pattern to which the insulating layer is attached is formed. Since the concave portion can be produced by removing, the manufacturing is easy and the productivity is high.

The method for producing a conductive substrate for plating includes a step of forming an insulating layer on the surface of the conductive substrate so that a geometric figure is drawn by the recesses exposing the conductive substrate.
This step includes (A) a step of forming a removable convex pattern on the surface of the conductive substrate, (B) a surface of the conductive substrate on which the removable convex pattern is formed, A step of forming an insulating layer; and (C) a step of removing the convex pattern to which the insulating layer is attached.

  For the step (A) of forming a removable convex pattern on the surface of the conductive substrate, a method of forming a resist pattern using a photolithographic method can be used. This method (method a) includes (a-1) a step of forming a photosensitive resist layer on a conductive substrate, and (a-2) a step of exposing the photosensitive resist layer through a mask corresponding to the conductor layer pattern. And (a-3) a step of developing the photosensitive resist layer after exposure.

  In addition, a method using laser light can be applied to the step (A) of forming a removable convex pattern on the surface of the conductive substrate. In this method (method b), (b-1) a step of forming a photosensitive resist layer on a conductive substrate, and (b-2) a portion of the photosensitive resist layer corresponding to the conductor layer pattern is masked. And (b-3) a step of developing the photosensitive resist layer after irradiation with the laser beam.

  As the photosensitive resist, a well-known negative resist (a portion irradiated with light is cured) can be used. At this time, a negative mask (light passes through a portion corresponding to the concave portion) is also used as the mask. Further, a positive resist can be used as the photosensitive resist. Corresponding to these methods, the light irradiation part in the method a and method b is appropriately determined.

  As a specific method, by laminating a dry film resist (photosensitive resin layer) on a conductive substrate, and wearing a mask to expose it, the part that remains as a convex pattern can be cured and the unnecessary part can be developed. It can be formed by developing and removing unnecessary portions. In addition, the convex pattern is a state in which the portion that remains as the convex pattern is cured by applying a liquid resist to the conductive substrate and then drying or temporarily curing the solvent, and then exposing the mask with a mask. Alternatively, the unnecessary portion can be developed, and the unnecessary portion can be developed and removed. The liquid resist can be applied by spraying, dispenser, dipping, roll, spin coating or the like.

In the above, after laminating a dry film resist or applying a liquid resist, it is also possible to employ a method of directly exposing without using a mask with a laser beam or the like instead of exposing through a mask. If the patterning can be performed by irradiating the photocurable resin with active energy rays with or without a mask, the mode is not limited.
When the size of the conductive substrate is large, a method using a dry film resist is preferable from the viewpoint of productivity. When the conductive substrate is a plating drum, the dry film resist is laminated or a liquid resist is applied. Then, a method of directly exposing with a laser beam or the like without using a mask is preferable.

  In the above, it can carry out also by the method of using a photocurable resin instead of a photosensitive resist, and removing the unnecessary part of a photocurable resin by irradiation of a laser beam.

  Although a resist pattern (convex pattern) can be formed by using a printing method, in this case, various methods can be used as a resist pattern printing method. For example, screen printing, letterpress printing, letterpress offset printing, letterpress reversal offset printing, intaglio printing, letterpress printing, ink jet printing, flexographic printing, and the like can be used. As the resist, a photocurable or thermosetting resin can be used. After printing, the resist is cured by light irradiation or heat.

An example of the manufacturing method of the electroconductive base material for plating is demonstrated using drawing.
FIG. 12 is a cross-sectional view showing an example of a process showing a method for producing a conductive substrate for plating.

  A photosensitive resist layer (photosensitive resin layer) 35 is formed on the conductive substrate 32 (FIG. 12A). The photosensitive resist layer 35 is patterned by applying a photolithographic method to the photosensitive resist layer (photosensitive resin layer) 35 of the laminate (FIG. 12B). Patterning is performed by placing a photomask on which a pattern has been formed on the photosensitive resist layer 35, exposing it, developing it, removing unnecessary portions of the photosensitive resist layer 35, and leaving protrusions 36. Done. The shape of the protrusion 36 and the convex pattern formed therefrom are considered to correspond to the concave 34 on the conductive substrate 32 and the pattern.

