CN108541205B - Electromagnetic shielding case and manufacturing method thereof - Google Patents
Electromagnetic shielding case and manufacturing method thereof Download PDFInfo
- Publication number
- CN108541205B CN108541205B CN201710116287.8A CN201710116287A CN108541205B CN 108541205 B CN108541205 B CN 108541205B CN 201710116287 A CN201710116287 A CN 201710116287A CN 108541205 B CN108541205 B CN 108541205B
- Authority
- CN
- China
- Prior art keywords
- layer
- shielding
- electromagnetic shielding
- substrate
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
An electromagnetic shielding cover is used for electrically connecting a circuit board with electronic elements and providing electromagnetic shielding for the electronic elements of the circuit board and comprises a base material layer made of transparent materials and a first conducting circuit pattern formed on the surface of one side of the base material layer; the electromagnetic shielding cover is divided into an accommodating area; the first conductive circuit pattern comprises a first electromagnetic shielding grid, and the first electromagnetic shielding grid is formed in the accommodating area; the electromagnetic shielding cover is bulged out from the position corresponding to the accommodating area to form an accommodating space, and the accommodating space is used for shielding and accommodating the electronic elements on the circuit board. A method of making an electromagnetic shield is also provided.
Description
Technical Field
The invention relates to the field of electromagnetic shielding, in particular to an electromagnetic shielding cover and a manufacturing method thereof.
Background
Transparent electronic products have been proposed as a new concept for a long time, but to achieve true transparency, full transparency of machine components, parts, rigid circuit boards (PCBs), flexible circuit boards (FPCs), and the like is required. The electromagnetic shielding cover is usually attached to the surface of the circuit board, and plays an important role in solving the electromagnetic shielding problem of electronic products. Therefore, how to obtain a transparent electromagnetic shielding cover which is well matched with the circuit board is very critical for solving the problem of full transparency of the transparent electronic product.
Disclosure of Invention
Therefore, it is desirable to provide an electromagnetic shielding cover and a method for manufacturing the same, wherein the electromagnetic shielding cover is transparent and well-matched with a circuit board.
A method of making an electromagnetic shield for electrically connecting a circuit board having electronic components and providing electromagnetic shielding for the electronic components of the circuit board, comprising the steps of: manufacturing a substrate, wherein the substrate comprises a base material layer made of a transparent material and a first conducting layer formed on the surface of one side of the base material layer, and an accommodating area is divided on the substrate; manufacturing the first conducting layer to form a first conducting circuit pattern, wherein the first conducting circuit pattern comprises a first electromagnetic shielding grid, and the first electromagnetic shielding grid is formed in the accommodating area; the substrate after the first conducting circuit pattern is manufactured through hot extrusion treatment is extruded and bulges at the position corresponding to the accommodating area, and an electromagnetic shielding cover is obtained; the bulging part of the electromagnetic shielding cover encloses an accommodating space which is used for shielding and accommodating the electronic element on the circuit board.
An electromagnetic shielding cover is used for electrically connecting a circuit board with electronic elements and providing electromagnetic shielding for the electronic elements of the circuit board and comprises a base material layer made of transparent materials and a first conducting circuit pattern formed on the surface of one side of the base material layer; the electromagnetic shielding cover is provided with an accommodating area; the first conductive circuit pattern comprises a first electromagnetic shielding grid, and the first electromagnetic shielding grid is formed in the accommodating area; the electromagnetic shielding cover is bulged out from the position corresponding to the accommodating area to form an accommodating space, and the accommodating space is used for shielding and accommodating the electronic elements on the circuit board.
Compared with the prior art, the electromagnetic shielding cover and the manufacturing method thereof have the advantages that the transparent feeling is good, the electromagnetic shielding cover in the containing area bulges to form the containing space, and components on a circuit board connected with the electromagnetic shielding cover can be contained and protected, so that the electromagnetic shielding cover can be well matched with the circuit board.
