JPH0617317Y2 - Connection structure of hybrid integrated circuit - Google Patents
Connection structure of hybrid integrated circuitInfo
- Publication number
- JPH0617317Y2 JPH0617317Y2 JP14911288U JP14911288U JPH0617317Y2 JP H0617317 Y2 JPH0617317 Y2 JP H0617317Y2 JP 14911288 U JP14911288 U JP 14911288U JP 14911288 U JP14911288 U JP 14911288U JP H0617317 Y2 JPH0617317 Y2 JP H0617317Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit boards
- connection structure
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】 (イ)産業上の利用分野 本考案は混成集積回路の接続構造に関し、特に二枚の混
成集積回路基板を接続する接続構造の改良に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a connection structure for a hybrid integrated circuit, and more particularly to improvement of a connection structure for connecting two hybrid integrated circuit boards.
(ロ)従来の技術 従来二枚の混成集積回路基板からなる混成集積回路は第
２図に示す如く、第１及び第２の混成集積回路基板(21)
(22)と、第１及び第２の混成集積回路基板(21)(22)上に
設けられた回路素子(23)(24)と、第１及び第２の混成集
積回路基板(21)(22)の一側辺から導出された外部リード
(25)と、第１及び第２の混成集積回路基板(21)(22)を離
間支持する枠体(26)とから構成される。(B) Conventional technology A conventional hybrid integrated circuit consisting of two hybrid integrated circuit boards has a first and a second hybrid integrated circuit board (21) as shown in FIG.
(22), the circuit elements (23) and (24) provided on the first and second hybrid integrated circuit boards (21) and (22), and the first and second hybrid integrated circuit boards (21) ( 22) External lead derived from one side
(25) and a frame (26) for supporting the first and second hybrid integrated circuit boards (21, 22) at a distance.
第１及び第２の混成集積回路基板(21)(22)は表面を絶縁
処理したアルミニウム基板が用いられる。第１の混成集
積回路基板(21)には発熱の少ない回路素子(23)が設けら
れ、第２の混成集積回路基板(22)には発熱の伴う回路素
子(24)が設けられる。第１及び第２の混成集積回路基板
(21)(22)の一側辺からは外部回路との接続を行うために
外部リード(25)が水平に導出される。第１及び第２の混
成集積回路基板(21)(22)は金属から成るリード線(27)に
よって接続させる。第１及び第２の混成集積回路基板(2
1)(22)を枠体(26)を介して固着した際、枠体(26)の側壁
と第１及び第２の混成集積回路基板(21)(22)との両端部
とで形成された空間にエポキシ樹脂等の絶縁樹脂(28)を
充填して一体化するものである。As the first and second hybrid integrated circuit boards (21) and (22), aluminum substrates whose surfaces are insulated are used. The first hybrid integrated circuit board (21) is provided with circuit elements (23) that generate less heat, and the second hybrid integrated circuit board (22) is provided with circuit elements (24) that generate heat. First and second hybrid integrated circuit board
External leads (25) are drawn out horizontally from one side of (21) and (22) for connection with an external circuit. The first and second hybrid integrated circuit boards (21) and (22) are connected by lead wires (27) made of metal. The first and second hybrid integrated circuit boards (2
1) When the (22) is fixed via the frame (26), it is formed by the side wall of the frame (26) and both ends of the first and second hybrid integrated circuit boards (21) (22). The space is filled with an insulating resin (28) such as an epoxy resin to be integrated.
上述の様な混成集積回路は実公昭５５−８３１６号公報
に記載されている。A hybrid integrated circuit as described above is described in Japanese Utility Model Publication No. 55-8316.
この様な二枚の混成集積回路基板から成る混成集積回路
は金属製の複数本のリード線によって互いに導通され
る。Such a hybrid integrated circuit composed of two hybrid integrated circuit boards is electrically connected to each other by a plurality of metal lead wires.
従来この導通方法は第３図の如く、夫々の基板(30)(31)
にあらかじめリード(33)(34)を固着した後、リード(33)
(34)が当接する如く枠体(32)に基板(30)(31)を固着し、
リード(33)(34)の当接部分を１本づつ手作業で半田接続
していた。Conventionally, this conduction method is as shown in FIG. 3 for each substrate (30) (31).
After attaching the leads (33) (34) to the
Fix the boards (30) and (31) to the frame (32) so that the (34) abuts,
The contact parts of the leads (33) and (34) were manually soldered one by one.
(ハ)考案が解決しようとする課題 この様に従来の接続構造では上下２本のリード線を１カ
所づつ手作業で半田接続されるために、作業工程時間が
非常にかかりコスト高となる問題があった。更に半田接
合部の半田のバラツキにより信頼性が低下する問題があ
った。(C) Problem to be solved by the invention As described above, in the conventional connection structure, since the upper and lower two lead wires are manually soldered at one place, the work process time is extremely long and the cost is high. was there. Further, there is a problem that reliability is lowered due to variation in solder at the solder joint.