At this time, in the cross-sectional shape of the protrusion 36, the side surface is perpendicular to the conductive base material, or the end of the protrusion 36 is in contact with the end where the protrusion 36 contacts the conductive base material 32. It is preferable to be in a position where at least a part of the upper side surface covers the end portion. In terms of the width of the protrusions 36, the maximum value d of the convex pattern width is preferably equal to or larger than the width d in contact with the convex pattern and the conductive substrate 32. This is because the concave width of the insulating layer having good adhesion is determined by d. Here, as a method of increasing the width d ′ of the protrusion 36 in the cross-sectional shape of the protrusion 36 equal to or larger than the width d ′ in contact with the protrusion 36 and the conductive base material 32, the protrusion 36 is developed. A resist having a characteristic of over-developing or having an undercut shape may be used. It is preferable that d is realized at the upper part of the convex portion.
The shape of the protrusion 36 that forms the pattern of the removable convex portion is associated with the shape of the concave portion. From the ease of manufacture, the maximum width is 1 μm or more, the interval is 1 μm or more, and the height is 1 to 50 μm. Preferably there is. When the conductive substrate for plating is used for producing a conductor layer pattern for a light-transmitting electromagnetic wave shielding member, the protrusion 36 has a maximum width of 1 to 40 μm, a distance of 50 to 1000 μm, and a height of 1 to 1. Each of 30 μm is preferable. In particular, it is preferable that the maximum width is 3 to 10 μm and the interval is 100 to 400 μm.

The step (B) of forming an insulating layer on the surface of the conductive substrate on which the removable convex pattern is formed will be described.
An insulating layer 37 is formed on the surface of the conductive substrate 32 having a convex pattern composed of the protrusions 36 (FIG. 12C).

  As a method for forming a DLC thin film as an insulating layer, a vacuum deposition method, a sputtering method, an ion plating method, an arc discharge method, a physical vapor deposition method such as an ionization deposition method, a chemical vapor deposition method such as a plasma CVD method, etc. The dry CVD method can be employed, but the plasma CVD method using a high frequency or pulse discharge in which the film forming temperature can be controlled from room temperature (25 ° C.) is particularly preferable.

  In order to form the DLC thin film by the plasma CVD method, a hydrocarbon-based gas is preferably used as a carbon source as a raw material. For example, alkane gases such as methane, ethane, propane, butane, pentane, hexane, alkene gases such as ethylene, propylene, butene, pentene, alkadiene gases such as pentadiene, butadiene, acetylene, methylacetylene, etc. Alkyne gases, aromatic hydrocarbon gases such as benzene, toluene, xylene, indene, naphthalene and phenanthrene, cycloalkane gases such as cyclopropane and cyclohexane, cycloalkene gases such as cyclopentene and cyclohexene, methanol And alcohol gases such as ethanol, ketone gases such as acetone and melethyl ketone, and aldehyde gases such as methanal and ethanal. The said gas may be used independently and may use 2 or more types together. Further, a mixture of the above-described carbon source and hydrogen gas as a raw material gas containing carbon and hydrogen as elements, and the above-described carbon source and a gas of a compound composed only of carbon and oxygen such as carbon monoxide gas and carbon dioxide gas. A mixture of a compound gas composed of only carbon and oxygen, such as a mixture, carbon monoxide gas, carbon dioxide gas, and hydrogen gas; a compound gas composed of only carbon and oxygen, such as carbon monoxide gas, carbon dioxide gas; Examples thereof include a mixture with oxygen gas or water vapor. Further, these source gases may contain a rare gas. The rare gas is a gas composed of an element belonging to Group 0 of the periodic table, and examples thereof include helium, argon, neon, and xenon. These rare gases may be used alone or in combination of two or more.