Drawings
Fig. 1 is a cross-sectional view of a substrate provided by an embodiment of the present invention.
Fig. 2 is a flow chart of a method for fabricating a substrate according to an embodiment of the invention.
FIG. 3 is a flow chart of another method for fabricating a substrate according to an embodiment of the present invention.
Fig. 4 is a bottom view of the substrate of fig. 1 after conductive traces are formed on the conductive layer.
Fig. 5 is a top view of the conductive layer of the substrate of fig. 1 after forming a conductive line pattern.
Fig. 6 is a cross-sectional view taken along line a-a in fig. 4 after a conductive layer of the substrate of fig. 1 is patterned to form a conductive line pattern.
Fig. 7 is a cross-sectional view taken along line B-B in fig. 4 after conductive layers of the substrate of fig. 1 are patterned to form conductive traces.
Fig. 8 is a cross-sectional view of the conductive passivation layer formed on the surface of the electrical contact pad of fig. 7.
Fig. 9 is a cross-sectional view of the electromagnetic shield case formed by the circuit substrate hot pressing process of fig. 8.
Description of the main elements
First conductive layer 120
Second conductive layer 130
Conductive via 14
First metal film layer 121
Second metal film layer 131
Pore wall metal film layer 142
In-hole plating layer 143
First conductive line pattern 12
Second conductive line pattern 13
First electromagnetic shielding mesh 123
Second electromagnetic shielding mesh 133
Conductive protective layer 135
Electromagnetic shield 300
Accommodating space 301
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
A first embodiment of the present invention provides a method for manufacturing an electromagnetic shielding case, including the following steps:
first, referring to fig. 1, a substrate 100 is manufactured, where the substrate includes a substrate layer 11, and a first conductive layer 120 and a second conductive layer 130 respectively formed on two opposite side surfaces of the substrate layer.
The substrate layer 11 is made of a transparent material, and the material of the substrate layer is preferably polyethylene terephthalate (PET) resin or polyethylene naphthalate (PEN) resin. In this embodiment, the material of the substrate layer 11 is PET.
The substrate 100 is artificially divided into a receiving area 101 and an auxiliary area 102 connected to the receiving area 101. The accommodating area 101 is used for forming an accommodating space in the subsequent steps. In this embodiment, the accommodating area 101 is located near the middle of the substrate 100, and the auxiliary area 102 is disposed around the accommodating area 101.
A plurality of conductive vias 14 are formed in the substrate 100, and each of the conductive vias 14 is electrically connected to the first conductive layer 120 and the second conductive layer 130. The plurality of conductive vias 14 are all located in the auxiliary area 102. In this embodiment, the plurality of conductive holes 14 are arranged in a single row, uniformly spaced, and surrounding the accommodating area 101.
As shown in fig. 2, the substrate 100 may be manufactured by the following steps:
firstly, providing the substrate layer 11; then, metallizing two opposite side surfaces of the substrate layer 11, thereby forming a first metal film layer 121 and a second metal film layer 131 on the two opposite side surfaces of the substrate layer 11 respectively; then, a through hole 141 is formed by drilling to sequentially penetrate the first metal film layer 121, the base material layer 11, and the second metal film layer 131; then, the through hole 141 is processed by blackening, shading or chemical plating, and then is electroplated, so that the first electroplated layer 122 and the second electroplated layer 132 are respectively formed on the two opposite side surfaces of the metalized substrate layer 11, and the electroplated layer is also formed in the through hole 141, so that the through hole is made into a conductive hole 14; wherein the first conductive layer 120 includes the first plating layer 122 and the first metal film layer 121; the second conductive layer 130 includes the second plating layer 132 and a second metal film layer 131.
