JPH0356172U - - Google Patents

Info

Publication number
JPH0356172U
JPH0356172U JP11626289U JP11626289U JPH0356172U JP H0356172 U JPH0356172 U JP H0356172U JP 11626289 U JP11626289 U JP 11626289U JP 11626289 U JP11626289 U JP 11626289U JP H0356172 U JPH0356172 U JP H0356172U
Authority
JP
Japan
Prior art keywords
multilayer wiring
wiring boards
ceramic multilayer
circuit elements
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11626289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11626289U priority Critical patent/JPH0356172U/ja
Publication of JPH0356172U publication Critical patent/JPH0356172U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の構造を示すマウン
ト平面図、第2図は従来の混成集積回路装置の構
造を示すマウント平面図である。 10……ベース・リボン、11,11a,11
b……セラミツク多層配線基板、12a,12b
……ボンデイング・ワイヤ。
FIG. 1 is a mount plan view showing the structure of an embodiment of the present invention, and FIG. 2 is a mount plan view showing the structure of a conventional hybrid integrated circuit device. 10...Base ribbon, 11, 11a, 11
b... Ceramic multilayer wiring board, 12a, 12b
...Bonding wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路装置が必要とする所要個数の回路素子を分
散して搭載する複数個のセラミツク多層配線基板
と、前記複数個のセラミツク多層配線基板を互い
に隣接して張り付ける一枚のベース・リボンと、
前記ベース・リボン上でセラミツク多層配線基板
相互の回路素子間および回路素子と外部端子間を
それぞれ電気接続するボンデイング・ワイヤとを
含むことを特徴とする混成集積回路装置。
a plurality of ceramic multilayer wiring boards on which a required number of circuit elements required by a circuit device are distributed and mounted; a single base ribbon to which the plurality of ceramic multilayer wiring boards are attached adjacently to each other;
A hybrid integrated circuit device comprising bonding wires for electrically connecting circuit elements of the ceramic multilayer wiring boards and between circuit elements and external terminals on the base ribbon.
JP11626289U 1989-10-02 1989-10-02 Pending JPH0356172U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11626289U JPH0356172U (en) 1989-10-02 1989-10-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11626289U JPH0356172U (en) 1989-10-02 1989-10-02

Publications (1)

Publication Number Publication Date
JPH0356172U true JPH0356172U (en) 1991-05-30

Family

ID=31664544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11626289U Pending JPH0356172U (en) 1989-10-02 1989-10-02

Country Status (1)

Country Link
JP (1) JPH0356172U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022700A (en) * 2003-07-02 2005-01-27 Seal Eitou Kk Heat sealing device
JP2007091344A (en) * 2005-09-28 2007-04-12 G D Spa Automatic processing machine for products in tobacco industry and its relative controlling method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022700A (en) * 2003-07-02 2005-01-27 Seal Eitou Kk Heat sealing device
JP4546048B2 (en) * 2003-07-02 2010-09-15 シール栄登株式会社 Heat sealing equipment
JP2007091344A (en) * 2005-09-28 2007-04-12 G D Spa Automatic processing machine for products in tobacco industry and its relative controlling method

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