JPH03129866A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable a large number of semiconductor devices to be mounted on a printed circuit board taking advantage of not only the front but also the rear of the printed board by a method wherein the outer leads of the semiconductor device are so bent as to come into close contact with the side from which they extend and the other side vertical to the former side. CONSTITUTION:Outer leads 2a extending from one side of an outer body 1 of a semiconductor device are bent along the side concerned and the tips of the bent outer leads 2a are bent back along a side face vertical to the side concerned. When the semiconductor device is mounted on a printed circuit board 3, the bent parts of the outer leads 3 are brought into close contact with the pad of the printed circuit board 3 and soldered, so that the semiconductor device can be mounted without protruding the outer leads 3 from the rear side of the printed circuit board 3. By this setup, the rear of the printed circuit board 3 which can not be usually used can be effectively utilized, so that the mounted semiconductor devices can be increased in number.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a semiconductor device (hereinafter referred to as ZIP) in which external leads protrude from one surface of an outer shell in a staggered manner.
type semiconductor device).

[Conventional technology]

FIGS. 2(a) and 2(b) are a side view and a perspective view of a ZIP type semiconductor device showing an example of the conventional technology.

Conventionally, in a ZIP type semiconductor device, the external leads 2 extend perpendicularly from one surface of the outer shell 1 as shown in FIG. It was bent into a letter shape, and then turned upside down so that it was perpendicular to the surface of the page.After being bent, it became straight and long.

FIG. 3 is a side view showing the ZIP type semiconductor device of FIG. 2 attached to a printed circuit board.

When attaching the above-mentioned ZIP type semiconductor device to the printed circuit board 3, the external leads 2 of the ZIP type semiconductor device are inserted into the through holes of the printed circuit board and soldered.

[Problem to be solved by the invention]

The conventional ZIP type semiconductor device described above has a structure in which the external leads are inserted into the printed circuit board, so when mounted, the external leads penetrate through the back side of the printed circuit board, making it impossible to insert other components on the back side of the printed circuit board. It has the disadvantage that it cannot be mounted, and the external leads are also long, so they tend to bend before and after mounting.

An object of the present invention is to provide a semiconductor device that eliminates such drawbacks.

[Means to solve the problem]

The semiconductor device of the present invention is characterized in that an external lead protruding from one surface of the outer shell is bent along the one surface, and a tip of the bent external lead is bent back to a side surface perpendicular to the one surface. It is said that

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) show a ZI diagram showing one embodiment of the present invention.
It is a perspective view of a P-type opposition device. In this semiconductor device, an external lead 2a protruding from one surface of the outer body 1 is bent along the protruding surface, and the bent external lead 2a is
The tip of a is bent back along the side surface perpendicular to the protruding surface. By having the external leads 2a formed in this way, when mounting on the printed circuit board 3, as shown in FIG. This allows mounting without the external leads 3 protruding from the back surface of the printed circuit board 3. Therefore, the back side of the printed circuit board 3, which could not be used conventionally, can be effectively used.
The number of implementations can also be increased.

〔Effect of the invention〕

As explained above, in the semiconductor device of the present invention, a large number of semiconductor devices can be mounted using not only the front surface but also the back surface by bending the external leads from the protruding surface to the side surface perpendicular to the surface so as to be in close contact with each other. There is an effect that can be done.

In addition, since the external leads are often extended and mounted, less space is required during transportation and storage, and the external leads are less likely to bend during mounting tests during sorting.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) show a ZI diagram showing one embodiment of the present invention.
FIG. 2 is a perspective view of a P-type semiconductor device, and a side view showing a state in which the FIG. 2(a)-type semiconductor device is mounted on a printed circuit board. l... Outer body, 2.2a... External lead, 3...
printed circuit board.

Claims (1)

[Claims] A semiconductor device characterized in that an external lead protruding from one surface of an outer shell is bent along the one surface, and a tip of the bent external lead is bent back to a side surface perpendicular to the one surface.