JPH0380974U - - Google Patents
Info
- Publication number
- JPH0380974U JPH0380974U JP14318489U JP14318489U JPH0380974U JP H0380974 U JPH0380974 U JP H0380974U JP 14318489 U JP14318489 U JP 14318489U JP 14318489 U JP14318489 U JP 14318489U JP H0380974 U JPH0380974 U JP H0380974U
- Authority
- JP
- Japan
- Prior art keywords
- board
- leads
- mounting structure
- hole
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図ａ，ｂはこの考案の一実施例による基板
の実装構造を示す平面図及び断面図、第２図はそ
の断面拡大図、第３図はこの考案の他の実施例を
示す断面図、第４図ａ，ｂは従来の基板の実装構
造を示す平面図及び断面図である。
図において、１……基板、５……スルーホール
、６……リードである。なお、図中、同一符号は
同一、又は相当部分を示す。
1A and 1B are a plan view and a sectional view showing a mounting structure of a board according to an embodiment of this invention, FIG. 2 is an enlarged sectional view thereof, and FIG. 3 is a sectional view showing another embodiment of this invention. , FIGS. 4a and 4b are a plan view and a sectional view showing a conventional board mounting structure. In the figure, 1...substrate, 5... through hole, 6... lead. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ーホールを連ねて通したリードにより各基板間の
電気接続を行なう基板の実装構造において、リー
ドをリードの中心軸に対して交互に突出するよう
に屈曲させて、その突出部をスルーホールに接触
させて電気接続を行なうようにしたことを特徴と
する基板の実装構造。 In a board mounting structure in which boards are arranged parallel to each other and electrical connections are made between each board using leads passed through through holes formed in each board, the leads are arranged so that they protrude alternately with respect to the central axis of the leads. 1. A mounting structure for a board, characterized in that the protruding part is bent to make an electrical connection with a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14318489U JPH0380974U (en) | 1989-12-11 | 1989-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14318489U JPH0380974U (en) | 1989-12-11 | 1989-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0380974U true JPH0380974U (en) | 1991-08-19 |
Family
ID=31689979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14318489U Pending JPH0380974U (en) | 1989-12-11 | 1989-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0380974U (en) |
-
1989
- 1989-12-11 JP JP14318489U patent/JPH0380974U/ja active Pending