JPH0268452U - - Google Patents
Info
- Publication number
- JPH0268452U JPH0268452U JP14911288U JP14911288U JPH0268452U JP H0268452 U JPH0268452 U JP H0268452U JP 14911288 U JP14911288 U JP 14911288U JP 14911288 U JP14911288 U JP 14911288U JP H0268452 U JPH0268452 U JP H0268452U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit boards
- hybrid
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 3
- 238000010396 two-hybrid screening Methods 0.000 claims 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000009825 accumulation Methods 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
及び第３図は従来例を示す断面図である。
１，２…混成集積回路基板、３…ケース材、４
…リード線。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIGS. 2 and 3 are sectional views showing a conventional example. 1, 2...Mixed integrated circuit board, 3...Case material, 4
…Lead.
Claims (1)
素子が固着され、前記半導体素子が対向する様に
前記二枚の混成集積回路基板をケース材に配置さ
せ、前記二枚の混成集積回路基板が複数本の金属
製のリード線によつて接続されてなる混成集積回
路において、 前記リード線は一方の前記混成集積回路基板に
固着され、他方の前記混成集積回路基板に圧接配
置してなることを特徴とする混成集積回路の接続
構造。 (2) 前記リード線の一方の先端部は湾曲状に形
成され、前記湾曲状に形成された前記リード線の
先端部は前記ケース材に設けられた凹部内に配置
され、前記他方の混成集積回路基板に圧接接続さ
れていることを特徴とする請求項１記載の混成集
積回路の接続構造。 (3) 前記二枚の混成集積回路基板は絶縁処理さ
れたアルミニウム基板であることを特徴とする請
求項１記載の混成集積回路の接続構造。[Claims for Utility Model Registration] (1) A plurality of semiconductor elements are fixed on two hybrid integrated circuit boards, and the two hybrid integrated circuit boards are arranged in a case material so that the semiconductor elements face each other. , in a hybrid integrated circuit in which the two hybrid integrated circuit boards are connected by a plurality of metal lead wires, the lead wires are fixed to one of the hybrid integrated circuit boards and connected to the other hybrid integrated circuit board. A connection structure for a hybrid integrated circuit characterized by being placed in pressure contact with a circuit board. (2) One tip of the lead wire is formed in a curved shape, and the tip of the curved lead wire is disposed in a recess provided in the case material, and the other hybrid accumulation 2. The hybrid integrated circuit connection structure according to claim 1, wherein the hybrid integrated circuit is pressure-contacted to a circuit board. (3) The connection structure for a hybrid integrated circuit according to claim 1, wherein the two hybrid integrated circuit boards are insulated aluminum substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14911288U JPH0617317Y2 (en) | 1988-11-15 | 1988-11-15 | Connection structure of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14911288U JPH0617317Y2 (en) | 1988-11-15 | 1988-11-15 | Connection structure of hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0268452U true JPH0268452U (en) | 1990-05-24 |
| JPH0617317Y2 JPH0617317Y2 (en) | 1994-05-02 |
Family
ID=31421045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14911288U Expired - Lifetime JPH0617317Y2 (en) | 1988-11-15 | 1988-11-15 | Connection structure of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617317Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000307056A (en) * | 1999-04-22 | 2000-11-02 | Mitsubishi Electric Corp | Vehicle-mounted semiconductor device |
| JP2008141058A (en) * | 2006-12-04 | 2008-06-19 | Hitachi Ltd | Electronic device |
-
1988
- 1988-11-15 JP JP14911288U patent/JPH0617317Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000307056A (en) * | 1999-04-22 | 2000-11-02 | Mitsubishi Electric Corp | Vehicle-mounted semiconductor device |
| JP2008141058A (en) * | 2006-12-04 | 2008-06-19 | Hitachi Ltd | Electronic device |
| JP4537370B2 (en) * | 2006-12-04 | 2010-09-01 | 日立オートモティブシステムズ株式会社 | Electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617317Y2 (en) | 1994-05-02 |
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