As shown in fig. 3, the substrate 100 may also be manufactured by the following steps:
firstly, providing the substrate layer 11; then, drilling a hole in the substrate layer 11 to form a through hole 141 penetrating the substrate layer 11; then, metallizing the surfaces of the two opposite sides of the substrate layer 11 and the walls of the through holes 141, so as to form a first metal film layer 121 and a second metal film layer 131 on the two opposite sides of the substrate layer 11, respectively, and form a wall metal film layer 142 on the walls of the through holes 141; then, electroplating is carried out, so that the first electroplating layer 122 and the second conductive layer 132 are respectively formed on the two opposite side surfaces of the metalized substrate layer 11, and an in-hole electroplating layer 143 is also formed in the metalized through hole 141, so that a conductive hole 14 is formed in the through hole 141; the first conductive layer 120 includes the first plating layer 122 and the first metal film 121, and the second conductive layer 130 includes the second plating layer 132 and the second metal film 131.
In this embodiment, the metallization method may be:
firstly, performing surface treatment on the substrate layer 11, in this embodiment, immersing the substrate layer 11 in a mixed solution containing Polyethyleneimine (PEI) resin, epichlorohydrin, ethanol, and dimethyl formamide, and immersing for 6 hours, thereby forming a PEI film layer on each of the two opposite side surfaces of the substrate layer 11; then, the first metal film layer 121 and the second metal film layer 131 are formed on the PEI film layers on the two side surfaces of the substrate layer 11 by electroless copper plating, respectively (in the method of fig. 3, the hole wall metal film layer 142 is further formed on the hole wall of the through hole 141). Preferably, a substrate layer 11 made of PET is selected for this step.
In this embodiment, the metal film layers and the electroplated layer are made of copper; therefore, the boundary between the plating layer and the metal film layer is not shown in fig. 1.
In other embodiments, the substrate 100 may also be a single panel, i.e. only including one conductive layer.
Referring to fig. 4-7, a first conductive trace pattern 12 is formed on the first conductive layer 120, and a second conductive trace pattern 13 is formed on the second conductive layer 130, so as to obtain a circuit substrate 200.
In this embodiment, the first conductive line pattern 12 and the second conductive line pattern 13 are formed by an image transfer and etching process.
The first conductive trace pattern 12 includes a first electromagnetic shielding mesh 123 and a plurality of electrical connection pads 124 electrically connected to the first electromagnetic shielding mesh 123, the first electromagnetic shielding mesh 123 is formed in the accommodating area 101, and the plurality of electrical connection pads 124 are formed in the auxiliary area 102; the second conductive trace pattern 13 includes a second electromagnetic shielding mesh 133 and a plurality of electrical contact pads 134 electrically connected to the second electromagnetic shielding mesh 133, the second electromagnetic shielding mesh 133 is formed in the accommodating area 101, and the plurality of electrical contact pads 134 are formed in the auxiliary area 102; each of the electrical connection pads 124 correspondingly covers one of the conductive vias 14 and is electrically connected to the corresponding conductive via 14, and each of the electrical connection pads 134 correspondingly covers one of the conductive vias 14 and is electrically connected to the corresponding conductive via 14, so that each of the electrical connection pads 124 is electrically connected to one of the electrical connection pads 134 through one of the conductive vias 14.
Referring to fig. 4 to 5 again, the first electromagnetic shielding mesh 123 is a repeated grid pattern formed by crossing a plurality of first shielding lines 1231, and the second electromagnetic shielding mesh 133 is a repeated grid pattern formed by crossing a plurality of second shielding lines 1331.
The base material layer 11 of the electromagnetic shielding cover is transparent, and the opaque base material layer is a conductive circuit layer, so that the thinner the shielding circuit is, the larger the distance between the adjacent shielding circuits is, and the better the visual transparency effect of the electromagnetic shielding cover is.
Preferably, the line width of each first shielding line 1231 is smaller than the distance between each adjacent first shielding lines 1231, and the line width of each second shielding line 1331 is smaller than the distance between each adjacent second shielding lines 1331.
More preferably, the line width of each of the first shielding lines 1231 and the second shielding lines 1331 is 50 micrometers or less, and the distance between each adjacent first shielding lines 1231 and the distance between each adjacent second shielding lines 1331 are 100 micrometers or more.