Next, the step (C) of removing the convex pattern to which the insulating layer is attached will be described. In a state where the insulating layer 37 is attached (see FIG. 12C), the convex pattern formed of the protrusions 36 is removed (see FIG. 12D). A commercially available resist stripping solution, inorganic, organic alkali, organic solvent, or the like can be used to remove the resist to which the insulating layer is attached. In addition, if there is a dedicated stripping solution corresponding to the resist used to form the pattern, it can be used. As a peeling method, for example, it is possible to remove the resist after it has been swelled, broken or dissolved by immersion in a chemical solution. In order to sufficiently impregnate the resist with the solution, techniques such as ultrasonic waves, heating, and stirring may be used in combination. In addition, the liquid can be applied with a shower, a jet or the like in order to promote peeling, and can be rubbed with a soft cloth or cotton swab.
In addition, when the heat resistance of the insulating layer is sufficiently high, a method of baking at a high temperature to carbonize the resist and removing it, or irradiating with a laser to burn off can be used. As the stripping solution, for example, a 3% by mass NaOH solution is used, and showering or dipping can be applied as the stripping method.

A known method can be adopted as the plating method. As the plating method, an electrolytic plating method can be applied.
The electrolytic plating will be further described. For example, in the case of electrolytic copper plating, a copper sulfate bath, a copper borofluoride bath, a copper pyrophosphate bath, a copper cyanide bath, or the like can be used as an electrolytic bath for plating. At this time, it is known that the dispersion of electrodeposition stress can be further reduced by adding a stress relieving agent (also having an effect as a brightener) due to organic matter or the like to the plating bath. For electrolytic nickel plating, a Watt bath, a sulfamic acid bath, or the like can be used. In order to adjust the flexibility of the nickel foil in these baths, additives such as saccharin, paratoluenesulfonamide, sodium benzenesulfonate, sodium naphthalene trisulfonate, and commercial additions that are preparations as necessary An agent may be added. Furthermore, in the case of electrolytic gold plating, alloy plating using potassium gold cyanide, pure gold plating using an ammonium citrate bath or a potassium citrate bath, or the like is used. In the case of alloy plating, a gold-copper, gold-silver, gold-cobalt binary alloy or a gold-copper-silver ternary alloy is used. Similarly, other known methods can be used for other metals. As the electrolytic plating method, for example, “Practical Plating for On-Site Engineers” (edited by the Japan Plating Association, published by Sakai Shoten in 1986), pages 87 to 504 can be referred to.

  As a metal that appears or precipitates by plating, conductive metals such as silver, copper, gold, aluminum, tungsten, nickel, iron, and chromium are used, but the volume resistivity (specific resistance) at 20 ° C. is used. It is desirable to include at least one kind of metal of 20 μΩ · cm or less. When used as an electromagnetic wave shielding film used in the present invention, in order to ground an electromagnetic wave as an electric current, the metal constituting this is superior in electromagnetic wave shielding properties when having higher conductivity. Such metals include silver (1.62 μΩ · cm), copper (1.72 μΩ · cm), gold (2.4 μΩ · cm), aluminum (2.75 μΩ · cm), tungsten (5.5 μΩ · cm). ), Nickel (7.24 μΩ · cm), iron (9.8 μΩ · cm), chromium (17 μΩ · cm, all values at 20 ° C.), etc., but are not particularly limited thereto. If possible, the volume resistivity is more preferably 10 μΩ · cm or less, and further preferably 5 μΩ · cm or less. In view of the price of metal and availability, copper is most preferably used. These metals may be used alone, or may be an alloy with another metal or a metal oxide for imparting functionality. However, from the viewpoint of conductivity, it is preferable that a metal having a volume resistivity of 20 μΩ · cm or less is contained in the largest amount as a component.

  Next, the next step in the manufacturing process of the substrate with the conductor layer pattern, that is, (II) a conductor layer formed on the conductive substrate for plating (metal deposited in the concave portion of the conductive substrate for plating) A transfer process for transferring the film to a suitable base material including a resin layer will be described.

