JPH0350365U - - Google Patents
Info
- Publication number
- JPH0350365U JPH0350365U JP11061589U JP11061589U JPH0350365U JP H0350365 U JPH0350365 U JP H0350365U JP 11061589 U JP11061589 U JP 11061589U JP 11061589 U JP11061589 U JP 11061589U JP H0350365 U JPH0350365 U JP H0350365U
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- circuit board
- electrode
- buried
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Adjustable Resistors (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Description
第１図は、この考案に係る平面回路基板の実施
例の断面図である。第２図は、第１図に示すもの
を製造する実施例の第１手順を示した断面図であ
る。第３図は、上記実施例の第２手順を示した断
面図である。第４図は、上記実施例の第３手順を
示した断面図である。第５図は、上記実施例の第
４手順を示した断面図である。
１……基板、２……導体層、３……電極、２１
……粗化面、Ａ……平面回路基板。
FIG. 1 is a sectional view of an embodiment of a flat circuit board according to this invention. FIG. 2 is a cross-sectional view showing the first procedure of the embodiment for manufacturing what is shown in FIG. FIG. 3 is a sectional view showing the second procedure of the above embodiment. FIG. 4 is a sectional view showing the third procedure of the above embodiment. FIG. 5 is a sectional view showing the fourth procedure of the above embodiment. 1...Substrate, 2...Conductor layer, 3...Electrode, 21
...Roughened surface, A...Flat circuit board.
Claims (1)
路基板に於いて、前記導体層は樹脂に銀粒子とカ
ーボン粒子を混合した構成から成ることを特徴と
する平面回路基板。 1. A planar circuit board in which an electrode and a conductor layer are buried on the same plane, wherein the conductor layer is made of a resin mixed with silver particles and carbon particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11061589U JPH0350365U (en) | 1989-09-21 | 1989-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11061589U JPH0350365U (en) | 1989-09-21 | 1989-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350365U true JPH0350365U (en) | 1991-05-16 |
Family
ID=31659139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11061589U Pending JPH0350365U (en) | 1989-09-21 | 1989-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350365U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54139064A (en) * | 1978-04-19 | 1979-10-29 | Alps Electric Co Ltd | Method of forming circuit board |
| JPS6114704A (en) * | 1984-06-29 | 1986-01-22 | ナイルス部品株式会社 | Method of producing slide resistor |
| JPS6149473B2 (en) * | 1979-05-07 | 1986-10-29 | Kee Efu Shii Kk |
-
1989
- 1989-09-21 JP JP11061589U patent/JPH0350365U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54139064A (en) * | 1978-04-19 | 1979-10-29 | Alps Electric Co Ltd | Method of forming circuit board |
| JPS6149473B2 (en) * | 1979-05-07 | 1986-10-29 | Kee Efu Shii Kk | |
| JPS6114704A (en) * | 1984-06-29 | 1986-01-22 | ナイルス部品株式会社 | Method of producing slide resistor |