More preferably, the line width of each of the first shielding lines 1231 and the second shielding lines 1331 ranges from 1 micrometer to 25 micrometers, and the distance between each adjacent first shielding line 1231 and the distance between each adjacent second shielding line 1331 ranges from 200 micrometers to 1000 micrometers.
Third, referring to fig. 8, the plurality of electrical contact pads 134 are surface-treated, so that a conductive passivation layer 135 is formed on the surface of each electrical contact pad 134.
The surface treatment may be performed by gold plating, tin spraying, silver plating, or forming a conductive polymer film to prevent the surfaces of the pads 124 and 134 from being oxidized; if the methods of gold plating, tin spraying, silver plating, etc. are used, the electrical conductivity of the electrical pads 124 and 134 can be increased.
In other embodiments, this step may not be performed and the next step may be performed directly.
Fourthly, referring to fig. 9, the circuit substrate 200 is processed by hot extrusion, so that the circuit substrate 200 is extruded and bulged at a position corresponding to the accommodating area 101, and an electromagnetic shielding case 300 is obtained; the cross section of the bulging portion of the electromagnetic shielding cover 300 is substantially "U" shaped, and the bulging portion of the electromagnetic shielding cover 300 encloses an accommodating space 301.
When the electromagnetic shielding case 300 is attached to a circuit board, the accommodating space 301 is used for shielding and accommodating electronic components on the circuit board.
Referring to fig. 4-9 again, a second embodiment of the present invention provides an electromagnetic shielding case 300, where the electromagnetic shielding case 300 is used for electrically connecting a circuit board with electronic components and providing electromagnetic shielding for the electronic components of the circuit board. The electromagnetic shielding cover 300 includes a substrate layer 11 made of a transparent material, and a first conductive circuit pattern 12 and a second conductive circuit pattern 13 formed on two opposite side surfaces of the substrate layer 11.
The electromagnetic shielding case 300 is provided with a receiving area 101 and an auxiliary area 102. The electromagnetic shielding cover 300 bulges relative to the auxiliary area 102 at a position corresponding to the accommodating area 101, and the section of the bulged part of the electromagnetic shielding cover 300 is approximately in a 'U' shape, and the bulged part encloses an accommodating space 301. When the electromagnetic shielding case 300 is attached to a circuit board, the accommodating space 301 is used for shielding and accommodating electronic components on the circuit board. In this embodiment, the accommodating area 101 is located near the middle of the substrate 100, and the auxiliary area 102 is disposed around the accommodating area 101.
The first conductive trace pattern 12 includes a first electromagnetic shielding mesh 123 and a plurality of electrical connection pads 124 electrically connected to the first electromagnetic shielding mesh 123, the first electromagnetic shielding mesh 123 is formed in the accommodating area 101, and the plurality of electrical connection pads 124 are formed in the auxiliary area 102; the second conductive trace pattern 13 includes a second electromagnetic shielding mesh 133 and a plurality of electrical contact pads 134 electrically connected to the second electromagnetic shielding mesh 133, the second electromagnetic shielding mesh 133 is formed in the receiving area 101, and the plurality of electrical contact pads 134 are formed in the auxiliary area 102.
The plurality of electrical connection pads 124 may be electrically connected to the circuit board by anisotropic conductive adhesive, hot-press solder-melting, and the like; the plurality of electrical contact pads 134 may be grounded through conductive paste, conductive foam, or the like.
The first electromagnetic shielding mesh 123 is a repeated grid pattern formed by crossing a plurality of first shielding lines 1231, and the second electromagnetic shielding mesh 133 is a repeated grid pattern formed by crossing a plurality of second shielding lines 1331.
Preferably, the line width of each first shielding line 1231 is smaller than the distance between each adjacent and parallel first shielding lines 1231, and the line width of each second shielding line 1331 is smaller than the distance between each adjacent and parallel second shielding lines 1331, so that the electromagnetic shielding case 300 has better transparency.