(ニ)課題を解決するための手段 本考案は上述した課題に鑑みて為されたものであり、二
枚の混成集積回路基板上に複数の半導体素子が固着さ
れ、前記半導体素子が対向する様に前記二枚の混成集積
回路基板をケース材に配置させ、前記二枚の混成集積回
路基板が複数本の金属製のリード線によって接続されて
なる混成集積回路において、前記リード線は一方の前記
混成集積回路基板に固着され、他方の前記混成集積回路
基板に圧接接続させて解決する。(D) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and a plurality of semiconductor elements are fixed on two hybrid integrated circuit boards, and the semiconductor elements face each other. In the hybrid integrated circuit in which the two hybrid integrated circuit boards are arranged in a case material, and the two hybrid integrated circuit boards are connected by a plurality of metal lead wires, the lead wire is one of the The solution is fixed to the hybrid integrated circuit board and pressure-connected to the other hybrid integrated circuit board to solve the problem.
(ホ)作用 この様に本考案に依れば、一方の混成集積回路基板にリ
ード線の端部を固着し、リード線の他端部を他方の混成
集積回路基板に圧接することにより、連続した一本のリ
ード線で夫々の基板の接続が行える。(E) Function According to the present invention, the end portions of the lead wires are fixed to one hybrid integrated circuit board, and the other end portions of the lead wires are pressed against the other hybrid integrated circuit board to continuously Each of the substrates can be connected with the single lead wire.
(ヘ)実施例 以下に第１図に示した実施例に基づいて本考案を詳細に
説明する。(F) Embodiment The present invention will be described in detail below based on the embodiment shown in FIG.
本考案の混成集積回路は第１図に示す如く、二枚の混成
集積回路基板(1)(2)と、二枚の混成集積回路基板(1)(2)
を離間固着するケース材(3)と、一方の端部が湾曲状に
形成され、二枚の混成集積回路基板(1)(2)を接続するた
めのリード線(4)とから構成される。The hybrid integrated circuit of the present invention is, as shown in FIG. 1, two hybrid integrated circuit boards (1) (2) and two hybrid integrated circuit boards (1) (2).
A case member (3) for separating and fixing and a lead wire (4) for connecting two hybrid integrated circuit boards (1) and (2), one end of which is formed in a curved shape .
二枚の混成集積回路基板(1)(2)はセラミックスあるいは
金属基板が用いられ、本実施例では金属基板を用いるも
のとする。金属基板としてはアルミニウム基板が用いら
れ、その表面には酸化アルミニウム膜が形成されて絶縁
処理が施されている。Ceramic or metal substrates are used for the two hybrid integrated circuit substrates (1) and (2), and metal substrates are used in this embodiment. An aluminum substrate is used as the metal substrate, and an aluminum oxide film is formed on the surface of the aluminum substrate for insulation treatment.
夫々の基板(1)(2)上には銅箔により所望形状の導電路
(5)(6)が形成され、夫々の導電路(5)(6)上にはＩＣ、ト
ランジスタ、チップコンデーサー、チップ抵抗等の複数
の半導体素子(7)(8)が固着されている。また、導電路
(5)(6)は夫々の基板(1)(2)に延在形成され、基板(1)(2)
の一側辺端部には外部リード端子(9)(10)を固着するた
めのリード端子用パッド(6′)(6′)が複数個形成されて
おり、その反対側辺端部には二枚の基板(1)(2)を金属製
のリード線(4)で接続するための固着パッド(11)(12)が
形成されている。Conductive paths of the desired shape are formed on the respective boards (1) and (2) with copper foil.
(5) (6) is formed, and a plurality of semiconductor elements (7) (8) such as ICs, transistors, chip capacitors, and chip resistors are fixed on the respective conductive paths (5) (6). . Also, the conductive path
(5) (6) is formed to extend on each substrate (1) (2), the substrate (1) (2)
A plurality of lead terminal pads (6 ') (6') for fixing the external lead terminals (9) (10) are formed at one side edge, and the opposite side edge is formed. Adhering pads (11) and (12) for connecting the two substrates (1) and (2) with metal lead wires (4) are formed.
本考案の特徴とするところはリード線(4)で二枚の基板
(1)(2)を接続する接続構造である。即ち、金属製のリー
ド線(4)の一端を一方の基板(1)に半田を用い固着させ、
リード線(4)の他端を他方の基板(2)に半田付けレスで接
続するところにある。更に詳述するとリード線(4)の一
端は従来の如き、一方の基板(1)に設けられた固着パッ
ド(11)にあらかじめ半田によって固着されるのに対し
て、他端は湾曲状に形成され、その湾曲の弾性力を利用
して他方の基板(2)の固着パッド(12)に圧接接続させ
る。リード線(4)の湾曲部はケース材(3)に設けられた凹
部(13)内に配置されており、位置ズレを起こすことはな
い。The feature of the present invention is that the lead wire (4) is used for two boards.
