JPS6464298A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS6464298A
JPS6464298A JP22152387A JP22152387A JPS6464298A JP S6464298 A JPS6464298 A JP S6464298A JP 22152387 A JP22152387 A JP 22152387A JP 22152387 A JP22152387 A JP 22152387A JP S6464298 A JPS6464298 A JP S6464298A
Authority
JP
Japan
Prior art keywords
insulative substrate
sheathing resin
integrated circuit
clip terminal
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22152387A
Other languages
Japanese (ja)
Inventor
Hiromi Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP22152387A priority Critical patent/JPS6464298A/en
Publication of JPS6464298A publication Critical patent/JPS6464298A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

PURPOSE:To obtain shielding effect, and enable the miniaturization of hybrid integrated circuit, by forming a metal coating film by surface plating method of sheathing resin. CONSTITUTION:On an insulative substrate 1, an active element 2, like semiconductor element, and a passive element like resistor or capacitance are mounted, which are soldered by solder reflow method. A clip terminal 4 whose tip is made to protrude along the insulative substrate is fixed and soldered to connect to an external connection terminal formed on the edge part of one side on the insulative substrate 1. In the state where a tip of the clip terminal 4 is exposed, sheathing resin 5 like epoxy is formed on the outer peripheral part of the insulative substrate 1 so as to cover the active element 2 and the passive element 3. Next, by plating method, a metal coating film 6 of copper is formed on the surface of the sheathing resin 5 excepting the vicinity of a leading-out part of the clip terminal 4 from the sheathing resin 5.
JP22152387A 1987-09-03 1987-09-03 Hybrid integrated circuit Pending JPS6464298A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22152387A JPS6464298A (en) 1987-09-03 1987-09-03 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22152387A JPS6464298A (en) 1987-09-03 1987-09-03 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS6464298A true JPS6464298A (en) 1989-03-10

Family

ID=16768047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22152387A Pending JPS6464298A (en) 1987-09-03 1987-09-03 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS6464298A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486400B1 (en) * 2001-03-16 2005-04-29 마쯔시다덴기산교 가부시키가이샤 High-frequency module and manufacturing method thereof
US8884424B2 (en) 2010-01-13 2014-11-11 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US9070793B2 (en) 2010-08-02 2015-06-30 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having electromagnetic interference shielding and related methods
US9349611B2 (en) 2010-03-22 2016-05-24 Advanced Semiconductor Engineering, Inc. Stackable semiconductor package and manufacturing method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486400B1 (en) * 2001-03-16 2005-04-29 마쯔시다덴기산교 가부시키가이샤 High-frequency module and manufacturing method thereof
US8884424B2 (en) 2010-01-13 2014-11-11 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US9196597B2 (en) 2010-01-13 2015-11-24 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US9349611B2 (en) 2010-03-22 2016-05-24 Advanced Semiconductor Engineering, Inc. Stackable semiconductor package and manufacturing method thereof
US9070793B2 (en) 2010-08-02 2015-06-30 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having electromagnetic interference shielding and related methods

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