JPS6260067U - - Google Patents
Info
- Publication number
- JPS6260067U JPS6260067U JP15102485U JP15102485U JPS6260067U JP S6260067 U JPS6260067 U JP S6260067U JP 15102485 U JP15102485 U JP 15102485U JP 15102485 U JP15102485 U JP 15102485U JP S6260067 U JPS6260067 U JP S6260067U
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- circuit
- component mounting
- area
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は本考案の厚膜混成集積回路の一実施例
の断面図、第２図は従来構造の断面図である。
１，２１……回路基板、２……高周波回路面、
３……他の回路面、５……高周波部品、６……高
周波部品搭載領域、７……抵抗体膜、８……抵抗
体膜領域、１０……回路部品、１１……回路部品
搭載領域、１２……導体膜、１３……導体膜領域
、１４……端子ピン、２２……配線パターン、２
３……端子ピン、２４……高周波部品。
FIG. 1 is a sectional view of an embodiment of the thick film hybrid integrated circuit of the present invention, and FIG. 2 is a sectional view of a conventional structure. 1, 21...Circuit board, 2...High frequency circuit surface,
3...Other circuit surface, 5...High frequency component, 6...High frequency component mounting area, 7...Resistor film, 8...Resistor film area, 10...Circuit component, 11...Circuit component mounting area , 12... Conductor film, 13... Conductor film region, 14... Terminal pin, 22... Wiring pattern, 2
3...Terminal pin, 24...High frequency components.
Claims (1)
するとともに他方の面を他の回路面として構成し
、前記高周波回路面には高周波部品搭載領域とこ
の領域以外の抵抗体膜領域とを構成し、前記他の
回路面には前記高周波部品搭載領域の裏側に配置
した導体膜領域と前記抵抗体膜領域の裏側に配置
した回路部品搭載領域とを構成したことを特徴と
する厚膜混成集積回路。 One surface of the circuit board is configured as a high frequency circuit surface, and the other surface is configured as another circuit surface, and the high frequency circuit surface includes a high frequency component mounting area and a resistor film area other than this area, A thick film hybrid integrated circuit characterized in that the other circuit surface includes a conductor film region arranged on the back side of the high frequency component mounting region and a circuit component mounting region arranged on the back side of the resistor film region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15102485U JPS6260067U (en) | 1985-10-01 | 1985-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15102485U JPS6260067U (en) | 1985-10-01 | 1985-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6260067U true JPS6260067U (en) | 1987-04-14 |
Family
ID=31067706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15102485U Pending JPS6260067U (en) | 1985-10-01 | 1985-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6260067U (en) |
-
1985
- 1985-10-01 JP JP15102485U patent/JPS6260067U/ja active Pending