JPS63100869U - - Google Patents
Info
- Publication number
- JPS63100869U JPS63100869U JP19646086U JP19646086U JPS63100869U JP S63100869 U JPS63100869 U JP S63100869U JP 19646086 U JP19646086 U JP 19646086U JP 19646086 U JP19646086 U JP 19646086U JP S63100869 U JPS63100869 U JP S63100869U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- wiring structure
- power source
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ａは本考案のプリント板ワイヤ布線構造
の実施例を示す断面図、ｂは一部の平面図、第２
図は他の実施例の断面図、第３図ａ，ｂは従来例
を示す断面図である。
第１図ａ，ｂにおいて、１はプリント板、８は
信号ワイヤ、１０はバイア、１１はスルーホール
導体である。
FIG. 1a is a sectional view showing an embodiment of the printed board wire wiring structure of the present invention, FIG. 1b is a partial plan view, and FIG.
The figure is a sectional view of another embodiment, and FIGS. 3a and 3b are sectional views of a conventional example. In FIGS. 1a and 1b, 1 is a printed board, 8 is a signal wire, 10 is a via, and 11 is a through-hole conductor.
Claims (1)
、該バイア１０の周囲に形成した、電源又はグラ
ンドの表裏接続導体１１又は１３と該バイア１０
に接続される信号ワイヤ８，１４より成るプリン
ト板ワイヤ布線構造。 A via 10 provided at a predetermined location on a printed board 1, a power source or ground connecting conductor 11 or 13 formed around the via 10, and the via 10.
Printed board wiring structure consisting of signal wires 8, 14 connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19646086U JPS63100869U (en) | 1986-12-20 | 1986-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19646086U JPS63100869U (en) | 1986-12-20 | 1986-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100869U true JPS63100869U (en) | 1988-06-30 |
Family
ID=31155301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19646086U Pending JPS63100869U (en) | 1986-12-20 | 1986-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100869U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008524845A (en) * | 2004-12-17 | 2008-07-10 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | High frequency multilayer printed circuit board including through connection |
-
1986
- 1986-12-20 JP JP19646086U patent/JPS63100869U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008524845A (en) * | 2004-12-17 | 2008-07-10 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | High frequency multilayer printed circuit board including through connection |