JPH0459179U - - Google Patents
Info
- Publication number
- JPH0459179U JPH0459179U JP10123290U JP10123290U JPH0459179U JP H0459179 U JPH0459179 U JP H0459179U JP 10123290 U JP10123290 U JP 10123290U JP 10123290 U JP10123290 U JP 10123290U JP H0459179 U JPH0459179 U JP H0459179U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- gull wing
- mount components
- wing leads
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 241000272168 Laridae Species 0.000 claims description 4
- 239000006071 cream Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
、第１図の実施例のＡ部の拡大断面図、第３図は
従来例の断面図である。
１……クリーム半田、２……パツド、３……プ
リント基板、４……平坦部、５，６……表面実装
部品、５Ａ，６Ａ……ガルウイング形状リード。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is an enlarged sectional view of section A of the embodiment of FIG. 1, and FIG. 3 is a sectional view of a conventional example. 1... Cream solder, 2... Pad, 3... Printed circuit board, 4... Flat part, 5, 6... Surface mount components, 5A, 6A... Gull wing shaped lead.
Claims (1)
数個プリント基板上に実装する部品実装構造にお
いて、第１層の表面実装部品のガルウイングリー
ドの平坦部にクリーム半田を塗布し、前記プリン
ト基板面と垂直方向に配置された第２層の表面実
装部品のガルウイングリードの先端部を前記クリ
ーム半田上に取り付けはんだ付けすることを特徴
とする部品実装構造。 In a component mounting structure in which a plurality of surface mount components having gull wing leads are mounted on a printed circuit board, cream solder is applied to the flat parts of the gull wing leads of the first layer surface mount components, and the components are arranged in a direction perpendicular to the surface of the printed circuit board. A component mounting structure characterized in that the tips of the gull wing leads of the second layer surface mount components are attached and soldered onto the cream solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10123290U JPH0459179U (en) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10123290U JPH0459179U (en) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459179U true JPH0459179U (en) | 1992-05-21 |
Family
ID=31844515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10123290U Pending JPH0459179U (en) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459179U (en) |
-
1990
- 1990-09-27 JP JP10123290U patent/JPH0459179U/ja active Pending