In the transfer process, the appropriate base material (including the resin layer or the support base material and the resin layer thereon) is a resin layer having adhesiveness or exhibiting adhesiveness (these Is made of “adhesive” or “adhesive resin”. This pressure-sensitive adhesive may contain additives such as a crosslinking agent, a curing agent, a diluent, a plasticizer, an antioxidant, a filler, a colorant, an ultraviolet absorber and a tackifier, as necessary. Good. The “adhesiveness” includes “adhesiveness”.
As a support substrate for the transfer substrate, a plastic film is preferable in view of productivity. In some cases, the transfer substrate may be composed only of an adhesive layer.

  If the thickness of the pressure-sensitive adhesive layer (resin layer) is too thin, sufficient strength cannot be obtained. Therefore, when transferring a conductive layer formed by plating, the conductive layer does not adhere to the pressure-sensitive adhesive layer, resulting in poor transfer. May occur. Accordingly, the thickness of the pressure-sensitive adhesive layer is preferably 0.5 μm or more, more preferably 1 μm or more, and further preferably 3 μm or more in order to ensure transfer reliability during mass production. Further, if the thickness of the pressure-sensitive adhesive layer is too thick, the production cost of the pressure-sensitive adhesive layer increases, and the amount of deformation of the pressure-sensitive adhesive layer increases when laminated, so the thickness of the pressure-sensitive adhesive layer is preferably 100 μm or less. 90 μm or less is more preferable, and 70 μm or less is more preferable.

In the transfer step, when a pressure-sensitive adhesive containing a curable resin such as a thermosetting resin or a photo-curable resin is used for the pressure-sensitive adhesive layer of the transfer base material 40, the curing is performed by plating the transfer base material 40. It may be performed before peeling from the conductive substrate 31, may be performed after peeling, may be semi-cured before peeling, and may be completely cured after peeling. In particular, when curing or complete curing of the pressure-sensitive adhesive containing the curable resin is performed after the transfer substrate 40 is peeled from the conductive substrate 31 for plating, a cover lay film and a peelable support are laminated and adhered. You may carry out simultaneously with bonding to an agent layer. Thereby, it can be set as the base material with a conductor layer turn which protected the conductor layer.
Generally, the conductor layer pattern side of the substrate with the conductor layer pattern is bonded to the cover film, peelable support, etc., optionally via a resin layer, and the resin layer is applied. By coating, it can be set as the base material with a conductor layer pattern which protected the conductor layer.

The method for embedding the conductor layer in the resin layer will be further described, but the method is not limited thereto.
Immediately after transferring the plating deposited in the recesses of the conductive base material for plating to the base material including the resin layer, at least the portion of the conductor layer that is the maximum width may be already embedded in the resin layer, You don't have to. In order to embed at least the portion having the maximum width of the conductor layer immediately after the transfer, it is necessary to increase the fluidity of the resin layer of the base material at the time of transfer. For example, there are a method of increasing the laminating temperature, a method of adding a reactive low molecular weight material as the composition of the resin layer, and a method of using a liquid resin as the resin layer. In this case, it is preferable to peel the transparent substrate after the resin layer is cured or solidified while the substrate is in contact with the plating conductive substrate. The curing reaction is due to heating, irradiation with active energy rays such as ultraviolet rays, etc., but since the productivity is improved by instantaneous curing, curing by irradiation with active energy rays such as ultraviolet rays is preferable.
In addition, immediately after the conductor layer is transferred to the base material, if the portion having the maximum width of the conductor layer is not yet buried in the resin layer (including the case where it is not buried at all or almost), the conductor is formed in a separate process. It is necessary to bury the layer in the resin layer at least the portion (the other portion) having the maximum width of the conductor layer in the resin layer. For this purpose, after transferring the conductor layer to the base material, the base material with the conductor layer is pressed with a roll laminator or a press, while applying heat or irradiating active energy rays as necessary, at least of the conductor layer. At least the portion of the maximum width is buried in the resin. At this time, if necessary, the curing reaction may be performed simultaneously by heating or irradiation with energy rays, and the heating may be performed in order to enhance fluidity. Also, in this case, a separate film or other removable substrate is used for the substrate with the conductor layer for the purpose of protecting the surface or blocking oxygen when the resin is UV-cured in the pressurizing step or in the subsequent step. You may laminate | stack from a conductor layer. When a curable resin is used for the resin layer, in the case where the resin layer is not cured simultaneously with the pressurization, it is preferable to cure the resin layer by heating or irradiating active energy rays after the pressurization.
In addition, when a curable resin is used for the resin layer, it is partially cured before the substrate is subjected to the above transfer and before the embedding process after the transfer, in order to adjust the fluidity of the resin layer. The reaction may be performed, but when it is performed before transfer, it is performed to such an extent that the adhesiveness required for transfer is not impaired.

