JPH0341967U - - Google Patents
Info
- Publication number
- JPH0341967U JPH0341967U JP10119289U JP10119289U JPH0341967U JP H0341967 U JPH0341967 U JP H0341967U JP 10119289 U JP10119289 U JP 10119289U JP 10119289 U JP10119289 U JP 10119289U JP H0341967 U JPH0341967 U JP H0341967U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- surface mount
- mount component
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例に係るプリント基
板における部品実装構造を示す図、第２図は同実
施例における表面実装用部品の外観斜視図、第３
図は従来のプリント基板における部品実装構造で
適用される表面実装用部品の外観斜視図、第４図
は従来のプリント基板における部品実装構造を示
す図である。
FIG. 1 is a diagram showing a component mounting structure on a printed circuit board according to an embodiment of this invention, FIG. 2 is an external perspective view of a surface mount component in the same embodiment, and FIG.
The figure is an external perspective view of a surface mount component used in a conventional component mounting structure on a printed circuit board, and FIG. 4 is a diagram showing a component mounting structure on a conventional printed circuit board.
Claims (1)
に形成された表面実装用部品と、 上記表面実装用部品のリード先端を半田付けに
より固定するのに供される半田付け用パツドが上
記リード先端の形状に対応したＶ字型溝で形成さ
れたプリント基板と、 を具備し、上記表面実装用部品の上記リード先
端が上記プリント基板の上記半田付け用パツドの
Ｖ字型溝に装着された状態で半田付けがなされて
いることを特徴とするプリント基板における部品
実装構造。[Scope of Claim for Utility Model Registration] A surface mount component having a plurality of leads, each of which has a V-shaped tip, and a device for fixing the lead tips of the surface mount component by soldering. a printed circuit board in which the soldering pad is formed with a V-shaped groove corresponding to the shape of the lead tip, and the lead tip of the surface mount component is connected to the soldering pad of the printed circuit board. A component mounting structure on a printed circuit board, characterized in that components are soldered while being mounted in a V-shaped groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10119289U JPH0341967U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10119289U JPH0341967U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341967U true JPH0341967U (en) | 1991-04-22 |
Family
ID=31650155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10119289U Pending JPH0341967U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341967U (en) |
-
1989
- 1989-08-31 JP JP10119289U patent/JPH0341967U/ja active Pending
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