JPS6459985A - Printed wiring board for ic card - Google Patents

Printed wiring board for ic card

Info

Publication number
JPS6459985A
JPS6459985A JP62217232A JP21723287A JPS6459985A JP S6459985 A JPS6459985 A JP S6459985A JP 62217232 A JP62217232 A JP 62217232A JP 21723287 A JP21723287 A JP 21723287A JP S6459985 A JPS6459985 A JP S6459985A
Authority
JP
Japan
Prior art keywords
card
wiring board
printed wiring
patterns
mischief
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62217232A
Other languages
Japanese (ja)
Other versions
JP2517306B2 (en
Inventor
Atsushi Hiroi
Yasuhiro Horiba
Nobuhito Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62217232A priority Critical patent/JP2517306B2/en
Publication of JPS6459985A publication Critical patent/JPS6459985A/en
Application granted granted Critical
Publication of JP2517306B2 publication Critical patent/JP2517306B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To realize an IC card with a smooth surface and a fine appearance and avoid the breakdown of the IC card caused by a mischief from curiosity by a method wherein the electric signal transmission patterns of the printed wiring board for the IC card are branched or patterns which do not contribute to the electric signal transmission are formed to reduce the unevenness of the surface of a packaging film. CONSTITUTION:After a hole 2 for mounting a semiconductor is formed in a printed wiring board 1 made of glass-epoxy resin, polyester resin or the like by punching or drilling, a copper foil which is a metal foil is applied by pressing. An etching mask which has portions forming gaps 3a to cut off the continuity between the metal foil patterns is composed of a dry film or a film of photosensitive resin such as liquid resist and applied and required conductor patterns are formed by etching. After that, necessary plating is applied with Au, Su, copper, solder or the like to complete the printed wiring board for an IC card. With this constitution, the unevenness of the surface of the IC card can be significantly reduced and the appearance can be significantly improved and, moreover, the breakdown of the IC card caused by a mischief can be avoided.
JP62217232A 1987-08-31 1987-08-31 Printed wiring board for IC card Expired - Lifetime JP2517306B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62217232A JP2517306B2 (en) 1987-08-31 1987-08-31 Printed wiring board for IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62217232A JP2517306B2 (en) 1987-08-31 1987-08-31 Printed wiring board for IC card

Publications (2)

Publication Number Publication Date
JPS6459985A true JPS6459985A (en) 1989-03-07
JP2517306B2 JP2517306B2 (en) 1996-07-24

Family

ID=16700920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62217232A Expired - Lifetime JP2517306B2 (en) 1987-08-31 1987-08-31 Printed wiring board for IC card

Country Status (1)

Country Link
JP (1) JP2517306B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214187A (en) * 1989-02-15 1990-08-27 Matsushita Electric Works Ltd Printed-wiring board
US5508545A (en) * 1992-11-13 1996-04-16 Nippon Steel Corporation Semiconductor device including a pair of transistors having a common channel region, and method of making the same
JP2012194743A (en) * 2011-03-16 2012-10-11 Toyo Aluminium Kk Method for manufacturing inlet antenna for rfid

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214187A (en) * 1989-02-15 1990-08-27 Matsushita Electric Works Ltd Printed-wiring board
US5508545A (en) * 1992-11-13 1996-04-16 Nippon Steel Corporation Semiconductor device including a pair of transistors having a common channel region, and method of making the same
JP2012194743A (en) * 2011-03-16 2012-10-11 Toyo Aluminium Kk Method for manufacturing inlet antenna for rfid

Also Published As

Publication number Publication date
JP2517306B2 (en) 1996-07-24

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