More preferably, the line width of each of the first shielding lines 1231 and the second shielding lines 1331 is 50 micrometers or less, and the distance between each adjacent first shielding lines 1231 and the distance between each adjacent second shielding lines 1331 are both 100 micrometers or more, so that the electromagnetic shielding case 300 has better transparency.
More preferably, the line width range of each of the first shielding lines 1231 and the second shielding lines 1331 is 1 micrometer to 25 micrometers, the distance range between each adjacent first shielding line 1231 and the distance range between each adjacent second shielding line 1331 are 200 micrometers to 1000 micrometers, and the line width and line distance design can make the electromagnetic shielding case 300 have stronger transparency.
The electromagnetic shield 300 further has a plurality of conductive holes 14 formed thereon, and the plurality of conductive holes 14 are all located in the auxiliary area 102. Each of the electrical connection pads 124 correspondingly covers one of the conductive vias 14 and is electrically connected to the corresponding conductive via 14, and each of the electrical connection pads 134 correspondingly covers one of the conductive vias 14 and is electrically connected to the corresponding conductive via 14, so that each of the electrical connection pads 124 is electrically connected to one of the electrical connection pads 134 through one of the conductive vias 14. In this embodiment, the plurality of conductive holes 14 are arranged in a single row, uniformly spaced, and surrounding the accommodating area 101.
In this embodiment, a first conductive passivation layer 125 is formed on the surface of each of the pads 124, and a conductive passivation layer 135 is formed on the surface of each of the pads 124.
In one embodiment, the first conductive trace pattern 12 may be made of two layers of conductive materials, for example, may include a first metal film layer and a first plating layer formed on a surface of the first metal film layer by electroplating, and the second conductive trace pattern 13 may also be made of two layers of conductive materials, for example, may include a second metal film layer and a second plating layer formed on a surface of the second metal film layer by electroplating.
Preferably, the material of the substrate layer 11 is transparent PET or PEN; more preferably, transparent PET; in an embodiment, the two opposite surfaces of the substrate layer 11 made of PET may further include a PEI film layer respectively.
According to the electromagnetic shielding cover and the manufacturing method thereof, the electromagnetic shielding cover in the containing area bulges to form a containing space, so that components on a circuit board connected with the electromagnetic shielding cover can be contained and protected, and the electromagnetic shielding cover can be well matched with the circuit board; the double-sided conductive circuit design is adopted, and the two conductive circuits are electrically connected through the conductive holes, so that the shielding effect of the electromagnetic shielding cover is better and stronger, and the design of the conductive holes is also beneficial to heat dissipation; the transparency of the electromagnetic shielding grid in the technical scheme can reach 80-95%.
It is understood that various other changes and modifications may be made by those skilled in the art based on the technical idea of the present invention, and all such changes and modifications should fall within the protective scope of the claims of the present invention.
Claims (18)
1. A method of making an electromagnetic shield for electrically connecting a circuit board having electronic components and providing electromagnetic shielding for the electronic components of the circuit board, comprising the steps of:
manufacturing a substrate, wherein the substrate comprises a substrate layer made of transparent materials and a first conducting layer formed on the surface of one side of the substrate layer, an accommodating area is divided on the substrate, the substrate further comprises a second conducting layer and a plurality of conducting holes, the second conducting layer and the plurality of conducting holes are formed on the surface of the other side, opposite to the surface of the substrate layer, of the substrate, each conducting hole is electrically connected with the first conducting layer and the second conducting layer, the substrate is further artificially divided into an auxiliary area connected with the accommodating area, and the plurality of conducting holes are located in the auxiliary area;
manufacturing the first conducting layer to form a first conducting circuit pattern, wherein the first conducting circuit pattern comprises a first electromagnetic shielding grid, the first electromagnetic shielding grid is formed in the accommodating area, manufacturing the second conducting layer to form a second conducting circuit pattern, and at the moment, each conducting hole is electrically connected with the first conducting circuit pattern and the second conducting circuit pattern; and
the substrate after the first conducting circuit pattern is manufactured through hot extrusion treatment is extruded and bulges at the position corresponding to the accommodating area, and an electromagnetic shielding cover is obtained; the bulging part of the electromagnetic shielding cover encloses an accommodating space which is used for shielding and accommodating the electronic element on the circuit board.