This is a connection structure that connects (1) and (2). That is, one end of the metal lead wire (4) is fixed to one substrate (1) using solder,
The other end of the lead wire (4) is connected to the other substrate (2) without soldering. More specifically, one end of the lead wire (4) is fixed to the fixing pad (11) provided on one substrate (1) in advance by soldering, while the other end is curved. Then, the elastic force of the bending is used to press-connect to the fixing pad (12) of the other substrate (2). The curved portion of the lead wire (4) is arranged in the concave portion (13) provided in the case material (3) and does not cause a positional deviation.
斯る本考案に依れば、二枚の基板(1)(2)を接続するリー
ド線(4)の一端を湾曲状に形成することにより、湾曲部
と他方の基板(2)とが圧接されるので半田付けカ所が１
カ所となり、半田付け部の信頼性が安定する。また、リ
ード線の湾曲部はケース材(3)の凹部(13)によって規制
されているので位置ズレを起こすことがなく二枚の基板
(1)(2)の接続が行える。According to the present invention, by forming one end of the lead wire (4) connecting the two substrates (1) and (2) into a curved shape, the curved portion and the other substrate (2) are pressure-contacted. There are 1 soldering points
It becomes a place, and the reliability of the soldered part is stable. Further, since the curved portion of the lead wire is regulated by the recessed portion (13) of the case material (3), the two substrates are not displaced.
Connections (1) and (2) can be made.
(ト)考案の効果 以上に詳述した如く、本考案に依れば、二枚の混成集積
回路基板の一方の基板にリード線の端部を固着させ、リ
ード線の他端部を湾曲状に形成して他方の基板上に圧接
させることにより、半田付けカ所が１カ所となり半田付
け部が削減でき頼性が向上する。(G) Effect of the Invention As described in detail above, according to the present invention, the end of the lead wire is fixed to one of the two hybrid integrated circuit boards, and the other end of the lead wire is curved. By forming it on the other substrate and press-contacting it on the other substrate, the number of soldering points is reduced to one, and the number of soldering points can be reduced to improve the reliability.
また、従来の接続構造と比べ作業性が著しく向上するも
のである。Further, the workability is remarkably improved as compared with the conventional connection structure.
第１図は本考案の実施例を示す断面図、第２図及び第３
図は従来例を示す断面図である。 (1)(2)……混成集積回路基板、(3)……ケース材、(4)…
…リード線。FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 and FIG.
The figure is a cross-sectional view showing a conventional example. (1) (2) …… Hybrid integrated circuit board, (3) …… Case material, (4)…
…Lead.
Claims (3)
素子が固着され、前記半導体素子が対向する様に前記二
枚の混成集積回路基板をケース材に配置させ、前記二枚
の混成集積回路基板が複数本の金属製のリード線によっ
て接続されてなる混成集積回路において、 前記リード線は一方の前記混成集積回路基板に固着さ
れ、他方の前記混成集積回路基板に圧接配置してなるこ
とを特徴とする混成集積回路の接続構造。1. A plurality of semiconductor elements are fixed on two hybrid integrated circuit boards, the two hybrid integrated circuit boards are arranged on a case material so that the semiconductor elements face each other, and the two hybrid integrated circuit boards are arranged. In a hybrid integrated circuit in which an integrated circuit board is connected by a plurality of metal lead wires, the lead wire is fixed to one of the hybrid integrated circuit boards and arranged in pressure contact with the other of the hybrid integrated circuit boards. A connection structure for a hybrid integrated circuit characterized by the above.
成され、前記湾曲状に形成された前記リード線の先端部
は前記ケース材に設けられた凹部内に配置され、前記他
方の混成集積回路基板に圧接接続されていることを特徴
とする請求項１記載の混成集積回路の接続構造。2. One end portion of the lead wire is formed in a curved shape, and the tip end portion of the curved lead wire is arranged in a recess provided in the case member, and the other end portion is formed. The connection structure for a hybrid integrated circuit according to claim 1, wherein the connection structure is pressure-contacted to the hybrid integrated circuit substrate.
れたアルミニウム基板であることを特徴とする請求項１
記載の混成集積回路の接続構造。3. The two hybrid integrated circuit boards are insulation-treated aluminum boards.
A connection structure for the hybrid integrated circuit described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14911288U JPH0617317Y2 (en) | 1988-11-15 | 1988-11-15 | Connection structure of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14911288U JPH0617317Y2 (en) | 1988-11-15 | 1988-11-15 | Connection structure of hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0268452U JPH0268452U (en) | 1990-05-24 |
| JPH0617317Y2 true JPH0617317Y2 (en) | 1994-05-02 |
Family
ID=31421045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14911288U Expired - Lifetime JPH0617317Y2 (en) | 1988-11-15 | 1988-11-15 | Connection structure of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617317Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000307056A (en) * | 1999-04-22 | 2000-11-02 | Mitsubishi Electric Corp | Vehicle-mounted semiconductor device |
| JP4537370B2 (en) * | 2006-12-04 | 2010-09-01 | 日立オートモティブシステムズ株式会社 | Electronic equipment |
-
1988
- 1988-11-15 JP JP14911288U patent/JPH0617317Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0268452U (en) | 1990-05-24 |
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