JPH01161707A - Chip component - Google Patents

Chip component

Info

Publication number
JPH01161707A
JPH01161707A JP32033787A JP32033787A JPH01161707A JP H01161707 A JPH01161707 A JP H01161707A JP 32033787 A JP32033787 A JP 32033787A JP 32033787 A JP32033787 A JP 32033787A JP H01161707 A JPH01161707 A JP H01161707A
Authority
JP
Japan
Prior art keywords
leads
component
chip component
soldering
component body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32033787A
Other languages
Japanese (ja)
Inventor
Fushimi Yamauchi
山内　節美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP32033787A priority Critical patent/JPH01161707A/en
Priority to US07/271,748 priority patent/US4898837A/en
Publication of JPH01161707A publication Critical patent/JPH01161707A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To improve mounting efficiency by bending leads at the side of a component body. CONSTITUTION:A component body 1 and leads 2 bent inside the body 1 are provided. For example, a chip component is formed in a structure in which the leads 2 are disposed at the lower side of the body 1. Thus, solder 3 is introduced to the side faces of the leads 2 and the lower part of the body 1 to be effectively connected by soldering to a printed substrate 4 as shown at the time of soldering. Since the leads do not include larger mounting area than a conventional chip component disposed out of the body 1, the mounting efficiency can be improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、チップ部品、特に電子機器に使用されるチッ
プトランジスタ、ダイオードなどリード形状を有するチ
ップ部品に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to chip components, particularly chip components having lead shapes such as chip transistors and diodes used in electronic equipment.

〔従来の技術〕[Conventional technology]

従来のチップ部品は、例えばトランジスタ、ダイオード
のようなものでは、第３図に示すようにリード２が部品
本体１の外になるような構造となっている。Conventional chip components, such as transistors and diodes, have a structure in which leads 2 are outside the component body 1, as shown in FIG.

しかしながら、このような上述した従来のチップ部品は
、リードが部品本体の外になるため実装面積をとるとい
う欠点がある。However, the above-mentioned conventional chip components have the disadvantage that the leads are located outside the component body and therefore take up a large amount of mounting area.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のチップ部品はリードを部品本体の下側にくる構
造となっている。The chip component of the present invention has a structure in which the leads are placed below the component body.

〔実施例〕〔Example〕

次に、本発明の実施例について、図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.

第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.

第１図に示すチップ部品は、部品本体１の下側にリード
２がくるような構造となっていて、半田付時は第２図に
示すようにリード２の側面および部品本体１の下部に半
田３が回りプリント基板４と確実に半田接続される。The chip component shown in FIG. 1 has a structure in which the leads 2 are placed below the component body 1, and when soldering, the leads 2 are placed on the side surface of the lead 2 and the bottom of the component body 1 as shown in FIG. The solder 3 rotates and is reliably soldered connected to the printed circuit board 4.

〔発明の効果〕〔Effect of the invention〕

本発明のチップ部品は、リードを部品本体の側に曲げる
ことにより実装効率を向上できるという効果がある。The chip component of the present invention has the effect that mounting efficiency can be improved by bending the leads toward the component body.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例を示す斜視図、第２図は第１
図に示す実施例の一実施例を示す正面図、第３図は従来
の一例を示す斜視図である。 １・・・・・・部品本体、２・・・・・・リード、３・
・・・・・半田、４・・・・・・プリント基板。 代理人　弁理士　　内　原　　　音FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
FIG. 3 is a front view showing an example of the embodiment shown in the figure, and FIG. 3 is a perspective view showing an example of the conventional method. 1...Part body, 2...Lead, 3.
...Solder, 4...Printed circuit board. Agent Patent Attorney Oto Uchihara

Claims (1)

【特許請求の範囲】[Claims] 部品本体と、前記部品本体の内側に曲げられたリードと
を含むことを特徴とするチップ部品。A chip component comprising a component body and a lead bent inside the component body.
JP32033787A 1987-11-19 1987-12-17 Chip component Pending JPH01161707A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP32033787A JPH01161707A (en) 1987-12-17 1987-12-17 Chip component
US07/271,748 US4898837A (en) 1987-11-19 1988-11-15 Method of fabricating a semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32033787A JPH01161707A (en) 1987-12-17 1987-12-17 Chip component

Publications (1)

Publication Number Publication Date
JPH01161707A true JPH01161707A (en) 1989-06-26

Family

ID=18120356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32033787A Pending JPH01161707A (en) 1987-11-19 1987-12-17 Chip component

Country Status (1)

Country Link
JP (1) JPH01161707A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279303A (en) * 1991-06-14 1994-01-18 Colin Electronics Co., Ltd. Blood pressure monitor system
US5590661A (en) * 1994-07-29 1997-01-07 Colin Corporation Blood pressure measuring apparatus
DE10393769B4 (en) * 2002-11-22 2012-09-27 International Rectifier Corporation Semiconductor device with terminals for connection to external elements

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279303A (en) * 1991-06-14 1994-01-18 Colin Electronics Co., Ltd. Blood pressure monitor system
US5590661A (en) * 1994-07-29 1997-01-07 Colin Corporation Blood pressure measuring apparatus
DE10393769B4 (en) * 2002-11-22 2012-09-27 International Rectifier Corporation Semiconductor device with terminals for connection to external elements

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