In addition, as described above, a rotating body (roll) can be used as the conductive base material for plating. This will be described in detail. The rotating body (roll) is preferably made of metal. Furthermore, it is preferable to use a drum electrode or the like used in the drum-type electrolytic deposition method as the rotating body. As described above, the material that forms the surface of the drum electrode may be a material with relatively low plating adhesion, such as stainless steel, chrome-plated cast iron, chrome-plated steel, titanium, or titanium-lined material. preferable. By using a rotating body as the conductive base material, it is possible to obtain a base material with a conductor layer pattern as a roll, and in this case, productivity is greatly increased.
Using a rotating body, while continuously peeling the pattern formed by electrolytic plating, rotating the drum electrode when using the drum electrode as the conductive substrate and the process of obtaining the substrate with the conductor layer pattern as a scroll In addition, a method and an apparatus described in International Publication No. 08/081904 can be used as an apparatus for continuously depositing metal by electrolytic plating while continuously peeling the deposited metal.

Example 1
<Preparation of conductive substrate for plating>
First, a conductive substrate for plating was produced.
(Pattern specification)
A negative film for pattern formation was produced with the following specifications. The aperture width of the light transmission part is 15 μm, the line pitch is 300 μm, and the bias angle is 45 ° (in the regular square, the line is arranged at an angle of 45 degrees with respect to the side of the regular square. 90%), a pattern was formed in a lattice shape with a size of 120 mm square.

(Formation of convex pattern)
A resist film (Photech RY3315, manufactured by Hitachi Chemical Co., Ltd.) was bonded to both sides of a 150 mm square stainless steel plate (SUS316L, # 400 polished finish, thickness 500 μm, manufactured by Nisshin Steel Co., Ltd.) (FIG. 12A). Is not the same). The bonding conditions were a roll temperature of 105 ° C., a pressure of 0.5 MPa, and a line speed of 1 m / min. Subsequently, the negative film of the pattern specification was left still on one side of the stainless steel plate. Using an ultraviolet irradiation device, ultraviolet rays were irradiated at 250 mJ / cm ² from above and below the stainless plate on which the negative film was placed under a vacuum of 600 mmHg or less. Further, by developing with a 1% by mass sodium carbonate aqueous solution, a protrusion resist film (protrusion; height 15 μm) having a line width of 9 to 11 μm, a line pitch of 300 μm, and a bias angle of 45 degrees was obtained on the SUS plate. Since the entire surface opposite to the surface on which the pattern is formed is exposed, it is not developed and a resist film is formed on the entire surface (corresponding to FIG. 12B but not the same).

(Formation of insulating layer)
A DLC film is formed by a PBII / D apparatus (Type III, manufactured by Kurita Manufacturing Co., Ltd.). A stainless steel substrate with a resist film attached thereto was placed in the chamber, the inside of the chamber was evacuated, and the substrate surface was cleaned with argon gas. Next, hexamethyldisiloxane was introduced into the chamber, and an intermediate layer was formed to a thickness of 0.1 μm. Next, toluene, methane, and acetylene gas were introduced, and a DLC layer was formed on the intermediate layer so as to have a film thickness of 2 to 3 μm (corresponding to FIG. 12C, but not the same).

