JPS6484689A - Printed wiring board for high speed signal transmission - Google Patents

Printed wiring board for high speed signal transmission

Info

Publication number
JPS6484689A
JPS6484689A JP62240841A JP24084187A JPS6484689A JP S6484689 A JPS6484689 A JP S6484689A JP 62240841 A JP62240841 A JP 62240841A JP 24084187 A JP24084187 A JP 24084187A JP S6484689 A JPS6484689 A JP S6484689A
Authority
JP
Japan
Prior art keywords
wiring
signal transmission
high speed
tab
enable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62240841A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Saito
Tomoaki Takubo
Toshio Sudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62240841A priority Critical patent/JPS6484689A/en
Publication of JPS6484689A publication Critical patent/JPS6484689A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations

Landscapes

  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To enable both increasing of the number of input terminals and high packaging density to be easily achieved and to enable the high speed of chip to be sufficiently exhibited, by applying TAB (Tape Automated Bonding) system, and forming feed through wiring on a TAB board. CONSTITUTION:After a copper foil is stuck on a resin film 1 to form a wiring pattern 2, polyimide 6 is coated over the surface on the side of the wiring, and again, copper foils 3 and 5 are thereafter stuck on the upper and lower surfaces, respectively, to form a TAB board. A ground conductor wiring 3 and a rear ground conductor wiring 5 are connected each other through a plurality of through hole conductors 9. An integrated circuit device 7 and a signal transmission wiring 2 are connected each other through bump electrodes 8 which are formed on element electrodes. The space, width, thickness and the like of the signal transmission wiring 2, the ground conductors 3, 5, and the through hole conductors 9 are so selected, respectively, as to produce a predetermined characteristic impedance, thereby these elements form strip transmission lines.
JP62240841A 1987-09-28 1987-09-28 Printed wiring board for high speed signal transmission Pending JPS6484689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62240841A JPS6484689A (en) 1987-09-28 1987-09-28 Printed wiring board for high speed signal transmission

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62240841A JPS6484689A (en) 1987-09-28 1987-09-28 Printed wiring board for high speed signal transmission

Publications (1)

Publication Number Publication Date
JPS6484689A true JPS6484689A (en) 1989-03-29

Family

ID=17065499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62240841A Pending JPS6484689A (en) 1987-09-28 1987-09-28 Printed wiring board for high speed signal transmission

Country Status (1)

Country Link
JP (1) JPS6484689A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0457593A2 (en) * 1990-05-18 1991-11-21 Shinko Electric Industries Co. Ltd. Lead frame and assembly process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0457593A2 (en) * 1990-05-18 1991-11-21 Shinko Electric Industries Co. Ltd. Lead frame and assembly process
US5281556A (en) * 1990-05-18 1994-01-25 Shinko Electric Industries Co., Ltd. Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane

Similar Documents

Publication Publication Date Title
EP0198621B1 (en) Semiconductor device
KR890011064A (en) Semiconductor device and manufacturing method
EP0598914A4 (en) Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board.
GB1501500A (en) Multilayer printed circuit boards
GB1269592A (en) Sub-element for electronic circuit board
SG72713A1 (en) Multilayer printed-circuit board and method of fabricating the multilayer printed-circuit board
EP0126164A4 (en) Method of connecting double-sided circuits.
EP1041618A4 (en) Semiconductor device and manufacturing method thereof, circuit board and electronic equipment
JPS6484625A (en) Semiconductor integrated circuit device using film carrier
JPS6484689A (en) Printed wiring board for high speed signal transmission
US4829405A (en) Tape automated bonding package
JPS5930555Y2 (en) Printed board
GB1220370A (en) Electrical circuit boards
JPS6453493A (en) Wiring board for surface packaging
JPS6286793A (en) Mounting methed of electronic part
JPS6414934A (en) Semiconductor integrated circuit device and film carrier tape
JPS5636147A (en) Semiconductor device and its manufacture
JPS625339B2 (en)
JPH0425144A (en) Semiconductor device using tape for three-layer tab and manufacture of tape for three-layer tab
JP2908918B2 (en) Thick film thin film hybrid multilayer circuit board
JPH04306506A (en) Flat cable
JPS6459985A (en) Printed wiring board for ic card
JPS59135791A (en) Flexible jumper
JPH05259214A (en) Semiconductor device
JPS6298691A (en) Wiring board