JPH01174963U - - Google Patents

Info

Publication number
JPH01174963U
JPH01174963U JP7163988U JP7163988U JPH01174963U JP H01174963 U JPH01174963 U JP H01174963U JP 7163988 U JP7163988 U JP 7163988U JP 7163988 U JP7163988 U JP 7163988U JP H01174963 U JPH01174963 U JP H01174963U
Authority
JP
Japan
Prior art keywords
printed wiring
electrical connection
wiring boards
wire
establish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7163988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7163988U priority Critical patent/JPH01174963U/ja
Publication of JPH01174963U publication Critical patent/JPH01174963U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係るプリント配線板相互の電
気的接続構造の一実施例を示す断面図、第2図は
従来例を示す断面図である。 1A,1B……プリント配線板、2……ベース
、3A,3B……ワイヤーボンデイング部、4…
…ボンデイング用ワイヤー。
FIG. 1 is a sectional view showing an embodiment of an electrical connection structure between printed wiring boards according to the present invention, and FIG. 2 is a sectional view showing a conventional example. 1A, 1B...Printed wiring board, 2...Base, 3A, 3B...Wire bonding part, 4...
...Wire for bonding.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 配列された複数のプリント配線板の導体層に所
定の電気的接続関係となるようボンデイング用ワ
イヤーをそれぞれワイヤーボンデイングしたこと
を特徴とするプリント配線板相互の電気的接続構
造。
1. An electrical connection structure between printed wiring boards, characterized in that bonding wires are wire-bonded to the conductor layers of a plurality of arranged printed wiring boards so as to establish a predetermined electrical connection relationship.
JP7163988U 1988-05-30 1988-05-30 Pending JPH01174963U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7163988U JPH01174963U (en) 1988-05-30 1988-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7163988U JPH01174963U (en) 1988-05-30 1988-05-30

Publications (1)

Publication Number Publication Date
JPH01174963U true JPH01174963U (en) 1989-12-13

Family

ID=31296841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7163988U Pending JPH01174963U (en) 1988-05-30 1988-05-30

Country Status (1)

Country Link
JP (1) JPH01174963U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5637674A (en) * 1979-09-05 1981-04-11 Nec Corp Manufacture of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5637674A (en) * 1979-09-05 1981-04-11 Nec Corp Manufacture of semiconductor device

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