WO1997025847A1 - Shielding of electronic components embedded in plastics directly on circuit board - Google Patents
Shielding of electronic components embedded in plastics directly on circuit board Download PDFInfo
- Publication number
- WO1997025847A1 WO1997025847A1 PCT/SE1997/000015 SE9700015W WO9725847A1 WO 1997025847 A1 WO1997025847 A1 WO 1997025847A1 SE 9700015 W SE9700015 W SE 9700015W WO 9725847 A1 WO9725847 A1 WO 9725847A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- electronic components
- shielding
- insulating polymer
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01063—Europium [Eu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Definitions
- a meaning with the current invention is to considerably simplify and reduce cost for shielding of components on the lowest possible system level.
- This seal is equipped with a thin layer of a conductive polymer, e.g. silver epoxy which is connected to a ground terminal on the printed circuit board.
- a conductive polymer e.g. silver epoxy which is connected to a ground terminal on the printed circuit board.
- Other types of polymer seals which is done partially can also be used e.g. on assembly of direct bumped chips i.e. flip-chip. Eventually a thin insulating varnish needs to be applied, before the conductive polymer layer is applied.
- FIG. 1 shows a chip direct bonded on the printed circuit board and then sealed with an insulating polymer.
- Fig.2 shows a so called flip-chip mounted chip. This has then been covered partially with an insulating polymer and conductive polymer on top of the assembly.
- Fig 3 shows a direct mounted passive component which globtop has been equipped with a conductive polymer to give the shielding for the component.
- Fig.l shows a direct bonded chip 3, on a printed circuit board 1, which has been equipped with an insulating polymer 2, of e.g. epoxy, to give the chip 3 that environmental protection it needs.
- an insulating polymer 2 of e.g. epoxy
- a conductive polymer 4 which is connected to a ground terminal 7 on the printed circuit board 1
- the conductive polymer 4 can be a metal filled epoxy polymer.
- Fig 2 shows a bumped chip 3 mounted as a so called flip-chip. This type of assembly is then covered on the underside and the edges with an insulating polymer 2, i.e. underfiller.
- the top side of the chip 3 is equipped with an insulating varnish, if the chip design so requires, before the conductive polymer 4 is applied and connected to a ground terminal 7 on the printed circuit board.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU13251/97A AU1325197A (en) | 1996-01-08 | 1997-01-08 | Shielding of electronic components embedded in plastics directly on circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9600085A SE9600085D0 (en) | 1996-01-08 | 1996-01-08 | Shielding of electronic components that are baked directly on PCBs |
SE9600085-6 | 1996-01-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997025847A1 true WO1997025847A1 (en) | 1997-07-17 |
Family
ID=20400981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE1997/000015 WO1997025847A1 (en) | 1996-01-08 | 1997-01-08 | Shielding of electronic components embedded in plastics directly on circuit board |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1325197A (en) |
SE (1) | SE9600085D0 (en) |
WO (1) | WO1997025847A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000013233A1 (en) * | 1998-08-28 | 2000-03-09 | Amkor Technology, Inc. | Electromagnetic interference shield device and method |
EP1120831A2 (en) * | 2000-01-24 | 2001-08-01 | Infineon Technologies AG | Electronic component with an electromagnetic shielding device |
EP1160859A2 (en) * | 2000-05-30 | 2001-12-05 | Alps Electric Co., Ltd. | Surface-mounting type electronic circuit unit suitable for miniaturization and easy to manufacture |
US6448635B1 (en) | 1999-08-30 | 2002-09-10 | Amkor Technology, Inc. | Surface acoustical wave flip chip |
WO2003026006A2 (en) * | 2001-08-30 | 2003-03-27 | Infineon Technologies Ag | Arrangement of a semiconductor in a housing, chip card and chip module |
EP2043149A1 (en) * | 2007-09-27 | 2009-04-01 | Oticon A/S | Assembly comprising an electromagnetically screened smd component, method of manufacturing the same and use |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4959752A (en) * | 1988-10-24 | 1990-09-25 | Digital Equipment Corporation | Electronic module RFI/EMI shielding |
US5177324A (en) * | 1991-08-19 | 1993-01-05 | Motorola, Inc. | In situ RF shield for printed circuit board |
DE4016953C2 (en) * | 1990-05-25 | 1993-05-13 | Deutsche Itt Industries Gmbh, 7800 Freiburg, De | |
US5287247A (en) * | 1990-09-21 | 1994-02-15 | Lsi Logic Corporation | Computer system module assembly |
-
1996
- 1996-01-08 SE SE9600085A patent/SE9600085D0/en unknown
-
1997
- 1997-01-08 AU AU13251/97A patent/AU1325197A/en not_active Abandoned
- 1997-01-08 WO PCT/SE1997/000015 patent/WO1997025847A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4959752A (en) * | 1988-10-24 | 1990-09-25 | Digital Equipment Corporation | Electronic module RFI/EMI shielding |
DE4016953C2 (en) * | 1990-05-25 | 1993-05-13 | Deutsche Itt Industries Gmbh, 7800 Freiburg, De | |
US5287247A (en) * | 1990-09-21 | 1994-02-15 | Lsi Logic Corporation | Computer system module assembly |
US5177324A (en) * | 1991-08-19 | 1993-01-05 | Motorola, Inc. | In situ RF shield for printed circuit board |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000013233A1 (en) * | 1998-08-28 | 2000-03-09 | Amkor Technology, Inc. | Electromagnetic interference shield device and method |
US6092281A (en) * | 1998-08-28 | 2000-07-25 | Amkor Technology, Inc. | Electromagnetic interference shield driver and method |
US6472598B1 (en) | 1998-08-28 | 2002-10-29 | Amkor Technology, Inc. | Electromagnetic interference shield device with conductive encapsulant and dam |
US6601293B1 (en) | 1998-08-28 | 2003-08-05 | Amkor Technology, Inc. | Method of making an electromagnetic interference shield device |
US6448635B1 (en) | 1999-08-30 | 2002-09-10 | Amkor Technology, Inc. | Surface acoustical wave flip chip |
EP1120831A2 (en) * | 2000-01-24 | 2001-08-01 | Infineon Technologies AG | Electronic component with an electromagnetic shielding device |
EP1120831A3 (en) * | 2000-01-24 | 2003-12-17 | Infineon Technologies AG | Electronic component with an electromagnetic shielding device |
EP1160859A2 (en) * | 2000-05-30 | 2001-12-05 | Alps Electric Co., Ltd. | Surface-mounting type electronic circuit unit suitable for miniaturization and easy to manufacture |
EP1160859A3 (en) * | 2000-05-30 | 2005-03-30 | Alps Electric Co., Ltd. | Surface-mounting type electronic circuit unit suitable for miniaturization and easy to manufacture |
WO2003026006A2 (en) * | 2001-08-30 | 2003-03-27 | Infineon Technologies Ag | Arrangement of a semiconductor in a housing, chip card and chip module |
WO2003026006A3 (en) * | 2001-08-30 | 2003-08-07 | Infineon Technologies Ag | Arrangement of a semiconductor in a housing, chip card and chip module |
EP2043149A1 (en) * | 2007-09-27 | 2009-04-01 | Oticon A/S | Assembly comprising an electromagnetically screened smd component, method of manufacturing the same and use |
Also Published As
Publication number | Publication date |
---|---|
AU1325197A (en) | 1997-08-01 |
SE9600085D0 (en) | 1996-01-08 |
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