JPS63134569U - - Google Patents
Info
- Publication number
- JPS63134569U JPS63134569U JP2650887U JP2650887U JPS63134569U JP S63134569 U JPS63134569 U JP S63134569U JP 2650887 U JP2650887 U JP 2650887U JP 2650887 U JP2650887 U JP 2650887U JP S63134569 U JPS63134569 U JP S63134569U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- filled
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
第１図の実施例を用いてリード端子を固定したと
きのスルーホールの断面図、第３図は従来の印刷
配線板の一例の断面図である。
１，１ａ……穴、２，２ａ……めつき層、３，
３ａ……スルーホール、４……導電材、５……リ
ード端子、１０……絶縁基板。
Figure 1 is a sectional view of one embodiment of the present invention, Figure 2 is a sectional view of a through hole when a lead terminal is fixed using the embodiment of Figure 1, and Figure 3 is a sectional view of a conventional printed wiring board. FIG. 3 is a cross-sectional view of an example. 1, 1a... hole, 2, 2a... plating layer, 3,
3a... Through hole, 4... Conductive material, 5... Lead terminal, 10... Insulating substrate.
Claims (1)
するスルーホールを有すを印刷配線板において、
前記スルーホールに少くとも前記リード端子の外
周が圧接するよう充填された粘着性の導電材を有
することを特徴とする印刷配線板。 A printed wiring board that has conductive through holes on the front and back sides into which the lead terminals of the mounting parts are inserted,
A printed wiring board, characterized in that the through hole is filled with an adhesive conductive material so that at least the outer periphery of the lead terminal comes into pressure contact with the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2650887U JPS63134569U (en) | 1987-02-24 | 1987-02-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2650887U JPS63134569U (en) | 1987-02-24 | 1987-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63134569U true JPS63134569U (en) | 1988-09-02 |
Family
ID=30827655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2650887U Pending JPS63134569U (en) | 1987-02-24 | 1987-02-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63134569U (en) |
-
1987
- 1987-02-24 JP JP2650887U patent/JPS63134569U/ja active Pending
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