JPH01117074U - - Google Patents
Info
- Publication number
- JPH01117074U JPH01117074U JP1050388U JP1050388U JPH01117074U JP H01117074 U JPH01117074 U JP H01117074U JP 1050388 U JP1050388 U JP 1050388U JP 1050388 U JP1050388 U JP 1050388U JP H01117074 U JPH01117074 U JP H01117074U
- Authority
- JP
- Japan
- Prior art keywords
- case
- hybrid integrated
- integrated circuit
- lead pin
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の混成集積回路用ケースの断面図、第３図は
従来の不具合を説明するための一部の断面図であ
る。
１……ケース、２……貫通孔、３……基板、４
……リードピン、５……ガラス、６……回路、７
……被覆ガラス、８……導体膜、９……金属ワイ
ヤ、１０……ろう材、１１……ケース、１２……
貫通孔。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of a conventional case for a hybrid integrated circuit, and FIG. 3 is a partial sectional view for explaining the problems of the conventional case. 1... Case, 2... Through hole, 3... Board, 4
...Lead pin, 5...Glass, 6...Circuit, 7
...Covered glass, 8...Conductor film, 9...Metal wire, 10...Brazing material, 11...Case, 12...
Through hole.
Claims (1)
するとともに、このケース上面に混成集積回路を
構成する基板を搭載固着する混成集積回路用ケー
スにおいて、前記リードピンの側面の一部を絶縁
体で被覆したことを特徴とする混成集積回路用ケ
ース。 In a case for a hybrid integrated circuit in which a lead pin is supported in a through hole formed in the case, and a board constituting the hybrid integrated circuit is mounted and fixed on the upper surface of the case, a part of the side surface of the lead pin is covered with an insulator. A case for hybrid integrated circuits featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1050388U JPH01117074U (en) | 1988-01-30 | 1988-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1050388U JPH01117074U (en) | 1988-01-30 | 1988-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01117074U true JPH01117074U (en) | 1989-08-08 |
Family
ID=31218225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1050388U Pending JPH01117074U (en) | 1988-01-30 | 1988-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117074U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020173982A (en) * | 2019-04-11 | 2020-10-22 | ショット日本株式会社 | Airtight terminal |
-
1988
- 1988-01-30 JP JP1050388U patent/JPH01117074U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020173982A (en) * | 2019-04-11 | 2020-10-22 | ショット日本株式会社 | Airtight terminal |