2. The method of claim 1, wherein the second conductive trace pattern comprises a second electromagnetic shielding mesh, and the second electromagnetic shielding mesh is also formed in the receiving area.
3. The method of claim 2, wherein the first conductive trace pattern further comprises a plurality of electrical connection pads electrically connected to the first electromagnetic shielding mesh, the plurality of electrical connection pads being formed in the auxiliary region; the second conductive circuit pattern further comprises a plurality of electrical contact pads electrically connected with the second electromagnetic shielding grid, and the plurality of electrical contact pads are all formed in the auxiliary area; each of the electrical connection pads is electrically connected to one of the electrical connection pads through one of the conductive vias.
4. The method of manufacturing an electromagnetic shield according to claim 3, wherein before the thermal pressing process of the substrate on which the first conductive trace pattern is formed, further comprising the steps of: and performing surface treatment on the plurality of electrical contact pads so as to form a conductive protection layer on the surface of each electrical contact pad.
5. The method of fabricating an electromagnetic shield of claim 1, wherein the method of fabricating the substrate comprises the steps of: providing the substrate layer; then, metallizing the surfaces of two opposite sides of the substrate layer, so as to form a first metal film layer and a second metal film layer on the two opposite sides of the substrate layer respectively; drilling to form a through hole which sequentially penetrates through the first metal film layer, the base material layer and the second metal film layer; then, electroplating so as to form a first electroplated layer and a second electroplated layer on the two opposite side surfaces of the metalized substrate layer respectively and also form an electroplated layer in the through hole so as to form a conductive hole in the through hole; the first conductive layer includes the first electroplated layer and the first metal film layer, and the second conductive layer includes the second electroplated layer and the second metal film layer.
6. The method of fabricating an electromagnetic shield of claim 1, wherein the method of fabricating the substrate comprises the steps of: providing the substrate layer; drilling a hole in the substrate layer to form a through hole penetrating through the substrate layer; then, metallizing the surfaces of two opposite sides of the substrate layer and the hole walls of the through holes, so as to form a first metal film layer and a second metal film layer on the two opposite sides of the substrate layer respectively, and form hole wall metal film layers on the hole walls of the through holes; then, electroplating to form a first electroplated layer and a second conductive layer on the two opposite side surfaces of the metalized base material layer respectively, and forming an in-hole electroplated layer in the metalized through hole to form a conductive hole in the through hole; the first conductive layer comprises the first electroplated layer and a first metal film layer, and the second conductive layer comprises a second electroplated layer and a second metal film layer.
7. A method of forming an electromagnetic shield according to any one of claims 5 or 6, wherein the metalizing comprises: immersing the substrate layer in a mixed solution containing polyethyleneimine resin, epichlorohydrin, ethanol and dimethylformamide so as to form a PEI (polyetherimide) film layer on each of the two opposite side surfaces of the substrate layer; and then respectively forming a first metal film layer and a second metal film layer on the PEI film layers on the surfaces of the two sides of the base material layer in a chemical copper plating mode.
8. The method of claim 1, wherein the first electromagnetic shielding grid is a repeating grid pattern formed by intersecting a plurality of first shielding lines, and the line width of each first shielding line is smaller than the distance between adjacent first shielding lines.
9. The method of claim 8, wherein the line width of each of the first shielding lines is in a range of 1 micron to 25 microns, and the distance between adjacent first shielding lines is in a range of 200 microns to 1000 microns.
