JPH01146570U - - Google Patents
Info
- Publication number
- JPH01146570U JPH01146570U JP4206588U JP4206588U JPH01146570U JP H01146570 U JPH01146570 U JP H01146570U JP 4206588 U JP4206588 U JP 4206588U JP 4206588 U JP4206588 U JP 4206588U JP H01146570 U JPH01146570 U JP H01146570U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- conductive base
- base material
- insulating material
- board structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例に係る基板構造を被配
線部材を取付けた状態とともに示す断面図、第２
図はその平面図、第３図は従来の基板構造の一例
を被配線部材を取付けた状態とともに示す断面図
、第４図はその平面図である。
１０…チツプ部品（被配線部材）、１１…基板
、１２…導電性基材（共通配線部）、１３…絶縁
材、１４…貫通孔。
FIG. 1 is a sectional view showing the board structure according to the embodiment of the present invention together with the wiring member attached;
The figure is a plan view thereof, FIG. 3 is a sectional view showing an example of a conventional board structure together with a member to be wired attached, and FIG. 4 is a plan view thereof. DESCRIPTION OF SYMBOLS 10... Chip component (wiring member), 11... Board, 12... Conductive base material (common wiring part), 13... Insulating material, 14... Through hole.
Claims (1)
複数の被配線部材が着接される配線部を敷設した
配線用基板構造において、 上記配線部のうち各被配線部材が共通して用い
る共通配線部を上記導電性基材で構成するととも
に、絶縁材には被配線部材を導電性基材に着接す
るための貫通孔を形成したことを特徴とする配線
用基板構造。[Scope of Claim for Utility Model Registration] In a wiring board structure in which a conductive base material is coated with an insulating material, and a wiring portion to which a plurality of wired members are bonded is laid on the insulating material, among the wiring portions, A common wiring part commonly used by each wiring member is constructed of the conductive base material, and a through hole is formed in the insulating material for bonding the wiring member to the conductive base material. Board structure for wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4206588U JPH01146570U (en) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4206588U JPH01146570U (en) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146570U true JPH01146570U (en) | 1989-10-09 |
Family
ID=31268490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4206588U Pending JPH01146570U (en) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146570U (en) |
-
1988
- 1988-03-31 JP JP4206588U patent/JPH01146570U/ja active Pending