JPH0367471U - - Google Patents
Info
- Publication number
- JPH0367471U JPH0367471U JP12865589U JP12865589U JPH0367471U JP H0367471 U JPH0367471 U JP H0367471U JP 12865589 U JP12865589 U JP 12865589U JP 12865589 U JP12865589 U JP 12865589U JP H0367471 U JPH0367471 U JP H0367471U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductive via
- layer thin
- back sides
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000010410 layer Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例によるプリント基板
の表裏導通ビア構造を示す側断面図、第２図は従
来のプリント基板の表裏導通ビア構造を示す側断
面図、第３図は課題を示す側断面図である。
図において、４……表面層薄膜、１１……絶縁
基体、１２……ビア充填孔、１３……導体ビア、
を示す。
Fig. 1 is a side sectional view showing the front and back conductive via structure of a printed circuit board according to an embodiment of the present invention, Fig. 2 is a side sectional view showing the front and back conducting via structure of a conventional printed circuit board, and Fig. 3 shows the problem. FIG. In the figure, 4... surface layer thin film, 11... insulating base, 12... via filling hole, 13... conductor via,
shows.
Claims (1)
１の所定個所に、当該絶縁基体１１の板厚中央部
で表裏両側が相対的に偏心して上記表裏層薄膜４
と導通した導体ビア１３を内設したことを特徴と
するプリント基板の表裏導通ビア構造。 Insulating substrate 1 with surface layer thin film 4 formed on both front and back surfaces
1, the front and back layer thin films 4 are placed at a predetermined location of the insulating substrate 11, with both the front and back sides being relatively eccentric at the central part of the thickness of the insulating substrate 11.
A conductive via structure on the front and back sides of a printed circuit board, characterized in that a conductive via 13 is provided therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12865589U JPH0367471U (en) | 1989-11-02 | 1989-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12865589U JPH0367471U (en) | 1989-11-02 | 1989-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367471U true JPH0367471U (en) | 1991-07-01 |
Family
ID=31676347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12865589U Pending JPH0367471U (en) | 1989-11-02 | 1989-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367471U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003218525A (en) * | 2002-01-18 | 2003-07-31 | Fujitsu Ltd | Circuit board and its manufacturing method |
| JP2004219318A (en) * | 2003-01-16 | 2004-08-05 | Hamamatsu Photonics Kk | Radiation detector |
| WO2004110116A1 (en) * | 2003-06-03 | 2004-12-16 | Hitachi Metals, Ltd. | Production method for feedthrough electrode-carrying substrate |
| JP2013098209A (en) * | 2011-10-28 | 2013-05-20 | Seiko Epson Corp | Circuit board, electronic device, electronic equipment, and circuit board manufacturing method |
| JP2020199748A (en) * | 2019-06-13 | 2020-12-17 | セイコーエプソン株式会社 | Wiring board, manufacturing method of wiring board, inkjet head, mems device, and oscillator |
-
1989
- 1989-11-02 JP JP12865589U patent/JPH0367471U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003218525A (en) * | 2002-01-18 | 2003-07-31 | Fujitsu Ltd | Circuit board and its manufacturing method |
| JP2004219318A (en) * | 2003-01-16 | 2004-08-05 | Hamamatsu Photonics Kk | Radiation detector |
| WO2004110116A1 (en) * | 2003-06-03 | 2004-12-16 | Hitachi Metals, Ltd. | Production method for feedthrough electrode-carrying substrate |
| JP2013098209A (en) * | 2011-10-28 | 2013-05-20 | Seiko Epson Corp | Circuit board, electronic device, electronic equipment, and circuit board manufacturing method |
| JP2020199748A (en) * | 2019-06-13 | 2020-12-17 | セイコーエプソン株式会社 | Wiring board, manufacturing method of wiring board, inkjet head, mems device, and oscillator |