JPH0316372U - - Google Patents
Info
- Publication number
- JPH0316372U JPH0316372U JP7650289U JP7650289U JPH0316372U JP H0316372 U JPH0316372 U JP H0316372U JP 7650289 U JP7650289 U JP 7650289U JP 7650289 U JP7650289 U JP 7650289U JP H0316372 U JPH0316372 U JP H0316372U
- Authority
- JP
- Japan
- Prior art keywords
- board
- view
- exposing
- edges
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は、本考案の一実施例を説明するための
基板の一部分の斜視図、第２図は、第１図の要部
の横断面図、第３図は、基板に形成された端子に
コネクターを取り付けた状態を示す斜視図、第４
図は、第３図の要部の断面図、第５図は、他の実
施例の斜視図、第６図は、従来例の斜視図である
。
１……基板、２……スルーホール、３……金属
層、５，６……コネクターのハウジング、９……
リード線。
Fig. 1 is a perspective view of a part of a board for explaining an embodiment of the present invention, Fig. 2 is a cross-sectional view of the main part of Fig. 1, and Fig. 3 is a terminal formed on the board. A perspective view showing the state in which the connector is attached to the 4th
The figures are a sectional view of the main part of FIG. 3, FIG. 5 is a perspective view of another embodiment, and FIG. 6 is a perspective view of the conventional example. 1... Board, 2... Through hole, 3... Metal layer, 5, 6... Connector housing, 9...
Lead.
Claims (1)
ールを露出させたことを特徴とする基板の端子構
造。 A terminal structure of a board characterized by exposing through holes coated with a conductive material at the edges of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7650289U JPH0316372U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7650289U JPH0316372U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316372U true JPH0316372U (en) | 1991-02-19 |
Family
ID=31618031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7650289U Pending JPH0316372U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316372U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009158892A (en) * | 2007-12-28 | 2009-07-16 | Nec Corp | Multilayer wiring board and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752187A (en) * | 1980-09-12 | 1982-03-27 | Mitsubishi Electric Corp | Method of producing circuit board |
| JPS57141988A (en) * | 1981-02-27 | 1982-09-02 | Nippon Electric Co | Printed circuit board |
| JPS62189791A (en) * | 1986-02-15 | 1987-08-19 | 株式会社日立製作所 | Wiring board |
-
1989
- 1989-06-29 JP JP7650289U patent/JPH0316372U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752187A (en) * | 1980-09-12 | 1982-03-27 | Mitsubishi Electric Corp | Method of producing circuit board |
| JPS57141988A (en) * | 1981-02-27 | 1982-09-02 | Nippon Electric Co | Printed circuit board |
| JPS62189791A (en) * | 1986-02-15 | 1987-08-19 | 株式会社日立製作所 | Wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009158892A (en) * | 2007-12-28 | 2009-07-16 | Nec Corp | Multilayer wiring board and method of manufacturing the same |