(Concavity formation; removal of convex pattern with insulating layer attached)
The stainless steel substrate with the insulating layer attached was immersed in an aqueous sodium hydroxide solution (10 mass%, 50 ° C.) and left for 8 hours with occasional rocking. The resist film forming the convex pattern and the DLC film adhering thereto have been peeled off. Since there was a portion that was difficult to peel off, the entire surface was peeled off by lightly rubbing with a cloth to obtain a conductive substrate for plating (corresponding to FIG. 12 (d), but not the same).
The shape of the recess was wider toward the opening direction, and the inclination angle of the side surface of the recess was the same as the angle of the boundary surface. The depth of the recess was 2 to 3 μm. Moreover, the width | variety in the bottom part of a recessed part was 9-11 micrometers, and the width | variety (maximum width) in an opening part was 13-16 micrometers. The line pitch of the recesses was 300 μm.

<Formation of conductor layer pattern>
(Copper plating)
Furthermore, an adhesive film (Hitalex K-3940B, manufactured by Hitachi Chemical Co., Ltd.) was attached to the surface (back surface) where the pattern of the conductive substrate for plating obtained above was not formed. Electrolytic bath for electrolytic copper plating (copper sulfate (pentahydrate) 250 g / L, sulfuric acid 70 g / L, sulfuric acid 70 g / L, cube) using the electroconductive substrate for plating with the adhesive film attached as a cathode and phosphorus-containing copper as an anode Immerse it in 4 ml / L aqueous solution (30 ° C.) with light AR (supplied by Ebara Eugene Light Co., Ltd.), apply voltage to both electrodes to set the current density to 10 A / dm ² , and place it on the concave portion of the conductive substrate for plating. Plating was performed until the deposited metal thickness was approximately 6 μm. The plating was formed so as to overflow in and out of the recess of the conductive substrate for plating.

<Preparation of transfer substrate>
A separator on one side of a pressure-sensitive adhesive layer (Hitalex DA3025, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 25 μm is peeled off on a PET film HPE-25 (manufactured by Teijin DuPont Co., Ltd.) and attached to the adhesive surface Combined.

<Transfer of conductor layer pattern>
Next, the surface of the pressure-sensitive adhesive layer of the transfer substrate and the surface of the conductive substrate for plating that had been subjected to copper plating were bonded using a roll laminator (corresponding to FIG. 14G). Lamination conditions were a roll temperature of 30 ° C., a pressure of 0.3 MPa, and a line speed of 1.0 m / min. Subsequently, when the transfer substrate bonded to the conductive substrate for plating was peeled off, the copper deposited on the conductive substrate for plating was transferred to the adhesive layer of the transfer substrate (FIG. 14). Corresponding to (h)).

  A part of the obtained base material with a conductor layer pattern was cut out, and the cross section was taken on a scanning electron micrograph (magnification 2000 times) and observed. 5 points are selected arbitrarily, and the cross-sectional shape of the conductor layer pattern is as shown in FIG. 5A, the thickness T2 of the lower layer is 3 to 4 μm, the thickness T1 of the upper layer is 2 to 3 μm, and the total thickness T is 6 μm, maximum width L is 17 to 20 μm, lower upper base width L1 is 9 to 11 μm, lower base width L2 is 13 to 16 μm, and there is a relatively large curvature at both ends of the lower layer cross section, The curvature of the curvature at the center of the cross section of the upper layer was very small, almost flat, and the angle α was 45 °. The line pitch of the conductor layer pattern was 300 μm. It confirmed that the base material with a conductor layer pattern which consists of a grid-like metal pattern of such a conductor layer was obtained. In addition, the surface of the central portion of the cross section of the upper layer of the conductor layer and the surfaces of the curved portions at both ends were exposed. The maximum thickness (f) of the portion where the conductor layer pattern was embedded in the resin layer was 3 to 4 μm, and the maximum width portion of the conductor layer pattern was embedded. The ratio (f / T) to the thickness (T) of the entire conductor layer pattern of f was 0.33 to 0.50. Further, the ratio (T2 / L) of the thickness T2 of the lower layer to the maximum width L of the conductor layer pattern was 0.15 to 0.23.