10. An electromagnetic shielding cover is used for electrically connecting a circuit board with electronic elements and providing electromagnetic shielding for the electronic elements of the circuit board and comprises a base material layer made of transparent materials and a first conducting circuit pattern formed on the surface of one side of the base material layer; the electromagnetic shielding cover is provided with an accommodating area; the first conductive circuit pattern comprises a first electromagnetic shielding grid, and the first electromagnetic shielding grid is formed in the accommodating area; the electromagnetic shielding cover is characterized in that a containing space is formed by bulging the position of the containing area, the containing space is used for shielding and containing electronic elements on the circuit board, the electromagnetic shielding cover further comprises a second conducting circuit pattern and a plurality of conducting holes, the second conducting circuit pattern and the plurality of conducting holes are formed in the surface of the opposite side, opposite to the substrate layer, of the substrate layer, each conducting hole is electrically connected with the first conducting circuit pattern and the second conducting circuit pattern, the electromagnetic shielding cover is further divided into auxiliary areas connected with the containing areas manually, and the plurality of conducting holes are located in the auxiliary areas.
11. The electromagnetic shield of claim 10, wherein the second conductive trace pattern comprises a second electromagnetic shielding mesh also formed within the receiving area.
12. The electromagnetic shield of claim 11, wherein the first conductive trace pattern further comprises a plurality of electrical connection pads electrically connected to the first electromagnetic shield mesh, the plurality of electrical connection pads being formed in the auxiliary region; the second conductive circuit pattern further comprises a plurality of electrical contact pads electrically connected with the second electromagnetic shielding grid, and the plurality of electrical contact pads are all formed in the auxiliary area; each of the electrical connection pads is electrically connected to one of the electrical connection pads through one of the conductive vias.
13. The electromagnetic shield of claim 12 wherein a conductive protective layer is formed on a surface of each of said electrical contact pads.
14. The electromagnetic shield according to claim 11, wherein said first electromagnetic shielding grid is a repeating grid pattern formed by a plurality of crossing first shielding lines, each of said first shielding lines having a line width smaller than a distance between adjacent ones of said first shielding lines; the second electromagnetic shielding grid is a repeated grid pattern formed by a plurality of second shielding lines in a crossed mode, and the line width of each second shielding line is smaller than the distance between every two adjacent second shielding lines.
15. The electromagnetic shield of claim 14, wherein each of the first shielding lines has a line width in a range of 1 micron to 25 microns, and a spacing between adjacent ones of the first shielding lines is in a range of 200 microns to 1000 microns; the line width range of each second shielding line is 1 micrometer to 25 micrometers, and the distance range between every two adjacent second shielding lines is 200 micrometers to 1000 micrometers.
16. The electromagnetic shield of claim 10, wherein said first electromagnetic shielding grid is a repeating checkered pattern of intersecting first shielding lines, each of said first shielding lines having a line width less than a spacing between adjacent ones of said first shielding lines.
17. The electromagnetic shield of claim 16, wherein each of the first shielding lines has a line width in a range of 1 micron to 25 microns, and a spacing between adjacent ones of the first shielding lines is in a range of 200 microns to 1000 microns.
