JPS61192475U - - Google Patents

Info

Publication number
JPS61192475U
JPS61192475U JP7647385U JP7647385U JPS61192475U JP S61192475 U JPS61192475 U JP S61192475U JP 7647385 U JP7647385 U JP 7647385U JP 7647385 U JP7647385 U JP 7647385U JP S61192475 U JPS61192475 U JP S61192475U
Authority
JP
Japan
Prior art keywords
wiring board
metal plate
insulating layer
hole
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7647385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7647385U priority Critical patent/JPS61192475U/ja
Publication of JPS61192475U publication Critical patent/JPS61192475U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は配線基板の正面図、第2図は同断面図
、第3図は電子部品を取付けた断面図。 図面において、1:金属板、2:絶縁層、3:
導電体層、4:ラウンド、5:透孔、6:絶縁皮
膜、10:配線板。
FIG. 1 is a front view of the wiring board, FIG. 2 is a sectional view thereof, and FIG. 3 is a sectional view with electronic components attached. In the drawings, 1: metal plate, 2: insulating layer, 3:
Conductor layer, 4: round, 5: through hole, 6: insulating film, 10: wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属板を基材とし、この金属板の表面に絶縁層
が形成され、この絶縁層上に導電体が形成された
配線板において、この配線板を貫通した透孔の内
壁部に絶縁皮膜を形成したことを特徴とする配線
板。
In a wiring board that uses a metal plate as a base material, an insulating layer is formed on the surface of this metal plate, and a conductor is formed on this insulating layer, an insulating film is formed on the inner wall of a through hole that penetrates this wiring board. A wiring board characterized by:
JP7647385U 1985-05-24 1985-05-24 Pending JPS61192475U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7647385U JPS61192475U (en) 1985-05-24 1985-05-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7647385U JPS61192475U (en) 1985-05-24 1985-05-24

Publications (1)

Publication Number Publication Date
JPS61192475U true JPS61192475U (en) 1986-11-29

Family

ID=30618646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7647385U Pending JPS61192475U (en) 1985-05-24 1985-05-24

Country Status (1)

Country Link
JP (1) JPS61192475U (en)

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