JPH03129866A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH03129866A
JPH03129866A JP26959989A JP26959989A JPH03129866A JP H03129866 A JPH03129866 A JP H03129866A JP 26959989 A JP26959989 A JP 26959989A JP 26959989 A JP26959989 A JP 26959989A JP H03129866 A JPH03129866 A JP H03129866A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
semiconductor device
bent
outer leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26959989A
Other languages
Japanese (ja)
Inventor
Tomoharu Fukuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP26959989A priority Critical patent/JPH03129866A/en
Publication of JPH03129866A publication Critical patent/JPH03129866A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE: To enable a large number of semiconductor devices to be mounted on a printed circuit board taking advantage of not only the front but also the rear of the printed board by a method wherein the outer leads of the semiconductor device are so bent as to come into close contact with the side from which they extend and the other side vertical to the former side.
CONSTITUTION: Outer leads 2a extending from one side of an outer body 1 of a semiconductor device are bent along the side concerned and the tips of the bent outer leads 2a are bent back along a side face vertical to the side concerned. When the semiconductor device is mounted on a printed circuit board 3, the bent parts of the outer leads 3 are brought into close contact with the pad of the printed circuit board 3 and soldered, so that the semiconductor device can be mounted without protruding the outer leads 3 from the rear side of the printed circuit board 3. By this setup, the rear of the printed circuit board 3 which can not be usually used can be effectively utilized, so that the mounted semiconductor devices can be increased in number.
COPYRIGHT: (C)1991,JPO&Japio
JP26959989A 1989-10-16 1989-10-16 Semiconductor device Pending JPH03129866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26959989A JPH03129866A (en) 1989-10-16 1989-10-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26959989A JPH03129866A (en) 1989-10-16 1989-10-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH03129866A true JPH03129866A (en) 1991-06-03

Family

ID=17474608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26959989A Pending JPH03129866A (en) 1989-10-16 1989-10-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH03129866A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349235A (en) * 1992-09-08 1994-09-20 Samsung Electronics Co., Ltd. High density vertically mounted semiconductor package
US5574310A (en) * 1991-05-17 1996-11-12 Fujitsu Limited Semiconductor package for surface mounting with reinforcing members on support legs
US5592019A (en) * 1994-04-19 1997-01-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and module
US5831332A (en) * 1991-05-17 1998-11-03 Fujitsu Limited Semiconductor package for surface mounting
JP2008232573A (en) * 2007-03-22 2008-10-02 Osaka Gas Co Ltd Absorption refrigerating machine
JP2009068723A (en) * 2007-09-10 2009-04-02 Osaka Gas Co Ltd Absorption refrigerator

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5574310A (en) * 1991-05-17 1996-11-12 Fujitsu Limited Semiconductor package for surface mounting with reinforcing members on support legs
US5831332A (en) * 1991-05-17 1998-11-03 Fujitsu Limited Semiconductor package for surface mounting
US5861669A (en) * 1991-05-17 1999-01-19 Fujitsu Limited Semiconductor package for surface mounting
US5349235A (en) * 1992-09-08 1994-09-20 Samsung Electronics Co., Ltd. High density vertically mounted semiconductor package
US5592019A (en) * 1994-04-19 1997-01-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and module
JP2008232573A (en) * 2007-03-22 2008-10-02 Osaka Gas Co Ltd Absorption refrigerating machine
JP2009068723A (en) * 2007-09-10 2009-04-02 Osaka Gas Co Ltd Absorption refrigerator

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