The surface resistance of the obtained base material with a conductor layer pattern was 0.1Ω / □. The surface resistance was measured with a sample size of 50 mm square using a four-probe method surface resistance measuring device Lorester GP MCP-T600 (Mitsubishi Chemical Corporation).
As shown in FIG. 1, the surface of the electronic component mounted in the electronic device is the surface on which the conductive layer of the electromagnetic wave shielding film is formed. Bonded to the ground pattern at room temperature. In this electromagnetic wave shielding method for electronic parts, the connection with the ground pattern was easy, and the inside after bonding could be visually confirmed.

20. Conductor layer 21. Upper part (trapezoidal part)
22. Lower part (semi-circular part)
23. Shoulder 24. Resin layer 31. Conductive substrate for plating 32. Conductive substrate 33. Insulating layer 34. Concave part 35. Photosensitive resist layer (photosensitive resin layer)
36. Projection 37. Insulating layer (DLC film)
39. Conductor layer pattern 40. Substrate for transfer 42. Pressure-sensitive adhesive layer 43. Protective resin 50. Substrate with conductor layer pattern 51. Support base material 52. Resin layer 53. Base material 54. Conductor layer

Claims (8)

  An electromagnetic wave shielding method for an electronic component in which the surface of an electronic component mounted in an electronic device is covered with an electromagnetic wave shielding film to shield the electromagnetic wave, and the electromagnetic wave shielding film is 30% on an adhesive resin layer. The conductor layer of the electromagnetic wave shielding film in which the conductor layer having the above opening ratio is formed and the conductor layer is embedded in the resin layer so that at least a part of the surface of the conductor layer is exposed is the ground pattern. An electromagnetic wave shielding method, characterized by being bonded to a substrate.   The conductor layer embedded and formed so that at least a part of the surface of the conductor layer is exposed in the adhesive resin layer has an overall cross-sectional shape or a trapezoidal upper part of the cross-sectional shape, and the conductor layer The electromagnetic wave shielding method according to claim 1, wherein at least a part of the upper surface or the trapezoidal shape is exposed from the resin layer, and the other part is embedded in the resin layer.   The electromagnetic wave shielding method according to claim 1 or 2, wherein the height of the trapezoidal portion of the cross-sectional shape of the conductor layer is in the range of 0.1 to 10 µm and the angle of the side surface is 30 ° or more and 80 ° or less.   The cross-sectional shape of the conductor layer has an upper part of the trapezoidal shape part and a lower part having a semicircular part that is continuous with this part and is wider than this part and curved downward, and the conductor layer has at least a part of its upper surface. The electromagnetic wave shielding method according to any one of claims 1 to 3, wherein the electromagnetic wave shielding method according to any one of claims 1 to 3, wherein the electromagnetic wave is exposed from the resin layer, and at least a portion below the maximum width is embedded in the resin layer.   The electromagnetic wave according to any one of claims 1 to 4, wherein a ratio (T2 / L) of the thickness (T2) of the conductor layer above the maximum width to the maximum width (L) of the conductor layer is in a range of 0.01-2. Shield method.   The electromagnetic wave shielding method according to claim 1, wherein the conductor layer has a thickness of 0.1 to 100 μm and a width of 1 to 50 μm.   The electromagnetic wave shielding method according to claim 1, wherein the resin layer has a thickness in the range of 0.5 to 100 μm.   The electromagnetic wave shielding method according to any one of claims 1 to 7, wherein an insulating material is further formed so that at least a part of the pattern is exposed on the surface of the electromagnetic wave shielding film on which the conductor layer pattern is formed. .

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