JPH01121973U - - Google Patents
Info
- Publication number
- JPH01121973U JPH01121973U JP1715488U JP1715488U JPH01121973U JP H01121973 U JPH01121973 U JP H01121973U JP 1715488 U JP1715488 U JP 1715488U JP 1715488 U JP1715488 U JP 1715488U JP H01121973 U JPH01121973 U JP H01121973U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- thick
- integrated circuit
- inductance component
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示し、同図ａは表
面側の斜視図、同図ｂは裏面側の斜視図、第２図
は従来構造の表面側の斜視図である。
１……厚膜基板、２……各種部品、３，３Ａ…
…インダクタンス、４……回路パターン、５……
絶縁基板、６……導体パターン、７，８……スル
ーホール。
FIG. 1 shows an embodiment of the present invention, in which FIG. 1A is a perspective view of the front side, FIG. 1B is a perspective view of the back side, and FIG. 2 is a perspective view of the front side of a conventional structure. 1... Thick film substrate, 2... Various parts, 3, 3A...
...Inductance, 4...Circuit pattern, 5...
Insulating substrate, 6... conductor pattern, 7, 8... through hole.
Claims (1)
イブリツド集積回路において、実装されるインダ
クタンス部品を別体に設けた絶縁基板上に形成し
た導体パターンで構成し、このインダクタンス部
品を前記厚膜基板の裏面側に実装したことを特徴
とする厚膜ハイブリツド集積回路。 In a thick film hybrid integrated circuit in which various components are mounted on the front side of a thick film substrate, the inductance component to be mounted is composed of a conductor pattern formed on a separate insulating substrate, and this inductance component is mounted on the thick film substrate. A thick-film hybrid integrated circuit characterized by being mounted on the back side of the circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1715488U JPH01121973U (en) | 1988-02-12 | 1988-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1715488U JPH01121973U (en) | 1988-02-12 | 1988-02-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121973U true JPH01121973U (en) | 1989-08-18 |
Family
ID=31230684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1715488U Pending JPH01121973U (en) | 1988-02-12 | 1988-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121973U (en) |
-
1988
- 1988-02-12 JP JP1715488U patent/JPH01121973U/ja active Pending