18. The electromagnetic shield of claim 10 wherein said first conductive trace pattern comprises a first plated layer and a first metal film layer and said second conductive trace pattern comprises a second plated layer and a second metal film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710116287.8A CN108541205B (en) | 2017-03-01 | 2017-03-01 | Electromagnetic shielding case and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710116287.8A CN108541205B (en) | 2017-03-01 | 2017-03-01 | Electromagnetic shielding case and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108541205A CN108541205A (en) | 2018-09-14 |
| CN108541205B true CN108541205B (en) | 2020-05-22 |
Family
ID=63488413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710116287.8A Active CN108541205B (en) | 2017-03-01 | 2017-03-01 | Electromagnetic shielding case and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108541205B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110715675A (en) * | 2019-09-09 | 2020-01-21 | 北京金钢科技有限公司 | Hollow magnetic encoder with shielding |
| CN111653552B (en) * | 2020-06-16 | 2022-06-10 | 西安科技大学 | Square flat chip packaging structure with high electromagnetic pulse interference resistance |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102334091A (en) * | 2009-02-26 | 2012-01-25 | 3M创新有限公司 | Touch panel sensor with have a patterned substrate of the little pattern of covering of low visibility |
| CN203788636U (en) * | 2013-11-29 | 2014-08-20 | 优创贸易（深圳）有限公司 | Shielding case |
| CN104936425A (en) * | 2014-03-17 | 2015-09-23 | 三星电子株式会社 | Shield can, electronic device, and manufacturing method thereof |
| CN105684566A (en) * | 2013-09-25 | 2016-06-15 | 大自达电线股份有限公司 | Shielding housing, printed circuit board, electronic device, and method for manufacturing shielding housing |
| CN105960155A (en) * | 2016-05-30 | 2016-09-21 | 天诺光电材料股份有限公司 | Flexible transparent conductive material for electromagnetic shielding window, and preparation method |
| CN106409774A (en) * | 2015-07-31 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Shielding cover, packaging structure, and manufacturing method of packaging structure |
-
2017
- 2017-03-01 CN CN201710116287.8A patent/CN108541205B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102334091A (en) * | 2009-02-26 | 2012-01-25 | 3M创新有限公司 | Touch panel sensor with have a patterned substrate of the little pattern of covering of low visibility |
| CN105684566A (en) * | 2013-09-25 | 2016-06-15 | 大自达电线股份有限公司 | Shielding housing, printed circuit board, electronic device, and method for manufacturing shielding housing |
| CN203788636U (en) * | 2013-11-29 | 2014-08-20 | 优创贸易（深圳）有限公司 | Shielding case |
| CN104936425A (en) * | 2014-03-17 | 2015-09-23 | 三星电子株式会社 | Shield can, electronic device, and manufacturing method thereof |
| CN106409774A (en) * | 2015-07-31 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Shielding cover, packaging structure, and manufacturing method of packaging structure |
| CN105960155A (en) * | 2016-05-30 | 2016-09-21 | 天诺光电材料股份有限公司 | Flexible transparent conductive material for electromagnetic shielding window, and preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108541205A (en) | 2018-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102057483B (en) | Multilayer wiring board | |
| CN104349575B (en) | Flexible PCB and preparation method thereof | |
| CN104754855A (en) | Flexible circuit board and manufacturing method thereof | |
| CN110402615B (en) | Printed circuit board for high-frequency transmission | |
| TWI484875B (en) | Circuit board and method for manufacturing same | |
| US11019731B2 (en) | Printed circuit board and method of fabricating the same | |
| CN109769344B (en) | Circuit board and manufacturing method thereof | |
| KR102371134B1 (en) | Printed wiring board and method for manufacturing same | |
| CN103796451A (en) | Printed wiring board and method for manufacturing printed wiring board | |
| CN108541205B (en) | Electromagnetic shielding case and manufacturing method thereof | |
| CN104425286A (en) | IC carrier plate, semiconductor device having the same and manufacturing method of the IC carrier plate | |
| CN103929895A (en) | Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element | |
| CN102469691A (en) | Printed circuit board and method of manufacturing the same | |
| CN105592620A (en) | Circuit board and manufacturing method thereof | |
| CN113597085A (en) | Transmission circuit board and manufacturing method thereof | |
| CN109219329B (en) | Method for manufacturing circuit board | |
| CN114451074A (en) | Interposer, interposer manufacturing method and circuit board assembly | |
| KR20140118161A (en) | Printed circuit board and method for manufacturing the same | |
| CN214228531U (en) | Copper-nickel alloy flexible circuit board | |
| US20210120677A1 (en) | Printed circuit board and method of manufacturing the same | |
| CN111447753A (en) | Circuit board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190109 Address after: 223065 No. 11 Honghai North Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Qing Ding precision electronic (Huaian) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518105 Building A1 to A3 of Pengding Park Factory Building, Songluo Road, Yanchuan Community, Yanluo Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |